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Integrated microelectromechanical system devices and methods for making the same

  • US 10,298,193 B2
  • Filed: 10/13/2015
  • Issued: 05/21/2019
  • Est. Priority Date: 08/19/2013
  • Status: Active Grant
First Claim
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1. A method for making an integrated Microelectromechanical Systems (“

  • MEMS”

    ) device, comprising;

    forming first electronic circuitry on a major surface of a substrate;

    forming a MEMS filter structure on the major surface of the substrate;

    removing at least one first resist layer from the MEMS filter structure to form (a) a MEMS filter device suspended over the major surface of the substrate exclusively by a transition portion electrically connecting the MEMS filter device to the first electronic circuitry, and (b) a gas gap between the MEMS filter device and the major surface of the substrate; and

    removing at least one second resist layer from the MEMS filter structure such that the transition portion is defined by a three dimensional hollow ground structure in which an elongate center conductor is suspended and enclosed except for at one or more points of connection between the center conductor and the MEMS filter device;

    wherein at least a portion of the MEMS filter structure resides external to the three dimensional hollow ground structure of the transition portion, and the three dimensional hollow ground structure comprises at least one elongate linear portion extending between the first electronic circuitry and the MEMS filter.

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