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Semiconductor device

  • US 10,298,285 B2
  • Filed: 07/20/2017
  • Issued: 05/21/2019
  • Est. Priority Date: 01/31/2017
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a plurality of chips, each chip including a chip input/output (I/O) pad, a transceiver configured to perform a transmission operation in response to a transmission enable signal or perform a reception operation in response to a reception enable signal, and a switch configured to couple the chip input/output (I/O) pad to the transceiver in response to a switch enable signal;

    at least one line configured to couple the chip input/output (I/O) pads contained in the plurality of chips; and

    a controller configured to generate the transmission enable signal, the reception enable signal, and the switch enable signal in response to a command signal and a chip identifier (ID) signal,wherein the chip input/output (I/O) pad is coupled to the transceiver when the switch enable signal is enabled in at least one chip corresponding to the chip ID signal among the plurality of chips.

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