Vehicle camera with enhanced imager and PCB assembly
First Claim
1. A camera for a vision system for a vehicle, said camera comprising:
- an imager chip comprising an at least partially light transmitting substrate having a first surface and a second surface opposite said first surface, said imager chip comprising a photosensor array disposed at said second surface of said at least partially light transmitting substrate, said photosensor array having a plurality of photosensing elements that sense light passing through said at least partially light transmitting substrate;
wherein said imager chip comprises electrically conductive pads disposed in a pattern at said second surface of said at least partially light transmitting substrate;
a circuit element comprising a third surface and a fourth surface opposite said third surface, said circuit element comprising circuitry disposed at least at said third surface, wherein said circuitry includes a plurality of electrically conductive pads disposed in a pattern at said third surface of said circuit element;
wherein said imager chip is mounted at said circuit element with said second surface of said at least partially light transmitting substrate opposing said third surface of said circuit element, with said plurality of photosensing elements disposed between said at least partially light transmitting substrate and said circuit element; and
wherein electrical connection between said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip and said electrically conductive pads at said third surface of said circuit element is made via soldering said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip to corresponding ones of said electrically conductive pads at said third surface of said circuit element when mounting said imager chip at said circuit element.
1 Assignment
0 Petitions
Accused Products
Abstract
A camera for a vision system for a vehicle includes an imager chip having an at least partially light transmitting substrate having a photosensor array disposed at a second surface of the at least partially light transmitting substrate so as to sense light that passes through the at least partially light transmitting substrate. The imager chip includes electrically conductive pads disposed at the second surface of the at least partially light transmitting substrate. A circuit element includes circuitry disposed at least at a third surface thereof. The imager chip is mounted at the circuit element with the second surface of the at least partially light transmitting substrate opposing the third surface of the circuit element. Electrical connection between the electrically conductive pads and the circuitry of the circuit element is made when mounting the imager chip at the circuit element.
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Citations
20 Claims
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1. A camera for a vision system for a vehicle, said camera comprising:
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an imager chip comprising an at least partially light transmitting substrate having a first surface and a second surface opposite said first surface, said imager chip comprising a photosensor array disposed at said second surface of said at least partially light transmitting substrate, said photosensor array having a plurality of photosensing elements that sense light passing through said at least partially light transmitting substrate; wherein said imager chip comprises electrically conductive pads disposed in a pattern at said second surface of said at least partially light transmitting substrate; a circuit element comprising a third surface and a fourth surface opposite said third surface, said circuit element comprising circuitry disposed at least at said third surface, wherein said circuitry includes a plurality of electrically conductive pads disposed in a pattern at said third surface of said circuit element; wherein said imager chip is mounted at said circuit element with said second surface of said at least partially light transmitting substrate opposing said third surface of said circuit element, with said plurality of photosensing elements disposed between said at least partially light transmitting substrate and said circuit element; and wherein electrical connection between said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip and said electrically conductive pads at said third surface of said circuit element is made via soldering said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip to corresponding ones of said electrically conductive pads at said third surface of said circuit element when mounting said imager chip at said circuit element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A camera for a vision system for a vehicle, said camera comprising:
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an imager chip comprising an at least partially light transmitting substrate having a first surface and a second surface opposite said first surface, said imager chip comprising a photosensor array disposed at said second surface of said at least partially light transmitting substrate, said photosensor array having a plurality of photosensing elements that sense light passing through said at least partially light transmitting substrate; wherein said at least partially light transmitting substrate comprises an at least partially light transmitting semiconductor substrate; wherein said imager chip comprises electrically conductive pads disposed at said second surface of said at least partially light transmitting substrate; a circuit element comprising a third surface and a fourth surface opposite said third surface, said circuit element comprising circuitry disposed at least at said third surface; wherein said circuit element comprises a printed circuit board; wherein said circuit element comprises a plurality of electrically conductive pads disposed at said third surface of said circuit element and in electrical connection with said circuitry; wherein said imager chip is mounted at said circuit element with said second surface of said at least partially light transmitting substrate opposing said third surface of said circuit element, with said plurality of photosensing elements disposed between said at least partially light transmitting substrate and said circuit element; and wherein electrical connection between said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip and corresponding ones of said electrically conductive pads at said third surface of said circuit element is made via soldering said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip to said electrically conductive pads at said third surface of said circuit element when mounting said imager chip at said circuit element. - View Dependent Claims (14, 15, 16, 17)
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18. A camera for a vision system for a vehicle, said camera comprising:
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an imager chip comprising an at least partially light transmitting substrate having a first surface and a second surface opposite said first surface, said imager chip comprising a photosensor array disposed at said second surface of said at least partially light transmitting substrate, said photosensor array having a plurality of photosensing elements that sense light passing through said at least partially light transmitting substrate; wherein said imager chip comprises electrically conductive pads disposed at said second surface of said at least partially light transmitting substrate; a circuit element comprising a third surface and a fourth surface opposite said third surface, said circuit element comprising circuitry disposed at least at said third surface; wherein said circuit element comprises a plurality of electrically conductive pads disposed at said third surface of said circuit element; wherein said electrically conductive pads of said imager chip are arranged at said second surface of said at least partially light transmitting substrate in a pattern that generally matches a pattern of said electrically conductive pads arranged at said third surface of said circuit element; wherein said imager chip is mounted at said circuit element with said second surface of said at least partially light transmitting substrate opposing said third surface of said circuit element, with said plurality of photosensing elements disposed between said at least partially light transmitting substrate and said circuit element; wherein electrical connection between said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip and corresponding ones of said electrically conductive pads at said third surface of said circuit element is made when mounting said imager chip at said circuit element; and wherein said electrically conductive pads of said imager chip are electrically connected to said electrically conductive pads of said circuit element via respective solder balls disposed between respective corresponding ones of said electrically conductive pads, and wherein said solder balls comprise a ball grid array. - View Dependent Claims (19, 20)
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Specification