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Vehicle camera with enhanced imager and PCB assembly

  • US 10,298,818 B2
  • Filed: 03/22/2016
  • Issued: 05/21/2019
  • Est. Priority Date: 03/23/2015
  • Status: Active Grant
First Claim
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1. A camera for a vision system for a vehicle, said camera comprising:

  • an imager chip comprising an at least partially light transmitting substrate having a first surface and a second surface opposite said first surface, said imager chip comprising a photosensor array disposed at said second surface of said at least partially light transmitting substrate, said photosensor array having a plurality of photosensing elements that sense light passing through said at least partially light transmitting substrate;

    wherein said imager chip comprises electrically conductive pads disposed in a pattern at said second surface of said at least partially light transmitting substrate;

    a circuit element comprising a third surface and a fourth surface opposite said third surface, said circuit element comprising circuitry disposed at least at said third surface, wherein said circuitry includes a plurality of electrically conductive pads disposed in a pattern at said third surface of said circuit element;

    wherein said imager chip is mounted at said circuit element with said second surface of said at least partially light transmitting substrate opposing said third surface of said circuit element, with said plurality of photosensing elements disposed between said at least partially light transmitting substrate and said circuit element; and

    wherein electrical connection between said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip and said electrically conductive pads at said third surface of said circuit element is made via soldering said electrically conductive pads at said second surface of said at least partially light transmitting substrate of said imager chip to corresponding ones of said electrically conductive pads at said third surface of said circuit element when mounting said imager chip at said circuit element.

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