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Surface integrated waveguides and circuit structures therefor

  • US 10,299,368 B2
  • Filed: 12/21/2016
  • Issued: 05/21/2019
  • Est. Priority Date: 12/21/2016
  • Status: Active Grant
First Claim
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1. An apparatus for a microelectronic device, comprising:

  • a first conductive layer for providing a lower interior surface of a circuit structure;

    a plurality of wire bond wires interconnected to the lower interior surface of the first conductive layer with wire bonds and spaced apart from one another for providing at least one side of the circuit structure;

    a second conductive layer for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires; and

    the plurality of wire bond wires, the first conductive layer and the second conductive layer in combination defining at least one opening in the at least one side for a signal port of the circuit structure.

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