Modules, systems, and methods for monitoring environmental conditions

• US 10,302,455 B2
• Filed: 09/30/2016
• Issued: 05/28/2019
• Est. Priority Date: 10/09/2015
• Status: Active Grant

• Current Assignee: Bellutech LLC
• Original Assignee: Bellutech LLC
• Inventors: Yazdi, Navid
• Primary Examiner(s): Patel, Harshad R
• Assistant Examiner(s): Tran, Tran M.
• Application Number:
  US15/281,230
• Publication Number:
  US 20170102249A1
• Time in Patent Office: 970 Days
• CPC Class Codes: G01D 5/12 using electric or magnetic means G01D5/06 takes precedence
• CPC Class Codes: G01D 5/251 one conductor or channel
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0084 with perpendicular movement of the movable contact relative to the substrate
• CPC Class Codes: H01H 2037/008 Micromechanical switches operated thermally
• CPC Class Codes: H01H 2300/032 using RFID technology in switching devices
• CPC Class Codes: H01H 35/00 Switches operated by change of a physical condition operated by change of magnetic or electric field H01H36/00; thermally-actuated switches H01H37/00
• CPC Class Codes: H01H 35/42 Switches operated by change of humidity
• CPC Class Codes: Y02B 90/20 Smart grids as enabling technology in buildings sector smart grids supporting the management or operation of end-user stationary applications in general, or like technologies with no associated climate change mitigation effect Y04S20/00
• CPC Class Codes: Y04S 20/14 Protecting elements, switches, relays or circuit breakers

Abstract

Modules, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices that include a sensing device and electronic circuitry for processing an output of the sensing device and generating a output of the module. The sensing device includes a microstructure, for example, a cantilevered beam, and at least one set of contacts configured for contact-mode operation with the microstructure in response to the microstructure deflecting toward or away from the contacts when exposed to the parameter of interest. The microstructure has a stack of layers of dissimilar materials, at least one of which has at least one property that changes as a result of curing of or absorption by the first material when exposed to the parameter.

Claims

1. An electromechanical sensing module comprising:

a sensing device on a substrate, the sensing device comprising a microstructure and at least one set of contacts located on the substrate and configured for contact-mode operation with the microstructure, the microstructure being responsive to a parameter within an environment and to deflect toward or away from the contacts thereof in response to the parameter in the environment, the microstructure comprising a stack of layers comprising at least first and second layers of dissimilar first and second materials, respectively, the first material having at least one property that undergoes a change as a result of a time-dependent process in which curing of or absorption by the first material occurs due to exposure to the parameter over a period of time and the first material has a curing time or absorption time while exposed to the parameter such that the change in the property depends on a duration of the period of time during which the first material is exposed to the parameter, the curing of or the absorption by the first material during the time period indicates the parameter within the environment, the change in the property causes the microstructure to deflect in a direction normal to the stack as a result of the dissimilarity of the first and second materials, and the microstructure deflects an amount depending on the duration that the first material was exposed to the parameter in the environment, the microstructure being configured to contact and close or break contact and open the contacts after an amount of time depending on the parameter;

means for producing a digital output when the microstructure contacts and closes the contacts thereof; and

an electronic circuitry interfacing with the sensing device so that the digital output of the sensing device is used to generate a module output of the sensing module.

2. The electromechanical sensing module according to claim 1, wherein the parameter is at least one parameter chosen from the group consisting of electromagnetic radiation, a chemical, temperature, moisture, and nuclear particle radiation.

3. The electromechanical sensing module according to claim 1, wherein the first material is a curable organic material and the property of the first material changes as a result of the first material curing to form a polymeric material containing cross-linked polymer chains.

4. The electromechanical sensing module according to claim 1, wherein the property of the first material changes as a result of absorbing a chemical, particles, or moisture.

5. The electromechanical sensing module according to claim 1, wherein the change in the at least one property of the first material is irreversible.

6. The electromechanical sensing module according to claim 1, wherein the change in the at least one property of the first material is reversible.

7. The electromechanical sensing module according to claim 1, wherein the second material is an electrical conductor that electrically connects the contacts of the sensing device when the microstructure contacts and closes the contacts.

8. The electromechanical sensing module according to claim 1, wherein the second material is electrically non-conductive and the microstructure further comprises an electrical conductor layer that electrically connects the contacts of the sensing device when the microstructure contacts and closes the contacts.

9. The electromechanical sensing module according to claim 1, wherein the microstructure is a cantilevered beam.

10. The electromechanical sensing module according to claim 9, wherein the beam is a bimorph beam and the stack of layers consists of the first and second layers and optionally one or more adhesion layers therebetween.

11. The electromechanical sensing module according to claim 1, wherein the sensing device is a first sensing device and the module comprises a plurality of additional sensing devices on the substrate, each of the additional sensing devices comprises a microstructure and at least one set of contacts configured for contact-mode operation with the microstructure thereof, the microstructures are configured to contact and close or break contact and open their respective contacts depending on the duration that the first materials thereof were exposed to the parameter in the environment, the microstructure of each of the additional sensing devices comprises a stack of layers of the first and second materials so that a change in the property of the first material causes the microstructures of the additional sensing devices to deflect in a direction normal to the stack thereof as a result of the dissimilarity of the first and second materials, and each of the additional sensing devices produces a second digital output when the microstructure thereof contacts and closes or breaks contact and opens the contacts thereof.

12. The electromechanical sensing module according to claim 11, wherein the electronic circuitry interfaces with the additional sensing devices to digitally process the second digital outputs of the additional sensing devices and generate the module output therefrom over time as a cumulative output indicating the responses of the additional sensing devices to the parameter in the environment over time.

13. The electromechanical sensing module according to claim 11, wherein the interface electronics interfaces with the additional sensing devices to receive the second digital outputs of the additional sensing devices and relay the second digital outputs as the module output over time as a cumulative output indicating the responses of the additional sensing devices to the parameter in the environment over time.

14. The electromechanical sensing module according to claim 11, wherein the electronic circuitry communicates with a subset of the additional sensing devices, the second digital outputs of only the subset of additional sensing devices are processed by the electronic circuitry to generate the module output of the sensing module, and a remainder of the additional sensing devices not part of the subset of additional sensing devices are responsive to durations of exposure to the parameter in the environment outside a range defined by durations of exposure to the parameter in the environment to which the subset of additional sensing devices are responsive.

15. The electromechanical sensing module according to claim 11, wherein the microstructures of the sensing devices are responsive to the changes in the parameter in the environment without any electrical power supplied to the microstructures.

16. The electromechanical sensing module according to claim 1, further comprising a radio frequency identification link operable to wirelessly transmit the module output.

17. The electromechanical sensing module according to claim 1, wherein the microstructure is further configured to contact and close or break contact and open the contacts due at least in part to the parameter being at or above a predetermined level in the environment that initiates the change in the property.

18. An electromechanical sensing module comprising:

a plurality of sensing devices on a substrate, each sensing device comprising a cantilevered beam and at least one set of contacts located on the substrate and configured for non-latching contact-mode operation with the beam, the beam of each sensing device being responsive to a parameter within an environment and to deflect toward or away from the contacts thereof in response to the parameter in the environment, the beam of each sensing device comprising a stack of layers comprising at least first and second layers of dissimilar first and second materials, respectively, the first material being a curable material that has at least one property that undergoes a change as a result of a time-dependent process in which curing of the curable material occurs due to exposure to the parameter over a period of time and the first material has a curing time while exposed to the parameter such that the change in the property depends on a duration of the period of time during which the first material is exposed to the parameter, the curing of the first material during the time period indicates the parameter within the environment, the change in the property causes the beam to deflect in a direction normal to the stack as a result of the dissimilarity of the first and second materials, and the microstructure deflects an amount depending on the duration that the first material was exposed to the parameter in the environment, the beams being configured to contact and close or break contact and open their respective contacts after an amount of time depending on the parameter;

means for producing a digital output when any one of the beams contacts and closes or breaks contact and opens the contacts thereof; and

an electronic circuitry interfacing with the sensing devices so that the digital outputs of the sensing devices are used to generate a module output of the sensing module.

19. The electromechanical sensing module according to claim 18, wherein the parameter is at least one parameter chosen from the group consisting of electromagnetic radiation, a chemical, temperature, moisture, and nuclear particle radiation.

20. The electromechanical sensing module according to claim 18, wherein the curable material is an organic material that cures to form a polymeric material containing cross-linked polymer chains.

21. The electromechanical sensing module according to claim 18, wherein the curing of the curable material is irreversible.

22. The electromechanical sensing module according to claim 18, wherein the curing of the curable material is reversible.

23. The electromechanical sensing module according to claim 18, wherein the electronic circuitry interfaces with the sensing devices to digitally process the digital outputs of the sensing devices and generate the module output therefrom over time as a cumulative output indicating the responses of the sensing devices to the parameter in the environment over time.

24. The electromechanical sensing module according to claim 18, wherein the electronic circuitry interfaces with the sensing devices to receive the digital outputs of the sensing devices and relay the digital outputs as the module output over time as a cumulative output indicating the responses of the sensing devices to the parameter in the environment over time.

25. The electromechanical sensing module according to claim 18, wherein the electronic circuitry communicates with a subset of the sensing devices, the digital outputs of only the subset of sensing devices are processed by the electronic circuitry to generate the module output of the sensing module, and a remainder of the sensing devices not part of the subset of sensing devices are responsive to durations of exposure to the parameter in the environment outside a range defined by durations of exposure to the parameter in the environment to which the subset of sensing devices are responsive.

26. The electromechanical sensing module according to claim 18, wherein the module is a first electromechanical sensing module of a monitoring system and the monitoring system comprises a plurality of additional electromechanical sensing module.

27. The electromechanical sensing module according to claim 18, wherein the microstructure is further configured to contact and close or break contact and open the contacts due at least in part to the parameter being at or above a predetermined level in the environment that initiates the change in the property.

28. An electromechanical sensing module comprising:

a plurality of sensing devices on a substrate, each sensing device comprising a cantilevered beam and at least one set of contacts located on the substrate and configured for non-latching contact-mode operation with the beam, the beam of each sensing device being responsive to a parameter within an environment and to deflect toward or away from the contacts thereof in response to the parameter in the environment, the beam of each sensing device comprising a stack of layers comprising at least first and second layers of dissimilar first and second materials, respectively, the first material having at least one property that undergoes a change as a result of a time-dependent process in which absorption by the first material occurs due to exposure to the parameter over a period of time and the first material has an absorption time while exposed to the parameter such that the change in the property depends on a duration of the period of time during which the first material is exposed to the parameter, the absorption by the first material during the time period indicates the parameter within the environment, the change in the property causes the beam to deflect in a direction normal to the stack as a result of the dissimilarity of the first and second materials, and the microstructure deflects an amount depending on the duration that the first material was exposed to the parameter in the environment, the beams being configured to contact and close or break contact and open their respective contacts after an amount of time depending on the parameter;

means for producing a digital output when any one of the beams contacts and closes or breaks contact and opens the contacts thereof; and

an electronic circuitry interfacing with the sensing devices so that the digital outputs of the sensing devices are used to generate a module output of the sensing module.

29. The electromechanical sensing module according to claim 28, wherein the parameter is at least one parameter chosen from the group consisting of electromagnetic radiation, a chemical, temperature, moisture, and nuclear particle radiation.

30. The electromechanical sensing module according to claim 28, wherein the electronic circuitry interfaces with the sensing devices to digitally process the digital outputs of the sensing devices and generate the module output therefrom over time as a cumulative output indicating the responses of the sensing devices to the parameter in the environment over time.

31. The electromechanical sensing module according to claim 28, wherein the electronic circuitry interfaces with the sensing devices to receive the digital outputs of the sensing devices and relay the digital outputs as the module output over time as a cumulative output indicating the responses of the sensing devices to the parameter in the environment over time.

32. The electromechanical sensing module according to claim 28, wherein the electronic circuitry communicates with a subset of the sensing devices, the digital outputs of only the subset of sensing devices are processed by the electronic circuitry to generate the module output of the sensing module, and a remainder of the sensing devices not part of the subset of sensing devices are responsive to durations of exposure to the parameter in the environment outside a range defined by durations of exposure to the parameter in the environment to which the subset of sensing devices are responsive.

33. The electromechanical sensing module according to claim 28, wherein the module is a first electromechanical sensing module of a monitoring system and the monitoring system comprises a plurality of additional electromechanical sensing module.

34. The electromechanical sensing module according to claim 28, wherein the microstructure is further configured to contact and close or break contact and open the contacts due at least in part to the parameter being at or above a predetermined level in the environment that initiates the change in the property.

35. A method of sensing a parameter within an environment, the method comprising the steps of:

providing a sensing module comprising electronic circuitry and a sensing device on a substrate, the sensing device comprising a microstructure and at least one set of contacts located on the substrate and configured for contact-mode operation with the microstructure, the microstructure comprising a stack of layers comprising at least first and second layers of dissimilar first and second materials, respectively, the first material having at least one property that undergoes a change as a result of a time-dependent process in which curing of or absorption by the first material occurs due to exposure to the parameter over a period of time and the first material has a curing time or absorption time while exposed to the parameter such that the change in the property depends on a duration of the period of time during which the first material is exposed to the parameter, the curing of or the absorption by the first material during the time period indicates the parameter within the environment, the change in the property causes the microstructure to deflect in a direction normal to the stack as a result of the dissimilarity of the first and second materials, and the microstructure deflects an amount depending on the duration that the first material was exposed to the parameter in the environment;

exposing the microstructure to the parameter within the environment to cause the microstructure to deflect in a first direction toward and close or deflect away from and open the contacts after an amount of time depending on the parameter;

producing a digital output when the microstructure contacts and closes or breaks contact and opens the contacts thereof; and

using the digital output of the sensing device to generate a module output of the sensing module.

36. The method according to claim 35, wherein the parameter is at least one parameter chosen from the group consisting of electromagnetic radiation, a chemical, temperature, and moisture.

37. The method according to claim 35, wherein the first material is a curable organic material and the property of the first material changes as a result of the first material curing to form a polymeric material containing cross-linked polymer chains.

38. The method according to claim 35, wherein the property of the first material changes as a result of absorbing a chemical, particles, or moisture.

39. The method according to claim 35, wherein the change in the at least one property of the first material is irreversible.

40. The method according to claim 35, wherein the change in the at least one property of the first material is reversible.

41. The method according to claim 35, further comprising treating the sensing device to cause the microstructure to deflect in a second direction opposite the first direction.

42. The method according to claim 41, wherein the treating step comprises at least partially reversing the change in the at least one property of the first material.

43. The method according to claim 41, wherein the treating step comprises changing a property of the second material of the second layer.

44. The method according to claim 35, wherein the sensing device is a first sensing device and the module comprises a plurality of additional sensing devices on the substrate, each of the additional sensing devices comprises a microstructure and at least one set of contacts configured for contact-mode operation with the microstructure thereof, the microstructures are configured to contact and close or break contact and open their respective contacts depending on the duration that the first materials thereof were exposed to the parameter in the environment, the microstructure of each of the additional sensing devices comprises a stack of layers of the first and second materials so that a change in the property of the first material causes the microstructures of the additional sensing devices to deflect in a direction normal to the stack thereof as a result of the dissimilarity of the first and second materials, and each of the additional sensing devices produces a second digital output when the microstructure thereof contacts and closes or breaks contact and opens the contacts thereof.

45. The method according to claim 44, wherein the electronic circuitry generates the module output by individually digitally processing the second digital outputs of the additional sensing devices and generate the module output therefrom over time as a cumulative output indicating the responses of the additional sensing devices to the parameter in the environment over time.

46. The method according to claim 44, wherein the electronic circuitry generates the module output over time as a cumulative output of the additional sensing devices to the parameter in the environment over time.

47. The method according to claim 44, wherein the second digital outputs of only a subset of the additional sensing devices are processed to generate the module output of the sensing module, and a remainder of the additional sensing devices is ignored by the electronic circuitry when generating the module output.

48. The method according to claim 44, further comprising wirelessly transmitting the module output with a radio frequency identification link.

49. The method according to claim 44, wherein the module is a first electromechanical sensing module of a monitoring system and the monitoring system receives the module output of the first electromechanical sensing module and module outputs of a plurality of additional electromechanical sensing module.

50. The method according to claim 35, wherein exposing the microstructure to the parameter within the environment to at least partially cure the first material also causes the microstructure to deflect in the first direction toward and close or deflect away from and open the contacts due at least in part to the parameter being at or above a predetermined level in the environment that initiates the change in the property.