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Method and system for implementing high-speed electrical interfaces between semiconductor dies in optical communication systems

  • US 10,302,880 B2
  • Filed: 08/23/2018
  • Issued: 05/28/2019
  • Est. Priority Date: 02/23/2010
  • Status: Active Grant
First Claim
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1. A method for processing signals, the method comprising:

  • in a communication system, communicating electrical signals between a first die and a second die via coupling pads on said first die and said second die, wherein said coupling pads are located at low impedance points between two transistors in one or more transmit paths and/or one or more receive paths in said communication system, wherein a first of said two transistors is integrated in said first die and a second of said two transistors is integrated in said second die.

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