Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby
First Claim
1. A microelectronic package socket structure comprising:
- a conductive pin comprising;
a first portion, wherein the first portion comprises a cantilever beam, wherein the cantilever beam is physically coupled with a first side of a package substrate; and
a second portion, wherein the second portion comprises a contact pin, wherein a terminal end of the contact pin portion is physically and electrically coupled to a board, wherein the first portion and the second portion are in direct physical contact and are physically continuous with each other;
a housing structure, wherein the housing structure comprises a housing cavity, wherein the second portion of the conductive pin is within the housing cavity;
a solder ball directly on the terminal end of the contact pin portion, wherein the solder ball is at least partially within the housing cavity; and
a conductive material, wherein the conductive material is on a sidewall of the housing cavity.
1 Assignment
0 Petitions
Accused Products
Abstract
Methods/structures of forming package structures are described. Those methods/structures may include a conductive pin comprising: a cantilever beam portion physically coupled with a first side of a package substrate; a contact pin portion, wherein a terminal end of the contact pin portion is physically and electrically coupled to a board; a housing structure comprising a housing cavity, wherein the contact pin portion is disposed at least partially within the housing cavity; and a conductive material disposed on housing sides and/or adjacent a surface of the housing cavity. The placement of the conductive material is optimized to meet the requirements for either double data rate (DDR) and/or peripheral component interface express (PCIe) interfaces.
6 Citations
25 Claims
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1. A microelectronic package socket structure comprising:
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a conductive pin comprising; a first portion, wherein the first portion comprises a cantilever beam, wherein the cantilever beam is physically coupled with a first side of a package substrate; and a second portion, wherein the second portion comprises a contact pin, wherein a terminal end of the contact pin portion is physically and electrically coupled to a board, wherein the first portion and the second portion are in direct physical contact and are physically continuous with each other; a housing structure, wherein the housing structure comprises a housing cavity, wherein the second portion of the conductive pin is within the housing cavity; a solder ball directly on the terminal end of the contact pin portion, wherein the solder ball is at least partially within the housing cavity; and a conductive material, wherein the conductive material is on a sidewall of the housing cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a microelectronic package socket structure comprising:
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providing a housing structure for a conductive pin, wherein the housing structure comprises a first side and an opposing second side, and wherein the housing structure comprises a housing cavity; placing a contact pin portion of the conductive pin within the housing cavity, wherein a terminal end of the contact pin is placed directly onto a solder ball, wherein the solder ball is at least partially within the housing cavity; and
;attaching a cantilever beam portion of the conductive pin to a package substrate, wherein the cantilever beam portion and the contact pin portion are in direct physical contact and are physically continuous with each other; and forming a conductive material on at least one of a sidewall of the housing structure or a sidewall of the housing cavity. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A microelectronic system, comprising:
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a package substrate comprising one or more die; a socket structure physically and electrically coupled to the one or more die, wherein the socket structure comprises; a conductive pin comprising; a first portion, wherein the first portion comprises a cantilever beam, wherein the cantilever beam is physically coupled with a first side of a package substrate; and a second portion, wherein the second portion comprises a contact pin, wherein a terminal end of the contact pin portion is physically and electrically coupled to a board, wherein the first portion and the second portion are in direct physical contact and are physically continuous with each other; a housing structure, wherein the housing structure comprises a housing cavity, wherein the second portion of the conductive pin is within the housing cavity; a solder ball, wherein the solder ball is directly on the terminal end of the contact pin portion, wherein the solder ball is at least partially within the housing cavity; and a conductive material on a sidewall of the housing cavity. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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Specification