Apparatus and methods for predicting wafer-level defect printability

• US 10,304,180 B2
• Filed: 07/03/2017
• Issued: 05/28/2019
• Est. Priority Date: 08/10/2015
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation (KLA Corporation)
• Original Assignee: KLA-Tencor Corporation (KLA Corporation)
• Inventors: Shi, Rui-fang, Sezginer, Abdurrahman
• Primary Examiner(s): Dunphy, David F
• Application Number:
  US15/641,150
• Publication Number:
  US 20170309008A1
• Time in Patent Office: 694 Days
• CPC Class Codes: G01N 2021/95676 Masks, reticles, shadow masks
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G03F 1/84 Inspecting
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G06T 2207/10144 Varying exposure
• CPC Class Codes: G06T 2207/10152 Varying illumination
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire images at different imaging configurations from each of a plurality of pattern areas of a test reticle. A reticle near field for each of the pattern areas of the test reticle is recovered based on the acquired images from each pattern area of the test reticle. A lithography model is applied to the reticle near field for the test reticle to simulate a plurality of test wafer images, and the simulated test wafer images are analyzed to determine whether the test reticle will likely result in an unstable or defective wafer.

Claims

1. A method of qualifying a photolithographic reticle, the method comprising:

using a reticle inspection tool, acquiring a plurality of images at different imaging configurations from each of a plurality of pattern areas of a test reticle;

recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle;

applying a lithography model to the reticle near field for the test reticle to simulate a plurality of test wafer images; and

analyzing the simulated test wafer images to determine whether the test reticle will likely result in an unstable or defective wafer.

2. The method of claim 1, further comprising:

using a reticle inspection tool, acquiring a plurality of images at different imaging configurations from each of a plurality of pattern areas of a calibration reticle;

recovering the reticle near field for each of the pattern areas of the calibration reticle based on the acquired images from each pattern area of the calibration reticle;

using the recovered reticle near field for the calibration reticle, simulating a plurality of wafer images based on the reticle near field; and

adjusting a parameter of the lithography model so that simulated wafer images agree with wafers printed using the calibration reticle.

3. The method of claim 1, wherein the lithography model is based on a recovered reticle near field from a reticle.

4. The method of claim 3, wherein the reticle near field is recovered using a quasi-Newton or conjugate gradient technique for determining the reticle near field.

5. The method of claim 3, wherein the reticle near field is recovered by a regressive technique that minimizes a sum of a plurality of squared differences between the acquired images and a plurality of images that are calculated from the reticle near field.

6. The method of claim 3, wherein the reticle near field is recovered using a Hopkins approximation.

7. The method of claim 3, wherein the reticle near field is recovered without using a design database that was used to fabricate the reticle.

8. The method of claim 3, wherein the acquired images include at least three images that are acquired at different imaging conditions selected to result in a same reticle near field.

9. The method of claim 8, wherein the different process conditions include different focus settings, different illumination directions or patterns, different linear polarization for an entire illumination pupil or different parts of an illumination pupil, and/or different apodization settings to obscure different portions of a collection beam.

10. The method of claim 1, wherein the lithography model simulates a photolithography process, including the effect of a particular photoresist material.

11. The method of claim 1, wherein the model is applied to the test reticle near field under a plurality of different lithography process conditions and analyzing the simulated test wafer images includes determining whether the test reticle will likely result in an unstable wafer under the different lithography process conditions by comparing the simulated test images having different process conditions and being associated with a same reticle area.

12. An inspection system for qualifying a photolithographic reticle, the system comprising:

a light source for generating an incident beam;

illumination optics for directing the incident beam onto a reticle;

collection optics for directing an output beam from each pattern area of the reticle to at least one sensor;

at least one sensor for detecting the output beam and generating an image or signal based on the output beam; and

a controller that is configured to perform the following operations;

causing an acquiring of a plurality of images at different imaging configurations from each of a plurality of pattern areas of a test reticle;

recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle;

applying a lithography model to the reticle near field for the test reticle to simulate a plurality of test wafer images; and

analyzing the simulated test wafer images to determine whether the test reticle will likely result in an unstable or defective wafer.

13. The system of claim 12, wherein the controller is further configured for:

causing an acquiring of a plurality of images at different imaging configurations from each of a plurality of pattern areas of a calibration reticle;

recovering the reticle near field for each of the pattern areas of the calibration reticle based on the acquired images from each pattern area of the calibration reticle;

using the recovered reticle near field for the calibration reticle, simulating a plurality of wafer images based on the reticle near field; and

adjusting a parameter of the lithography model so that simulated wafer images agree with wafers printed using the calibration reticle.

14. The system of claim 12, wherein the lithography model is based on a recovered reticle near field from a reticle.

15. The system of claim 14, wherein the reticle near field is recovered using a quasi-Newton or conjugate gradient technique for determining the reticle near field.

16. The system of claim 14, wherein the reticle near field is recovered by a regressive technique that minimizes a sum of a plurality of squared differences between the acquired images and a plurality of images that are calculated from the reticle near field.

17. The system of claim 14, wherein the reticle near field is recovered using a Hopkins approximation.

18. The system of claim 14, wherein the reticle near field is recovered without using a design database that was used to fabricate the reticle.

19. The system of claim 14, wherein the acquired images include at least three images that are acquired at different imaging conditions selected to result in a same reticle near field.

20. The system of claim 19, wherein the different process conditions include different focus settings, different illumination directions or patterns, different linear polarization for an entire illumination pupil or different parts of an illumination pupil, and/or different apodization settings to obscure different portions of a collection beam.

21. The system of claim 12, wherein the lithography model simulates a photolithography process, including the effect of a particular photoresist material.

22. The system of claim 12, wherein the model is applied to the test reticle near field under a plurality of different lithography process conditions and analyzing the simulated test wafer images includes determining whether the test reticle will likely result in an unstable wafer under the different lithography process conditions by comparing the simulated test images having different process conditions and being associated with a same reticle area.