Pads and pin-outs in three dimensional integrated circuits
First Claim
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1. A method, comprising:
- forming a programmable layer of a hard-wired device by using a plurality of first masks in common with a programmable device fabrication process;
forming a hard-wire layer of the hard-wired device by using a plurality of second masks omitted from the programmable device fabrication process, wherein the hard-wire layer is operable to hard-wire the programmable layer with a logical functionality; and
forming a pad layer of the hard-wired device by using a plurality of third masks in common with the programmable device fabrication process.
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Abstract
A three dimensional semiconductor device, comprising: a substrate including a plurality of circuits; a plurality of pads, each pad coupled to a circuit; and a memory array positioned above or below the substrate and coupled to a circuit to program the memory array.
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Citations
20 Claims
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1. A method, comprising:
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forming a programmable layer of a hard-wired device by using a plurality of first masks in common with a programmable device fabrication process; forming a hard-wire layer of the hard-wired device by using a plurality of second masks omitted from the programmable device fabrication process, wherein the hard-wire layer is operable to hard-wire the programmable layer with a logical functionality; and forming a pad layer of the hard-wired device by using a plurality of third masks in common with the programmable device fabrication process. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method, comprising:
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forming a plurality of layers of a hard-wired device by using a first plurality of masks in common with a programmable device fabrication process, wherein said forming a plurality of layers includes; forming a programmable layer; and forming a pad layer; and forming a hard-wire layer of the hard-wired device by using a second plurality of masks omitted from the programmable device fabrication process, wherein the hard-wire layer is operable to hard-wire the programmable layer with a logical functionality. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method, comprising:
forming a hard-wired device operable to provide a logical functionality in common with a programmable device fabrication process, wherein said forming a hard-wired device includes; using a plurality of first masks in common with the programmable device fabrication process to form a programmable layer; using a plurality of second masks omitted from the programmable device fabrication process to form a hard-wire layer operable to hard-wire the programmable layer with the logical functionality; and using a plurality of third masks in common with the programmable device fabrication process to form a pad layer. - View Dependent Claims (16, 17, 18, 19, 20)
Specification