Light emitting semiconductor device

• US 10,305,002 B2
• Filed: 06/01/2015
• Issued: 05/28/2019
• Est. Priority Date: 06/12/2014
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Leirer, Christian, Maute, Markus
• Primary Examiner(s): Bradley, Stephen M
• Application Number:
  US15/121,713
• Publication Number:
  US 20170125643A1
• Time in Patent Office: 1,457 Days
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 29/861 Diodes
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting semiconductor device includes at least one light emitting semiconductor chip having a semiconductor layer sequence, a light outcoupling surface, a rear face on an opposite side of the semiconductor layer sequence from the light outcoupling surface, and side faces which connect the light outcoupling surface and the rear face. The light emitting semiconductor device further includes a carrier body, having a molded body which covers the side faces of the at least one light emitting semiconductor chip directly and in a positively-locking manner. The carrier body comprises, at the light outcoupling surface of the at least one light emitting semiconductor chip, a top face on which a dielectric mirror is disposed. At least part of the light outcoupling surface is uncovered by the dielectric mirror.

Claims

1. A light emitting semiconductor device comprising:

at least one light emitting semiconductor chip having a semiconductor layer sequence, a light outcoupling surface, a rear face on an opposite side of the semiconductor layer sequence from the light outcoupling surface, and side faces which connect the light outcoupling surface and the rear face;

a carrier body, having a molded body which covers the side faces of the at least one light emitting semiconductor chip directly and in a positively-locking manner, wherein the carrier body comprises, at the light outcoupling surface of the at least one light emitting semiconductor chip, a top face on which a dielectric mirror is disposed, wherein at least part of the light outcoupling surface is uncovered by the dielectric mirror, wherein the dielectric mirror comprises a periodic sequence of at least two dielectric layers having different refractive indices, and wherein each of the at least two dielectric layers extends substantially parallel to the top face of the carrier body and to the light outcoupling surface;

a first component configured to electrically connect the top face of the carrier body to a rear face of the carrier body opposite the top face, wherein the first component is arranged in the carrier body and beside the at least one light emitting semiconductor chip, wherein the first component has side faces to which the molded body is directly attached in a positively-locking manner; and

an electrical connecting element arranged on the top face of the carrier body, wherein the electrical connecting element electrically connects the light outcoupling surface of the at least one light emitting semiconductor chip and a top face of the first component;

wherein the electrical connecting element is arranged between the dielectric mirror and the carrier body; and

wherein the electrical connecting element encloses the at least one light emitting semiconductor chip in a lateral direction.

2. The semiconductor device as claimed in claim 1, wherein the dielectric mirror comprises at least one inorganic dielectric material.

3. The semiconductor device as claimed in claim 1, wherein the dielectric mirror is a Bragg mirror.

4. The semiconductor device as claimed in claim 1, wherein the first component is a protection diode.

5. The semiconductor device as claimed in claim 1, wherein the first component is arranged under the dielectric mirror and is covered by the dielectric mirror.

6. The semiconductor device as claimed in claim 1, wherein the electrical connecting element is a metallic layer.

7. The semiconductor device as claimed in claim 1, wherein the at least one light emitting semiconductor chip comprises an electrical contact element on the light outcoupling surface, wherein the first component comprises a corresponding electrical contact element on the top face of the first component and wherein the contact element of the at least one light emitting semiconductor chip and the corresponding electrical contact element of the first component are electrically connected by the electrical connecting element.

8. The semiconductor device as claimed in claim 1, wherein the electrical connecting element is arranged on the dielectric mirror as viewed from the carrier body.

9. The semiconductor device as claimed in claim 8, wherein the electrical connecting element is electrically connected to the top face of the first component and to the light outcoupling surface of the light emitting semiconductor chip by electrical vias extending through the dielectric mirror.

10. The semiconductor device as claimed in claim 1, wherein the light outcoupling surface is free of coverage by the molded body.

11. The semiconductor device as claimed in claim 1, wherein the dielectric mirror covers the entire top face of the carrier body.

12. The semiconductor device as claimed in claim 1, wherein a wavelength conversion element is arranged on the light outcoupling surface.

13. The semiconductor device as claimed in claim 12, wherein the dielectric mirror encloses the wavelength conversion element in a lateral direction.

14. The semiconductor device as claimed in claim 1, wherein the at least one light emitting semiconductor chip comprises an electrical contact element on the light outcoupling surface, and wherein the dielectric mirror extends from the top face of the carrier body over the electrical contact element and covers the electrical contact element.

15. The semiconductor device as claimed in claim 1, wherein the light outcoupling surface of the at least one light emitting semiconductor chip is substantially level with the top face of the carrier body;

wherein the dielectric mirror has a lowermost surface disposed above the top face of the carrier body and above the light outcoupling surface of the at least one light emitting semiconductor chip; and

wherein at least a portion of the dielectric mirror extends laterally from directly over the top face of the carrier body, over one of the side faces of the at least one light emitting semiconductor chip that is covered by the carrier body, directly over the light outcoupling surface of the at least one light emitting semiconductor chip.

16. A light emitting semiconductor device comprising:

at least one light emitting semiconductor chip having a semiconductor layer sequence, a light outcoupling surface, a rear face on an opposite side of the semiconductor layer sequence from the light outcoupling surface, and side faces which connect the light outcoupling surface and the rear face;

a carrier body, having a molded body which covers the side faces of the at least one light emitting semiconductor chip directly and in a positively-locking manner;

an electrical semiconductor component arranged in the carrier body; and

an electrical connecting element arranged on a top face of the carrier body;

wherein the carrier body has, at the light outcoupling surface of the at least one light emitting semiconductor chip, a dielectric mirror which is disposed on the top face of the carrier body, wherein at least part of the light outcoupling surface is uncovered by the dielectric mirror;

wherein the electrical connecting element is arranged between the dielectric mirror and the carrier body and electrically connects the at least one light emitting semiconductor chip and the electrical semiconductor component; and

wherein the electrical connecting element encloses the at least one light emitting semiconductor chip in a lateral direction.

17. A light emitting semiconductor device comprising:

at least one light emitting semiconductor chip having a semiconductor layer sequence, a light outcoupling surface, a rear face on an opposite side of the semiconductor layer sequence from the light outcoupling surface, and side faces which connect the light outcoupling surface and the rear face; and

a carrier body, having a molded body which covers the side faces of the at least one light emitting semiconductor chip directly and in a positively-locking manner;

wherein the carrier body comprises, at the light outcoupling surface of the at least one light emitting semiconductor chip, a top face on which a dielectric mirror is disposed, wherein at least part of the light outcoupling surface is uncovered by the dielectric mirror;

wherein the top face of the carrier body, the light outcoupling surface of the at least one light emitting semiconductor chip, and a surface of the dielectric mirror that is remote from the carrier body and from the light emitting semiconductor chip are substantially parallel; and

wherein the at least one light emitting semiconductor chip comprises an electrical contact element on the light outcoupling surface, and wherein the dielectric mirror extends from the top face of the carrier body over the electrical contact element and covers the electrical contact element.

18. A light emitting semiconductor device comprising:

at least one light emitting semiconductor chip having a semiconductor layer sequence, a light outcoupling surface, a rear face on an opposite side of the semiconductor layer sequence from the light outcoupling surface, and side faces which connect the light outcoupling surface and the rear face; and

a carrier body, having a molded body which covers the side faces of the at least one light emitting semiconductor chip directly and in a positively-locking manner;

wherein the carrier body comprises, at the light outcoupling surface of the at least one light emitting semiconductor chip, a top face on which a dielectric mirror is disposed, wherein at least part of the light outcoupling surface is uncovered by the dielectric mirror, wherein the dielectric mirror comprises a periodic sequence of at least two dielectric layers having different refractive indices, and wherein each of the at least two dielectric layers extends substantially parallel to the top face of the carrier body and to the light outcoupling surface; and

wherein the at least one light emitting semiconductor chip comprises an electrical contact element on the light outcoupling surface, and wherein the dielectric mirror extends from the top face of the carrier body over the electrical contact element and covers the electrical contact element.