Dielectric lens structures for EHF radiation

• US 10,305,196 B2
• Filed: 04/17/2013
• Issued: 05/28/2019
• Est. Priority Date: 04/17/2012
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: Redd, Justin
• Primary Examiner(s): Nguyen, Hoang V
• Assistant Examiner(s): Kim, Jae K
• Application Number:
  US13/865,105
• Publication Number:
  US 20130271331A1
• Time in Patent Office: 2,232 Days
• Field of Search: 343753
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H01Q 19/062 for focusing

Abstract

Communication devices for communicating using EHF electromagnetic radiation that include a dielectric lens configured to refract incident EHF electromagnetic radiation. The communication device may include an integrated circuit (IC) package that in turn includes a transducer configured to transmit and/or receive an EHF electromagnetic signal and convert between electrical signals and electromagnetic signals. The integrated circuit package also includes an integrated circuit including at least one of a transmitter circuit and a received circuit that is operatively coupled to the transducer. The dielectric lens is generally disposed so as to enhance transmission or reception of the EHF electromagnetic signal by the transducer.

Claims

1. An EHF communication system comprising:

a first device comprising a first integrated circuit package having a first transducer configured to transmit an electromagnetic signal in an EHF frequency range;

a first dielectric lens disposed adjacent the first transducer such that at least a portion of the electromagnetic signal is refracted by the first dielectric lens; and

a second device including a second integrated circuit package having a second transducer configured to receive the electromagnetic signal refracted by the first dielectric lens, wherein the first dielectric lens has a first surface and a second surface opposite the first surface, the first surface facing the first integrated circuit package having the first transducer and the second surface facing the second integrated circuit package having the second transducer, and wherein the first dielectric lens is a biconvex lens comprising a combination of a first spherical cap in a first housing of the first device and a second spherical cap is in a second housing of the second device.

2. The EHF communication system of claim 1, wherein the first spherical cap comprises a first base having a first base radius and the second spherical cap comprises a second base having a second base radius, the first base radius substantially equal to the second base radius;

wherein the first spherical cap has a first spherical surface with the first radius of curvature and the second spherical cap has a second spherical surface with the second radius of curvature.

3. The EHF communication system of claim 2, wherein the first dielectric lens includes a homogeneous material having an index of refraction between 1.2 and 2.0 measured at 60 GHz.

4. The EHF communication system of claim 2, wherein the first spherical cap has a first height that is substantially equal to the first radius of curvature, such that the first spherical surface substantially corresponds to a hemisphere.

5. The EHF communication system of claim 2 wherein the second spherical surface has a second height that is less than the second radius of curvature.

6. The EHF communication system of claim 5, wherein the ratio of the first radius of curvature to the second radius of curvature is in the range of about 9 to about 9.2.

7. The EHF communication system of claim 2, wherein the second spherical cap has a second height that is substantially equivalent to the second radius of curvature, such that the second spherical surface substantially corresponds to a hemisphere.

8. The EHF communication system of claim 1, wherein:

the first integrated circuit package comprises a transmitter circuit configured to convert a first baseband signal into an EHF electrical signal, the transducer configured to convert the EHF electrical signal into the electromagnetic signal; and

the second integrated circuit package comprises a receiver circuit configured to convert an EHF electrical signal from the second transducer into a second baseband signal.