Plating method and plating apparatus

• US 10,309,030 B2
• Filed: 02/20/2017
• Issued: 06/04/2019
• Est. Priority Date: 03/27/2012
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Minami, Yoshio, Fujikata, Jumpei, Kishi, Takashi
• Primary Examiner(s): West, Paul M.
• Application Number:
  US15/437,157
• Publication Number:
  US 20170159203A1
• Time in Patent Office: 834 Days
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/004 Sealing devices
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: G01M 3/20 using special tracer materials, e.g. dye, fluorescent material, radioactive material
• CPC Class Codes: G01M 3/26 by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
• CPC Class Codes: G01M 3/3263 using a differential pressure detector G01M3/3245, G01M3/3272 take precedence
• CPC Class Codes: G01M 3/3281 removably mounted in a test cell
• CPC Class Codes: G01M 3/34 by testing the possibility of maintaining the vacuum in containers, e.g. in can-testing machines

Abstract

A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

Claims

1. An apparatus for plating a substrate, comprising:

a substrate holder including a first holding member and a second holding member which has an opening, the substrate holder being configured to hold a substrate by supporting one surface of the substrate with the first holding member while placing the second holding member in contact with other surface of the substrate, with the other surface of the substrate exposed through the opening of the second holding member, the second holding member having a first protruding portion configured to seal a gap between the first holding member and the second holding member and a second protruding portion configured to seal a peripheral portion of the substrate when the substrate is held by the substrate holder to form an internal space in the substrate holder by the first holding member, the second holding member, and the substrate, the substrate holder having an internal passage communicating with the internal space;

a suction coupling coupled to a suction line extending from a vacuum source and detachably mounted to the substrate holder so as to communicate with the internal passage;

a pressure sensor configured to check whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time when producing a vacuum in the internal space through the suction line; and

a pressure change detection section configured to detect a change in the pressure in the internal space after the vacuum is produced in the internal space and the internal space is closed off;

wherein the apparatus is operable to perform a first-stage leakage test of the substrate holder for inspecting the first protruding portion and the second protruding portion by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time, then perform a second-stage leakage test of the substrate holder, which has passed the first-stage leakage test, for further inspecting the first protruding portion and the second protruding portion by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time, and then plate the substrate in a plating bath with use of the substrate holder that has passed the second-stage leakage test.

2. The apparatus according to claim 1, wherein the pressure change detection section includes:

a master container which is assured that any leakage does not occur and is coupled to the vacuum source; and

a differential pressure sensor configured to measure a differential pressure between the pressure in the master container and the pressure in the internal space.

3. The apparatus according to claim 1, wherein the internal passage of the substrate holder is formed in the first holding member, the substrate holder has a suction port coupled to the internal passage, and the suction port is removably coupled to the suction line.

4. The apparatus according to claim 1, further comprising:

a substrate loading unit for loading and unloading the substrate into and from the substrate holder, the first leakage test and the second leakage test being performed in the substrate loading unit.

5. The apparatus according to claim 4, further comprising:

a cassette table on which a cassette can be placed, the cassette being for storing substrates therein;

a substrate transport device configured to transport a substrate between the cassette table and the substrate loading unit;

a stocker for storing the substrate holder therein; and

a substrate holder transport device configured to transport the substrate holder,

wherein the substrate transport device is configured to remove a substrate from a substrate holder that has failed to pass the first leakage test and the second leakage test and return the substrate into the cassette, and

wherein the substrate holder transport device is configured to transport the substrate holder that has failed to pass the first leakage test and the second leakage test into the stocker.