Display device and manufacturing method of the same
First Claim
1. A manufacturing method of a display device, the manufacturing method comprising:
- preparing a first substrate on which light emitting elements, a thin film encapsulation layer and connecting pads are formed;
preparing a second substrate on which a touch sensor layer including sensing electrodes and sensing lines and sensing pads electrically connected to the sensing electrodes through the sensing lines are formed;
applying an interlayer to the thin film encapsulation layer or the touch sensor layer to cover an edge of the thin film encapsulation layer;
applying a conductive member to the connecting pads or the sensing pads;
reversing the second substrate such that the touch sensor layer faces the thin film encapsulation layer; and
bonding the first substrate to the second substrate through the interlayer.
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Accused Products
Abstract
A display device includes a first substrate including a first area and a second area, light emitting elements arranged in the first area, connecting pads arranged in the second area, a thin film encapsulation layer arranged on the light emitting elements, a second substrate including a third area and a fourth area, sensing pads arranged in the fourth area, a touch sensor layer including sensing electrodes arranged in the third area and sensing lines connected between the sensing electrodes and the sensing pads, an interlayer arranged between the thin film encapsulation layer and the touch sensor layer, and a conductive member connected between the connecting pads and the sensing pads.
13 Citations
19 Claims
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1. A manufacturing method of a display device, the manufacturing method comprising:
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preparing a first substrate on which light emitting elements, a thin film encapsulation layer and connecting pads are formed; preparing a second substrate on which a touch sensor layer including sensing electrodes and sensing lines and sensing pads electrically connected to the sensing electrodes through the sensing lines are formed; applying an interlayer to the thin film encapsulation layer or the touch sensor layer to cover an edge of the thin film encapsulation layer; applying a conductive member to the connecting pads or the sensing pads; reversing the second substrate such that the touch sensor layer faces the thin film encapsulation layer; and bonding the first substrate to the second substrate through the interlayer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification