Radiation-emitting semiconductor device

• US 10,312,416 B2
• Filed: 04/04/2016
• Issued: 06/04/2019
• Est. Priority Date: 03/24/2010
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Wittmann, Michael
• Primary Examiner(s): Tran, Trang Q
• Application Number:
  US15/090,028
• Publication Number:
  US 20160218253A1
• Time in Patent Office: 1,156 Days
• CPC Class Codes: H01L 2224/48097 the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.

Claims

1. A radiation-emitting semiconductor device comprising:

a housing body having a chip mounting area;

a chip connection region;

a radiation-emitting semiconductor chip; and

a light-absorbing material, wherein

the radiation-emitting semiconductor chip is fixed to the chip connection region,

the chip connection region is covered with the light-absorbing material at first selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip,

the radiation-emitting semiconductor chip is free of the light-absorbing material in second selected locations,

the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged,

the chip mounting area is a surface of the housing body which abuts the cavity, and

the chip mounting area is free of the light-absorbing material at third selected locations remote from the chip connection region.

2. The device according to claim 1, wherein a wire connection region is arranged at the chip mounting area.

3. The device according to claim 1, wherein the chip mounting area is formed with the same color as, or in a similar color to, the light absorbing material.

4. The device according to claim 1, further comprising a light-transmissive potting material, wherein the potting material is substantially free of the light-absorbing material, and the potting material adjoins the radiation-emitting semiconductor chip and the light-absorbing material in the second selected locations.

5. The device according to claim 4, wherein the potting material abuts the chip mounting area in the second selected locations.

6. The device according to claim 4, wherein the potting material is transparent.

7. The device according to claim 4, wherein the potting material is filled with a phosphor and/or a diffuser.

8. The device according to claim 1, wherein the housing body and the light-absorbing material are the same color.

9. The device according to claim 2, wherein the chip connection region and the wire connection region are formed with a metal.

10. The device according to claim 9, wherein the light-absorbing material inhibits migration and/or oxidation and/or corrosion of the metal.

11. The device according to claim 1, wherein the light-absorbing material comprises a silicone into which light-absorbing particles are introduced.

12. A display apparatus comprising at least one pixel formed at least partly by the device according to claim 1.

13. A method of producing the device according to claim 1 comprising applying the light-absorbing material by a jet process.

15. The device according to claim 1, wherein at least 50% of the chip mounting area is free of the light-absorbing material.

16. The device according to claim 1, wherein the light-absorbing material reflects or reemits at most 25% of light that impinges on an outer area of the light-absorbing material.

14. A radiation-emitting semiconductor device comprising:

a housing body having a chip mounting area;

a wire connection region arranged at the chip mounting area;

a wire electrically conductively connecting the wire connection region to the radiation-emitting semiconductor chip;

a chip connection region;

a radiation-emitting semiconductor chip; and

a light-absorbing material, wherein

the radiation-emitting semiconductor chip is fixed to the chip connection region,

the wire connection region is covered with the light-absorbing material at the first selected locations at which it is not covered by the wire,

the chip connection region is covered with the light-absorbing material at first selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip,

the radiation-emitting semiconductor chip is free of the light-absorbing material in second selected locations,

the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged,

the chip mounting area is a surface of the housing body which abuts the cavity, and

the chip mounting area is free of the light-absorbing material at third selected locations remote from the chip connection region.