Magnetoelectric macro fiber composite fabricated using low temperature transient liquid phase bonding
First Claim
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1. A magnetoelectric composite material comprised of:
- a layer of piezoelectric (PE) material;
a layer of magnetostrictive (MS) material;
the layer of piezoelectric material bonded to the layer of magnetostrictive material using low temperature transient liquid phase (LTTLP) bonding, forming a composite material;
the LTTLP bond comprised of;
titanium, gold, and a solder alloy;
the titanium used to form an adhesion layer on the PE material and the MS material;
the gold used to form a bonding layer on the PE material and the MS material; and
the solder alloy used to bond the PE material and MS material together by diffusing into the bonding layers;
the composite material divided into multiple fibers;
a flexible circuit;
the flexible circuit applied to the composite material;
an epoxy spin coating applied to the combination of the flexible circuit and composite material;
wherein the solder alloy has a melting point at or below a Curie temperature of the PE material and at or below a Curie temperature of the MS material.
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Abstract
A composite material fabricated using a novel process and materials. The piezoelectric and magnetostrictive layers of the composite material are coated, layered, and bonded using a process known as LTTLP bonding. The resulting magnetoelectric composite fibers are bonded to a polyimide film based copper flexible circuit using a room temperature curing epoxy. The sensor that results is an MEMFC that outperforms conventionally fabricated MEMFCs.
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Citations
12 Claims
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1. A magnetoelectric composite material comprised of:
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a layer of piezoelectric (PE) material; a layer of magnetostrictive (MS) material; the layer of piezoelectric material bonded to the layer of magnetostrictive material using low temperature transient liquid phase (LTTLP) bonding, forming a composite material; the LTTLP bond comprised of; titanium, gold, and a solder alloy;
the titanium used to form an adhesion layer on the PE material and the MS material;
the gold used to form a bonding layer on the PE material and the MS material; and
the solder alloy used to bond the PE material and MS material together by diffusing into the bonding layers;the composite material divided into multiple fibers; a flexible circuit; the flexible circuit applied to the composite material; an epoxy spin coating applied to the combination of the flexible circuit and composite material; wherein the solder alloy has a melting point at or below a Curie temperature of the PE material and at or below a Curie temperature of the MS material. - View Dependent Claims (2, 3)
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4. A method of fabricating a composite material with piezoelectric (PE) and magnetostrictive (MS) layers, the method comprising:
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creating a PE adhesion layer by coating one side of a piezoelectric material with a layer of a first metal; creating an MS adhesion layer by coating one side of a magnetostrictive material with a layer of the first metal; creating a PE bonding layer by coating the PE adhesion layer with a layer of a second metal; creating a MS bonding layer by coating the MS adhesion layer with a layer of the second metal; creating an PE solder layer by depositing solder alloy on the PE bonding layer; creating a MS solder layer by depositing solder alloy on the MS bonding layer; pressing the PE solder layer and MS solder layer against one-another while heating to a temperature; the temperature no greater than a Curie temperature of the magnetostrictive material; thereby bonding the PE and MS materials to each other, resulting in the composite materials; slicing the composite material into fibers; applying a flexible circuit to the composite material; spin coating the composite material and flexible circuit with epoxy; and vacuum bonding the composite material and flexible circuit. - View Dependent Claims (5, 6, 7)
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8. A composite material fabricated by the process of:
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coating a piezoelectric (PE) material with one or more layers of metal; coating a magnetostrictive (MS) material with one more layers of metal; creating a first solder layer by depositing solder alloy on the one or more layers of metal of the PE material; creating a second solder layer by depositing solder alloy on the one or more layers of metal of the MS material; pressing the first solder layer and second solder layer together while applying heat, thereby bonding the PE and ME materials to each other, resulting in a magnetoelectric composite materials; slicing the magnetoelectric composite material into fibers; applying a flexible circuit to the magnetoelectric composite material; spin coating the magnetoelectric composite fibers and flexible circuit with epoxy; and vacuum bonding the magnetoelectric composite material and flexible circuit; thereby creating an MEMFC. - View Dependent Claims (9, 10, 11, 12)
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Specification