Transfer for application to a surface

• US 10,315,402 B2
• Filed: 12/20/2016
• Issued: 06/11/2019
• Est. Priority Date: 11/02/2016
• Status: Active Grant

• Current Assignee: Conductive Transfers Limited
• Original Assignee: Conductive Transfers Limited
• Inventors: Brook, Paul Timothy, Bungay, Raymond, Revitt, Melvyn
• Primary Examiner(s): Sengupta, Sonya M
• Application Number:
  US15/384,566
• Publication Number:
  US 20180117895A1
• Time in Patent Office: 903 Days
• Field of Search: 15624412, 156249, 156277, 156298, 427152
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: B41M 3/12 Transfer pictures or the like, e.g. decalcomanias processes for producing decorative surface effects B44C1/00; B41M5/0256 takes precedence
• CPC Class Codes: B44C 1/1733 Decalcomanias applied under pressure only, e.g. provided with a pressure sensitive adhesive
• CPC Class Codes: D06C 15/00 Calendering, pressing, ironing, glossing or glazing textile fabrics for making patterns or designs D06C23/00
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: Y10T 156/109 Embedding of laminae within face of additional laminae

Abstract

A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.

Claims

1. A conductive transfer for application to a surface, comprising:

a first non-conductive printed ink layer and a second non-conductive printed ink layer;

an electrically conductive printed ink layer positioned between said first non-conductive printed ink layer and said second non-conductive printed ink layer, said electrically conductive printed ink layer forming part of an electrical circuit; and

an adhesive layer for adhering said conductive transfer to a surface;

wherein

said first non-conductive printed ink layer comprises separate portions over a given cross-section of said first non-conductive printed ink layer which produce an opening in said first non-conductive printed ink layer; and

said electrically conductive printed ink layer is encapsulated by said first non-conductive printed ink layer and said second non-conductive printed ink layer over a first area produced by said separate portions and exposed at said opening to provide an electrical contact point in a second area to enable a connection to be made to said electrical circuit.

2. A conductive transfer according to claim 1, wherein said first non-conductive printed ink layer is printed onto a substrate.

3. A conductive transfer according to claim 2, wherein said substrate is removable from said first non-conductive printed ink layer following an application of heat.

4. A conductive transfer according to claim 2, wherein said substrate is removable from said first non-conductive printed ink layer following an application of pressure.

5. A conductive transfer according to claim 1, wherein said first non-conductive printed ink layer and said second non-conductive printed ink layer each comprise any one of the following:

a water-based printing ink;

an ultraviolet cured printing ink;

a solvent based ink;

a latex printing ink.

6. A conductive transfer according to claim 1, wherein said adhesive layer comprises any one of the following:

a water-based adhesive;

a solvent based adhesive;

a printable adhesive;

a powder adhesive.

7. A conductive transfer according to claim 1, wherein said electrically conductive printed ink layer comprises a geometric waveform.

8. A surface comprising the conductive transfer of claim 1.

9. A surface according to claim 8, wherein said surface comprises part of a wearable item.

16. A conductive transfer according to claim 1, further comprising an electronic device.

17. A surface according to claim 9, wherein said conductive transfer is configured to monitor the heart rate, blood pressure or other vital function of a patient.

10. A method of producing a conductive transfer for application to a surface, comprising the steps of:

printing a non-conductive ink onto a substrate to produce a first non-conductive printed ink layer;

curing said first non-conductive printed ink layer;

printing an electrically conductive ink onto said first non-conductive printed ink layer to produce an electrically conductive printed ink layer forming part of an electrical circuit;

curing said electrically conductive printed ink layer;

printing said non-conductive ink over said electrically conductive printed ink layer to produce a second non-conductive printed ink layer;

curing said second non-conductive printed ink layer;

printing an adhesive material over said second non-conductive ink layer to produce an adhesive layer; and

curing said adhesive layer;

wherein

said step of printing said first non-conductive printed ink layer comprises printing separate portions for a given cross section of said first non-conductive printed ink layer which produce an opening in said first non-conductive printed ink layer;

said steps of printing said non-conductive ink and said electrically conductive ink encapsulates said electrically conductive printed ink layer between said first non-conductive printed ink layer and said second non-conductive printed ink layer over a first area produced by said separate portions; and

said step of printing said non-conductive ink over said electrically conductive printed ink layer creates an exposed second area which provides an electrical contact point to enable a connection to be made to said electrical circuit.

11. A method according to claim 10, wherein said adhesive layer comprises a larger cross sectional area than each of said first non-conductive printed ink layer, said second non-conductive printed ink layer and said electrically conductive printed ink layer.

12. A method according to claim 10, wherein each said step of printing comprises one or more of the following:

screen-printing;

reel-to-reel printing;

dot matrix printing;

laser printing;

cylinder press printing;

ink jet printing;

flexographic printing;

lithographic printing;

offset printing;

digital printing;

gravure printing;

xerographic printing.

13. A method according to claim 10, wherein each said step of curing comprises drying each said layer.

14. A method of applying a conductive transfer to a surface, comprising the steps of:

obtaining a conductive transfer formed by the method of claim 10, said conductive transfer having a first non-conductive printed ink layer, a second non-conductive printed ink layer, and an electrically conductive printed ink layer forming part of an electrical circuit, said electrically conductive printed ink layer being positioned between said first non-conductive printed ink layer and said second non-conductive printed ink layer;

positioning said conductive transfer onto a surface; and

applying at least one of heat or pressure to said conductive transfer such that said conductive transfer adheres to said surface;

wherein

said first non-conductive printed ink layer comprises separate portions over a given cross-section of said first non-conductive printed ink layer which produce an opening in said first non-conductive printed ink layer; and

said electrically conductive printed ink layer is encapsulated by said first non-conductive printed ink layer and said second non-conductive printed ink layer over a first area and exposed to provide an electrical contact point in a second area to enable a connection to be made to said electrical circuit.

15. A method according to claim 14, further comprising the step of:

removing a substrate of said conductive transfer from said first non-conductive printed ink layer.