Robust inertial sensors

• US 10,317,211 B2
• Filed: 12/30/2014
• Issued: 06/11/2019
• Est. Priority Date: 12/30/2013
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Kim, Bongsang, Feyh, Ando, Graham, Andrew, O'Brien, Gary, Baus, Michael, Maier, Ralf, Koc, Mariusz
• Primary Examiner(s): Kwok, Helen C
• Application Number:
  US15/108,414
• Publication Number:
  US 20160327392A1
• Time in Patent Office: 1,624 Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0016 Protection against shocks or vibrations, e.g. vibration damping
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings
• CPC Class Codes: G01D 5/241 by relative movement of capacitor electrodes
• CPC Class Codes: G01P 1/003 used for damping
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/084 the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
• CPC Class Codes: G01P 2015/0882 for providing damping of vibrations
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

Claims

1. A sensor, comprising:

a rigid wafer outer body;

a first cavity located within the rigid wafer outer body;

a first vibration isolating spring supported by the rigid wafer outer body and extending into the first cavity;

a second vibration isolating spring supported by the rigid wafer outer body and extending into the first cavity; and

a first sensor packaging supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

2. The sensor of claim 1, wherein the first sensor packaging includes an encapsulated sensor element located within a second cavity.

3. The sensor of claim 2, wherein:

the first cavity has a first pressure;

the second cavity has a second pressure; and

the first pressure is a different pressure from the second pressure.

4. The sensor of claim 2, further comprising:

a second sensor packaging directly supported by the rigid wafer outer body.

5. The sensor of claim 2, further comprising:

a second sensor packaging supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

6. The sensor of claim 2, wherein:

the first vibration isolating spring has a first spring constant;

the second vibration isolating spring has a second spring constant; and

the first spring constant is different from the second spring constant.

7. The sensor of claim 2, further comprising:

at least one anchor; and

at least one third spring extending from the at least one anchor and supporting the rigid wafer outer body, the at least one third spring integrally formed with the at least one anchor and the rigid wafer outer body.

8. The sensor of claim 2, wherein:

the rigid wafer outer body includes a first portion of a silicon dioxide layer; and

a second portion of the silicon dioxide layer is located at a bottom portion of the first sensor packaging.

9. The sensor of claim 2, further comprising:

at least one interconnect extending from the first sensor packaging into the rigid wafer outer body and supported by the first vibration isolating spring.

10. The sensor of claim 9, wherein the at least one interconnect is embedded within the first vibration isolating spring.

11. The senor of claim 2, wherein the encapsulated sensor element is formed from a middle device layer, the first sensor packaging further including:

a lower device layer directly beneath the encapsulated sensor element, the lower device layer mechanically and electrically isolated from the encapsulated sensor element; and

an upper device layer directly above the encapsulated sensor element, the upper device layer mechanically and electrically isolated from the encapsulated sensor element.