Conditions for burn-in of high power semiconductors
First Claim
1. A method of testing a plurality of III-N devices each comprising a source, a gate, and a drain, the method comprising:
- for each device, holding the device at a first temperature less than or equal to 30°
C. for a first period of time while applying a first gate-source voltage lower than a threshold voltage of the device and a first drain-source voltage greater than 0.2 times a breakdown voltage of the device;
for each device, holding the device at a second temperature greater than the first temperature for a second period of time while applying a second gate-source voltage lower than the threshold voltage of the device and a second drain-source voltage greater than 0.2 times the breakdown voltage of the device;
after holding the devices at the first and second temperatures, testing electrical performance of one or more parameters of each of the devices; and
based on results obtained from the testing, rejecting at least one device of the plurality of devices.
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Accused Products
Abstract
Techniques for improving reliability of III-N devices include holding the III-N devices at a first temperature less than or equal to 30° for a first period of time while applying a first gate-source voltage lower than a threshold voltage of the III-N devices and a first drain-source voltage greater than 0.2 times a break down voltage of the III-N devices; and holding the III-N devices at a second temperature greater than the first temperature for a second period of time while applying a second gate-source voltage lower than a threshold voltage of the III-N devices and a second drain-source voltage greater than 0.2 times a breakdown voltage of the III-N devices. After holding the III-N devices at the first and second temperatures, screening the III-N devices based on electrical performance of one or more parameters of the III-N devices.
130 Citations
35 Claims
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1. A method of testing a plurality of III-N devices each comprising a source, a gate, and a drain, the method comprising:
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for each device, holding the device at a first temperature less than or equal to 30°
C. for a first period of time while applying a first gate-source voltage lower than a threshold voltage of the device and a first drain-source voltage greater than 0.2 times a breakdown voltage of the device;for each device, holding the device at a second temperature greater than the first temperature for a second period of time while applying a second gate-source voltage lower than the threshold voltage of the device and a second drain-source voltage greater than 0.2 times the breakdown voltage of the device; after holding the devices at the first and second temperatures, testing electrical performance of one or more parameters of each of the devices; and based on results obtained from the testing, rejecting at least one device of the plurality of devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of assuring quality and reliability of a III-N device, the device including a package, a gate, a source, and a drain, the method comprising:
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for a first period of time, applying a first gate-source voltage below a threshold voltage of the device and applying a positive drain-source voltage; holding the package at a first temperature which is below a median operating temperature range of the device for the first period of time; and after holding the devices at the first temperature, testing electrical performance of one or more parameters of the device; and based on results obtained from the testing, rejecting the device if the performance is not within an acceptable range of one or more of the electrical performance-tested parameters. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of testing a wafer including a plurality of III-N electronic devices each comprising a source, a gate, and a drain, the method comprising:
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holding the wafer at a first temperature less than or equal to 30°
C. for a first period of time while simultaneously applying to a plurality of the devices a first gate-source voltage lower than a threshold voltage of the device and a first drain-source voltage greater than 0.2 times a breakdown voltage of the device;holding the wafer at a second temperature greater than the first temperature for a second period of time while simultaneously applying to a plurality of the devices a second gate-source voltage lower than the threshold voltage of the device and a second drain-source voltage greater than 0.2 times the breakdown voltage of the device; after holding the wafer at the first and second temperatures, testing electrical performance of one or more parameters of each of the devices; and based on results obtained from the testing, rejecting at least one device on the wafer. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30)
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31. A system for testing a plurality of III-N devices, the system comprising:
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a testing chamber and a temperature controller;
whereinthe temperature controller is configured to hold the plurality of devices at a first temperature less than or equal to 30°
C. for a first period of time; andduring the first period of time, the testing chamber is configured to apply a first gate-source voltage lower than a threshold voltage of the device and a first drain-source voltage greater than 0.2 times a breakdown voltage of the device; and the temperature controller is configured to hold the plurality of devices at a second temperature greater than or equal to 30°
C. for a second period of time; andthe during the second period of time, the testing chamber is configured to apply a second gate-source voltage lower than the threshold voltage of the device and a second drain-source voltage greater than 0.2 times the breakdown voltage of the device;
whereinthe first period of time and the second period of time is greater than 1 hour.
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32. A method of testing a plurality of III-N devices each comprising a source, a gate, and a drain, the method comprising:
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for each device, holding the device at a first temperature for a first period of time while applying a first gate-source voltage lower than a threshold voltage of the device and a first drain-source voltage greater than 0.2 times a breakdown voltage of the device; for each device, holding the device at a second temperature for a second period of time while applying a second gate-source voltage lower than the threshold voltage of the device and a second drain-source voltage greater than 0.2 times the breakdown voltage of the device, wherein the second temperature is smaller than the first temperature and smaller than 30°
C.;after holding the devices at the first and second temperatures, testing electrical performance of one or more parameters of each of the devices; and based on results obtained from the testing, rejecting at least one device of the plurality of devices. - View Dependent Claims (33, 34, 35)
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Specification