Optical emission spectroscopy (OES) for remote plasma monitoring

• US 10,319,649 B2
• Filed: 04/11/2017
• Issued: 06/11/2019
• Est. Priority Date: 04/11/2017
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Cho, Tae Seung, Park, Soonam, Kim, Junghoon, Lubomirsky, Dmitry, Venkataraman, Shankar
• Primary Examiner(s): Deo, Duy Vu N
• Application Number:
  US15/484,985
• Publication Number:
  US 20180294198A1
• Time in Patent Office: 791 Days
• CPC Class Codes: G01J 3/0218 using optical fibers
• CPC Class Codes: G01J 3/443 Emission spectrometry
• CPC Class Codes: G01N 21/73 using plasma burners or torches
• CPC Class Codes: G01N 2201/08 Optical fibres; light guides
• CPC Class Codes: G01N 2201/0833 Fibre array at detector, resolving
• CPC Class Codes: H01J 2237/3341 Reactive etching
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32568 Relative arrangement or disposition of electrodes; moving means
• CPC Class Codes: H01J 37/32743 for introducing the material into processing chamber
• CPC Class Codes: H01J 37/32972 Spectral analysis
• CPC Class Codes: H01J 37/3411 Constructional aspects of the reactor
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

Methods and systems for etching substrates using a remote plasma are described. Remotely excited etchants are formed in a remote plasma and flowed through a showerhead into a substrate processing region to etch the substrate. Optical emission spectra are acquired from the substrate processing region just above the substrate. The optical emission spectra may be used to determine an endpoint of the etch, determine the etch rate or otherwise characterize the etch process. A weak plasma may be present in the substrate processing region. The weak plasma may have much lower intensity than the remote plasma. In cases where no bias plasma is used above the substrate in an etch process, a weak plasma may be ignited near a viewport disposed near the side of the substrate processing region to characterize the etchants.

Claims

1. A method of etching a substrate, the method comprising:

placing the substrate in a substrate processing region of a substrate processing chamber;

flowing a fluorine-containing precursor into a remote plasma region separated from the substrate processing region by a showerhead;

forming a remote plasma having a remote plasma power in the remote plasma region;

producing plasma effluents from the fluorine-containing precursor in the remote plasma in the remote plasma region;

flowing the plasma effluents through the showerhead into the substrate processing region;

etching the substrate with the plasma effluents;

forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the remote plasma power of the remote plasma exceeds the local plasma power of the local plasma by a factor of ten or more;

acquiring an optical emission spectrum through a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein the optical emission spectrum represents intensity as a function of optical wavelength, and wherein the optical emission spectrum is acquired with an optical emission spectrometer;

determining a fluorine signal from the optical emission spectrum; and

determining an etch rate of the substrate based on the fluorine signal, wherein the fluorine signal is linearly correlated with the etch rate of the substrate.

2. The method of claim 1, wherein the local plasma is centered over the substrate.

3. The method of claim 1, wherein the local plasma is disposed above the substrate and outside an edge of the substrate near the viewport.

4. The method of claim 3, wherein the local plasma is formed using an electrode that is different from electrodes used for forming the remote plasma and that is disposed on the outside of the viewport, and wherein the local plasma power is applied between the electrode and the substrate processing chamber.

5. The method of claim 3, wherein the local plasma is formed using a first electrode and a second electrode that are different from electrodes used for forming the remote plasma, wherein the first electrode and the second electrode are each disposed on the outside of the viewport, and wherein the local plasma power is applied between the first electrode and the second electrode.

6. The method of claim 1, wherein the local plasma is formed outside a radial edge of the substrate and proximate the viewport, and wherein a region that is within the substrate processing region and above the substrate is plasma free.

7. The method of claim 1, further comprising etching the substrate with the local plasma, wherein the local plasma is a bias plasma.

8. A method of etching a substrate, the method comprising:

placing the substrate in a substrate processing region of a substrate processing chamber;

flowing a fluorine-containing precursor into a remote plasma region separated from the substrate processing region by a showerhead;

forming a remote plasma having a remote plasma power in the remote plasma region;

producing plasma effluents from the fluorine-containing precursor in the remote plasma in the remote plasma region;

flowing the plasma effluents through the showerhead into the substrate processing region;

etching the substrate with the plasma effluents, wherein an electron temperature within the substrate processing region is less than 0.5 eV while etching the substrate;

forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the remote plasma power of the remote plasma exceeds the local plasma power of the local plasma by a factor of ten or more;

acquiring an optical emission spectrum through a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein the optical emission spectrum represents intensity as a function of optical wavelength and the optical emission spectrum is acquired with an optical emission spectrometer;

determining at least one signal from the optical emission spectrum; and

determining an etch rate of the substrate based on the at least one signal, wherein the at least one signal is linearly correlated with the etch rate of the substrate.

9. The method of claim 8, wherein a pressure in the substrate processing region and in the remote plasma region while etching the substrate is between 0.01 Torr and 50 Torr.

10. The method of claim 8, wherein a temperature of the substrate while etching the substrate is between −

20°

C. and 450°

C.

11. The method of claim 8, wherein the at least one signal comprises a fluorine signal from the optical emission spectrum.

12. The method of claim 8, wherein the at least one signal comprises a fluorine signal representing a concentration of excited fluorine from both the remote plasma and the local plasma.

13. The method of claim 8, further comprising passing an electron beam above the substrate.

14. The method of claim 8, further comprising passing an electron beam as a laminar sheet above the substrate.

15. A method of etching a substrate, the method comprising:

flowing a fluorine-containing precursor into a remote plasma region of a substrate processing chamber;

forming a remote plasma having a remote plasma power in the remote plasma region to produce plasma effluents;

flowing the plasma effluents into a substrate processing region separated from the remote plasma region by a showerhead, wherein the substrate is housed in the substrate processing region;

etching the substrate with the plasma effluents;

forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the local plasma is formed outside a radial edge of the substrate and proximate a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein a region that is within the substrate processing region and above the substrate is plasma free;

acquiring an optical emission spectrum through the viewport;

determining at least one signal from the optical emission spectrum; and

determining an etch rate of the substrate based on the at least one signal, wherein the at least one signal is linearly correlated with the etch rate of the substrate.

16. The method of claim 15, wherein the remote plasma power of the remote plasma exceeds the local plasma power of the local plasma by a factor of ten or more.

17. The method of claim 15, wherein the at least one signal comprises a fluorine signal.

18. The method of claim 15, further comprising passing an electron beam as a laminar sheet above the substrate in the substrate processing region, and wherein an electron temperature within the substrate processing region is less than 0.5 eV while etching the substrate.