Optical emission spectroscopy (OES) for remote plasma monitoring
First Claim
1. A method of etching a substrate, the method comprising:
- placing the substrate in a substrate processing region of a substrate processing chamber;
flowing a fluorine-containing precursor into a remote plasma region separated from the substrate processing region by a showerhead;
forming a remote plasma having a remote plasma power in the remote plasma region;
producing plasma effluents from the fluorine-containing precursor in the remote plasma in the remote plasma region;
flowing the plasma effluents through the showerhead into the substrate processing region;
etching the substrate with the plasma effluents;
forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the remote plasma power of the remote plasma exceeds the local plasma power of the local plasma by a factor of ten or more;
acquiring an optical emission spectrum through a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein the optical emission spectrum represents intensity as a function of optical wavelength, and wherein the optical emission spectrum is acquired with an optical emission spectrometer;
determining a fluorine signal from the optical emission spectrum; and
determining an etch rate of the substrate based on the fluorine signal, wherein the fluorine signal is linearly correlated with the etch rate of the substrate.
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Abstract
Methods and systems for etching substrates using a remote plasma are described. Remotely excited etchants are formed in a remote plasma and flowed through a showerhead into a substrate processing region to etch the substrate. Optical emission spectra are acquired from the substrate processing region just above the substrate. The optical emission spectra may be used to determine an endpoint of the etch, determine the etch rate or otherwise characterize the etch process. A weak plasma may be present in the substrate processing region. The weak plasma may have much lower intensity than the remote plasma. In cases where no bias plasma is used above the substrate in an etch process, a weak plasma may be ignited near a viewport disposed near the side of the substrate processing region to characterize the etchants.
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Citations
18 Claims
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1. A method of etching a substrate, the method comprising:
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placing the substrate in a substrate processing region of a substrate processing chamber; flowing a fluorine-containing precursor into a remote plasma region separated from the substrate processing region by a showerhead; forming a remote plasma having a remote plasma power in the remote plasma region; producing plasma effluents from the fluorine-containing precursor in the remote plasma in the remote plasma region; flowing the plasma effluents through the showerhead into the substrate processing region; etching the substrate with the plasma effluents; forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the remote plasma power of the remote plasma exceeds the local plasma power of the local plasma by a factor of ten or more; acquiring an optical emission spectrum through a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein the optical emission spectrum represents intensity as a function of optical wavelength, and wherein the optical emission spectrum is acquired with an optical emission spectrometer; determining a fluorine signal from the optical emission spectrum; and determining an etch rate of the substrate based on the fluorine signal, wherein the fluorine signal is linearly correlated with the etch rate of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of etching a substrate, the method comprising:
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placing the substrate in a substrate processing region of a substrate processing chamber; flowing a fluorine-containing precursor into a remote plasma region separated from the substrate processing region by a showerhead; forming a remote plasma having a remote plasma power in the remote plasma region; producing plasma effluents from the fluorine-containing precursor in the remote plasma in the remote plasma region; flowing the plasma effluents through the showerhead into the substrate processing region; etching the substrate with the plasma effluents, wherein an electron temperature within the substrate processing region is less than 0.5 eV while etching the substrate; forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the remote plasma power of the remote plasma exceeds the local plasma power of the local plasma by a factor of ten or more; acquiring an optical emission spectrum through a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein the optical emission spectrum represents intensity as a function of optical wavelength and the optical emission spectrum is acquired with an optical emission spectrometer; determining at least one signal from the optical emission spectrum; and determining an etch rate of the substrate based on the at least one signal, wherein the at least one signal is linearly correlated with the etch rate of the substrate. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of etching a substrate, the method comprising:
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flowing a fluorine-containing precursor into a remote plasma region of a substrate processing chamber; forming a remote plasma having a remote plasma power in the remote plasma region to produce plasma effluents; flowing the plasma effluents into a substrate processing region separated from the remote plasma region by a showerhead, wherein the substrate is housed in the substrate processing region; etching the substrate with the plasma effluents; forming a local plasma having a local plasma power in the substrate processing region while maintaining the remote plasma and etching the substrate, wherein the local plasma is formed outside a radial edge of the substrate and proximate a viewport affixed to a side of the substrate processing chamber and forming a border of the substrate processing region, wherein a region that is within the substrate processing region and above the substrate is plasma free; acquiring an optical emission spectrum through the viewport; determining at least one signal from the optical emission spectrum; and determining an etch rate of the substrate based on the at least one signal, wherein the at least one signal is linearly correlated with the etch rate of the substrate. - View Dependent Claims (16, 17, 18)
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Specification