Cooler and cooler fixing method

• US 10,319,665 B2
• Filed: 04/23/2015
• Issued: 06/11/2019
• Est. Priority Date: 06/19/2014
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Maruyama, Ryo
• Primary Examiner(s): Schermerhorn, Jr., Jon T.
• Application Number:
  US15/108,275
• Publication Number:
  US 20160307821A1
• Time in Patent Office: 1,510 Days
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10272 : Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/14252 : Voltage converter
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.

Claims

1. A cooler for cooling a semiconductor module, the cooler being securable to a base, and the cooler comprising:

a cooler body that comprises a refrigerant flow path defined by (i) a first wall part having a first through-hole, (ii) a second wall part that is arranged facing the first wall part and that comprises a connection region which is connectable to the base at a position opposing the first through-hole, the connection region of the second wall part having a second through-hole, and a maximum inner diameter of the first through hole being greater than a maximum inner diameter of the second through-hole, and (iii) a side wall part for connecting a periphery of the first wall part and a periphery of the second wall part; and

a lid for closing off the first through-hole.

2. The cooler according to claim 1, wherein the cooler further comprises a securing member small enough to be capable of passing through the first through-hole, the securing member being inserted through the second through-hole to secure the cooler body to the base.

3. The cooler according to claim 2, wherein an inner diameter of a refrigerant-flow-path-side of the second through-hole is greater than an inner diameter of a base-side of the second through-hole.

4. The cooler according to claim 3, wherein:

the securing member comprises a screw having a head part and a screw part; and

the refrigerant-flow-path side of the second through-hole comprises a groove which accommodates the head part of the screw such that the head part does not protrude into the refrigerant flow path.

5. The cooler according to claim 4, further comprising a seal member between the second through-hole and the securing member.

6. The cooler according to claim 3, further comprising a seal member between the second through-hole and the securing member.

7. The cooler according to claim 2, further comprising a seal member between the second through-hole and the securing member.

8. The cooler according to claim 1, wherein a wall part is provided in the connection region of the second wall part such that a wall thickness of the wall part is less than a wall thickness in other regions of the second wall part.

9. The cooler according to claim 1, wherein a plurality of fins are connected so as not to block the first through-hole on a refrigerant-flow-path side of the first wall part.

10. The cooler according to claim 1, wherein the lid is detachable from the first wall part.

11. The cooler according to claim 1, wherein the lid, when fully received in the first through-hole, does not to protrude from a refrigerant-flow-path side of the first wall part into the refrigerant flow path.

12. The cooler according to claim 1, wherein:

the semiconductor module is securable to an outer side of the first wall part; and

a thickness of the first wall part is less than a thickness of the second wall part.