Light bulb

• US 10,319,703 B2
• Filed: 08/23/2018
• Issued: 06/11/2019
• Est. Priority Date: 08/15/2012
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Hsieh, Min Hsun
• Primary Examiner(s): Miller, Jami Valentine
• Application Number:
  US16/110,293
• Publication Number:
  US 20180366452A1
• Time in Patent Office: 292 Days
• Field of Search: 257 88
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21W 2121/00 Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device of an embodiment of the present application comprises light-emitting units; a transparent structure having cavities configured to accommodate at least one of the light-emitting units; and a conductive element connecting at least two of the light-emitting units.

Claims

1. A light bulb, comprising:

a first optoelectronic unit and a second optoelectronic unit, each optoelectronic unit comprising;

a light-emitting structure comprising a side surface, a first semiconductor layer, a second semiconductor layer, and a light-emitting layer formed between the first semiconductor layer and the second semiconductor layer; and

a first bonding pad and a second bonding pad formed on the first semiconductor layer;

a conductive element connecting the first bonding pad of the first optoelectronic unit and the second bonding pad of the second optoelectronic unit, without covering the side surfaces of the first optoelectronic unit and the second optoelectronic unit;

a transparent structure, pervious to light from the light-emitting structure, and continuously covering the light-emitting structures and the conductive element, and having a curved surface;

a first terminal and a second terminal electrically connecting the first optoelectronic unit and the second optoelectronic unit, and formed on a same side of the transparent structure; and

a cover covering the first optoelectronic unit, the second optoelectronic unit, the conductive element, and the transparent structure.

2. The light bulb of claim 1, wherein the transparent structure can be bent into a curved shape.

3. The light bulb of claim 1, further comprising a wavelength converting material in the transparent structure.

4. The light bulb of claim 1, wherein the transparent structure has a plurality of the cavities accommodating the first optoelectronic unit and the second optoelectronic unit, and a portion of the conductive element is located on the transparent structure and between two of the plurality of the cavities.

5. The light bulb of claim 1, wherein the first terminal is arranged on an end of the transparent structure.

6. The light bulb of claim 1, wherein the first optoelectronic unit and the second optoelectronic unit are arranged in a dispersive type.

7. The light bulb of claim 1, wherein long sides of the first optoelectronic unit and the second optoelectronic unit are not arranged in a line.

8. The light bulb of claim 7, wherein short sides of the first optoelectronic unit and the second optoelectronic unit are not arranged in a line.

9. The light bulb of claim 1, wherein the transparent structure has a melting point higher than an operation temperature of the first optoelectronic unit.

10. The light bulb of claim 1, wherein the transparent structure can be bent into a 3-dimention shape.

11. The light bulb of claim 1, wherein the transparent structure directly contacts the side surface.

12. The light bulb of claim 1, further comprising a socket couples to the cover.

13. The light bulb of claim 12, wherein the first terminal and the second terminal plug into the socket.

14. The light bulb of claim 12, wherein the transparent structure plugs into the socket.

15. The light bulb of claim 1, wherein the transparent structure has a first portion extending along a first direction, a second portion extending along a second portion, and a third portion extending along a third direction.

16. The light bulb of claim 15, wherein the second direction and the third direction differ from the first direction.

17. The light bulb of claim 1, further comprising a reflective layer formed on the first semiconductor layer.

18. The light bulb of claim 1, wherein the first optoelectronic unit and the second optoelectronic unit are embedded in the transparent structure.

19. The light bulb of claim 1, wherein the first optoelectronic unit and the second optoelectronic unit are connected in series.

20. The light bulb of claim 1, wherein the first optoelectronic unit and the second optoelectronic unit are connected in parallel.