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Microelectronic workpiece processing systems and associated methods of color correction

  • US 10,319,875 B2
  • Filed: 05/05/2014
  • Issued: 06/11/2019
  • Est. Priority Date: 03/02/2010
  • Status: Active Grant
First Claim
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1. A system for processing a semiconductor substrate, comprising:

  • a substrate support configured to individually carry a microelectronic workpiece containing a plurality of light emitting diodes (LEDs);

    a container holding a phosphor;

    an injector operatively coupled to the container, the injector being configured to introduce a volume of the phosphor onto the plurality of LEDs of the microelectronic workpiece; and

    a controller operatively coupled to the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising;

    receiving a base emission characteristic of the plurality of LEDs of the microelectronic workpiece;

    adjusting a characteristic of the phosphor based on a previously-performed measurement that generates a plurality of points in a chromaticity plot of the received base emission characteristic of the plurality of LEDs, and wherein each of the plurality of points is indicative of a set of parameters associated with the phosphor and the plurality of LEDs, and wherein the plurality of points together define a rectangular distribution area; and

    introducing the phosphor with the adjusted characteristic onto the plurality of LEDs.

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