Antenna carrier intended for being built into an electronic document

• US 10,320,066 B2
• Filed: 06/30/2015
• Issued: 06/11/2019
• Est. Priority Date: 07/01/2014
• Status: Active Grant

• Current Assignee: IDEMIA France (Advent International Corporation)
• Original Assignee: IDEMIA France (Advent International Corporation)
• Inventors: Gragnic, Elodie, Bosquet, Olivier
• Primary Examiner(s): Estrada, Angel R
• Application Number:
  US15/322,592
• Publication Number:
  US 20170155189A1
• Time in Patent Office: 1,442 Days
• Field of Search: 174153 A, 174137, 174138 R, 174152 A, 174255, 361736, 361737, 361748, 361749, 235492
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

Disclosed is an antenna support for incorporating in an electronic document. The support can include a first substrate made of a plastics material that is defined by first and second opposite faces, which define between them a thickness of the substrate. The antenna can include one or more turn that extends between two ends, and the antenna can be formed by a wire that is inlaid in the thickness of the first substrate from the first face, such that each of the two ends presents a zigzag shape formed by at least two rectilinear portions and by two bends. The bends can be inlaid more deeply than the rectilinear portions in the thickness of the first substrate from the first face.

Claims

1. An antenna support for incorporating in an electronic document, the support comprising:

a first substrate made of plastics material, being defined by a first face and a second face that is opposite the first face, defining therebetween a thickness of the first substrate; and

an antenna comprising at least one turn that extends between two ends, the antenna being formed by a wire that is inlaid in the thickness of the first substrate from the first face, each of the two ends presenting a zigzag shape formed by at least two rectilinear portions and by two bends;

wherein the two bends are inlaid more deeply than the two rectilinear portions in the thickness of the first substrate from the first face.

2. An antenna support according to claim 1, wherein the two bends are inlaid to a depth of not less than 20 μ

m relative to the at least two rectilinear portions.

3. An electronic document comprising:

an antenna support according to claim 1, wherein the antenna support further comprises;

a second substrate assembled to the first substrate such that the antenna is trapped between the first substrate and the second substrate;

an cavity including a bottom in which at least a machined section of a rectilinear portion of the two ends of the antenna are apparent;

an electrical connection covering at least part of the machined section of the rectilinear portion of the two ends of the antenna; and

a microcircuit module that is inserted and fastened in the cavity and that is in electrical contact with the machined section via the electrical connection.

4. An electronic document according to claim 3, wherein the electrical connection comprise an anisotropic adhesive covering the machined section of the rectilinear portion.

5. An electronic document according to claim 3, wherein the cavity is formed by a first spot face and a secondary spot face made in the first spot face, the machined section being apparent in the bottom of the first spot face.

6. A fabrication method for fabricating an electronic document according to claim 3, the method comprising:

fabricating an antenna support, the antenna support comprising;

a first substrate made of plastics material, being defined by a first face and a second face that is opposite the first face, defining therebetween a thickness of the first substrate; and

an antenna comprising at least one turn that extends between two ends, the antenna being formed by a wire that is inlaid in the thickness of the first substrate from the first face, each of the two ends presenting a zigzag shape formed by at least two rectilinear portions and by two bends;

wherein the two bends are inlaid more deeply than the two rectilinear portions in the thickness of the first substrate from the first face; and

wherein the antenna is inlaid in the first substrate by means of a tool adapted to dispense and inlay the wire;

assembling the second substrate to the first substrate using a lamination step;

machining the cavity to a depth such that the machined section of the rectilinear portion is apparent in the bottom of the cavity; and

placing the microcircuit module in the cavity and making an electrical connection between the microcircuit module and the two ends of the antenna.

7. A fabrication method for fabricating an electronic document according to claim 6, wherein the machining is performed in such a manner that the machined section of the rectilinear portion presents a width lying in the range 0.4 times to 0.6 times the diameter of the wire.

8. A fabrication method according to claim 6 further comprising:

depositing an anisotropic adhesive between the microcircuit module and the bottom of the cavity prior to the step of placing the microcircuit module; and

pressing the microcircuit module into the cavity in order to bond the microcircuit module in the cavity and activate the electrical connection.

9. A fabrication method for fabricating an antenna support according to claim 1, comprising:

inlaying the antenna in the first substrate by means of a tool adapted to dispense and inlay the wire.

10. A fabrication method according to claim 9, further comprising:

moving the tool at a speed relative to the first substrate such that the speed at which the two bends are laid is no more than 0.75 times the speed at which the at least two rectilinear portions are laid.

11. A fabrication method according to claim 9, wherein the tool exerts a bearing force against the first substrate, the bearing force applied for laying the two bends being not less than 1.25 times the bearing force applied for laying the at least two rectilinear portions.

12. A fabrication method according to claim 9, wherein the tool dispenses and inlays the wire by ultrasound at a determined frequency, the determined frequency applied for laying the two bends being not less than 1.25 times the determined frequency applied for laying the at least two rectilinear portions.

13. A method of fabricating an antenna support according to claim 9, wherein the at least two rectilinear portions are spaced apart from one another at a gap of not less than the diameter of the wire.