Method of manufacturing elastic wave device
First Claim
1. A method for manufacturing an elastic wave device comprising:
- a step of forming a plurality of functional element units and a connection line that electrically connects the plurality of functional element units on one principal surface of a motherboard having piezoelectricity;
a step of forming a support layer made of resin that encloses the functional element units on the one principal surface of the motherboard; and
a step of obtaining an elastic wave device having the functional element units by a step of dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line;
whereinthe connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected;
the line main body and the connection unit are both formed in the step of forming the plurality of functional element units and the connection line;
the step of dividing the multilayer body includes a step of dicing the multilayer body along the dicing line such that electrical connection between the connection unit and the line main body is broken;
the connection unit is electrically connected to the line main body and the functional element units before the step of dicing the multilayer body; and
the method further including a step of forming a retaining member made of resin which straddles the line main body in a width direction of the line main body and is separate from the support layer on the motherboard prior to dividing the multilayer body.
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Accused Products
Abstract
Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.
7 Citations
12 Claims
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1. A method for manufacturing an elastic wave device comprising:
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a step of forming a plurality of functional element units and a connection line that electrically connects the plurality of functional element units on one principal surface of a motherboard having piezoelectricity; a step of forming a support layer made of resin that encloses the functional element units on the one principal surface of the motherboard; and a step of obtaining an elastic wave device having the functional element units by a step of dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line;
whereinthe connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected; the line main body and the connection unit are both formed in the step of forming the plurality of functional element units and the connection line; the step of dividing the multilayer body includes a step of dicing the multilayer body along the dicing line such that electrical connection between the connection unit and the line main body is broken; the connection unit is electrically connected to the line main body and the functional element units before the step of dicing the multilayer body; and the method further including a step of forming a retaining member made of resin which straddles the line main body in a width direction of the line main body and is separate from the support layer on the motherboard prior to dividing the multilayer body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification