Top port multi-part surface mount MEMS microphone

• US 10,321,226 B2
• Filed: 05/01/2018
• Issued: 06/11/2019
• Est. Priority Date: 11/28/2000
• Status: Expired due to Fees

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony D.
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US15/968,676
• Publication Number:
  US 20180249242A1
• Time in Patent Office: 406 Days
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 3/00 Assembling of devices or systems from individually processed components
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/222 for microphones H04R1/24, H04R1/26 take precedence
• CPC Class Codes: H04R 1/2892 Mountings or supports for transducers
• CPC Class Codes: H04R 19/005 : using semiconductor materials
• CPC Class Codes: H04R 19/016 : for microphones
• CPC Class Codes: H04R 19/04 : Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 : Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 2225/49 : Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
• CPC Class Codes: H04R 23/00 : Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045
• CPC Class Codes: H04R 2410/03 : Reduction of intrinsic noise in microphones
• CPC Class Codes: H04R 3/00 : Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H04R 31/006 : Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003
• CPC Class Codes: Y10T 29/49005 : Acoustic transducer
• CPC Class Codes: Y10T 29/4908 : Acoustic transducer
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device'"'"'s printed circuit board and for making electrical connections between the microphone package and the device'"'"'s circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Claims

1. An acoustic component comprising:

a substantially planar multilayer printed circuit board having first and second electrical interfaces, wherein the second electrical interface enables reflow solder attachment of the acoustic component to a user circuit board, the acoustic component comprising;

a rigid top printed circuit board layer comprising a first non-conductive material layer with a first conductive layer disposed on an upper surface of the first non-conductive material layer, wherein the first conductive layer is patterned to form the first electrical interface comprising a plurality of conductive pads;

a rigid bottom printed circuit board layer comprising a second non-conductive material layer with a second conductive layer disposed on a lower surface of the second non-conductive material layer, wherein the second conductive layer is pattered to form the second electrical interface comprising a plurality of flat solder pads, wherein the top and bottom printed circuit board layers are in facing relation to each other;

a plurality of plated throughholes within the multilayer printed circuit board electrically coupling the plurality of conductive pads of the first interface to the plurality of flat solder pads of the second electrical interface; and

a mounting region disposed along the periphery of the top printed circuit board layer;

a micro-electro-mechanical system (MEMS) microphone die mounted to the upper surface of the top printed circuit board layer and electrically coupled to at least one of the conductive pads in the first electrical interface; and

a single-piece microphone die protection member that includes an acoustic port,

wherein the microphone die protection member is a solid material with a predetermined shape comprising a rectangular top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle, the sidewall portion supporting the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface, the acoustic port disposed in the top portion of the microphone die protection member and passing completely through the microphone die protection member,

wherein the attachment surface of the sidewall portion of the microphone die protection member is aligned with and attached to the mounting region of the top printed circuit board layer, and

wherein the predetermined height of the sidewall portion of the microphone die protection member, the interior sidewall surface of the sidewall portion of the microphone die protection member, and an interior surface of the top portion of the microphone die protection member, in cooperation with the upper surface of the top printed circuit board layer, provide a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.

2. The acoustic component of claim 1, wherein the MEMS microphone die is a pressure-equalizing MEMS microphone die, a diaphragm of the MEMS microphone die defines a front volume and a back volume within the protective enclosure, and the acoustic port disposed in the microphone die protection member is acoustically coupled to the diaphragm.

3. The acoustic component of claim 2, wherein an interface between the attachment surface of the sidewall portion of the microphone die protection member and the upper surface of the top printed circuit board layer is sealed to maintain acoustic pressure within the front volume.

4. The acoustic component of claim 2, wherein the multilayer printed circuit board further comprises a recess located in the top printed circuit board layer, and the MEMS microphone die is positioned over the recess.

5. The acoustic component of claim 2, wherein the multilayer printed circuit board further comprises an internal cavity with an aperture in the top surface of the multilayer printed circuit board, the internal cavity extending longitudinally within the multilayer printed circuit board, the MEMS microphone die positioned over the aperture in the top surface of the multilayer printed circuit board.

6. The acoustic component of claim 1, wherein the first and second non-conductive material layers comprise one or more layers of FR-4 printed circuit board material.

7. The acoustic component of claim 1, wherein the multilayer printed circuit board further comprises:

a third conductive layer disposed on a lower surface of the first non-conductive material layer, wherein the third conductive layer is patterned to form a plurality of first electrodes, the first electrodes being electrically coupled to the first electrical interface via plated throughholes;

a fourth conductive layer disposed on an upper surface of the second non-conductive material layer, wherein the fourth conductive layer is patterned to form a plurality of second electrodes, the second electrodes being electrically coupled to the second electrical interface via plated throughholes; and

a passive electronic material layer disposed between the third and fourth conductive layers and in electrical contact with the first and second electrodes.

8. The acoustic component of claim 7, wherein the passive electronic material layer is a resistive material.

9. The acoustic component of claim 7, wherein the passive electronic material layer is a capacitive dielectric material.

10. The acoustic component of claim 7, wherein a passive electrical element formed in the passive electronic material layer filters one or more of an input signal, an output signal, or input power.

11. An acoustic component comprising:

a substantially planar multilayer printed circuit board having first and second electrical interfaces, wherein the second electrical interface enables reflow solder attachment of the acoustic component to a user circuit board, the acoustic component comprising;

a rigid top printed circuit board layer comprising a first non-conductive material layer with a first conductive layer disposed on an upper surface of the first non-conductive material layer, wherein the first conductive layer is patterned to form the first electrical interface comprising a plurality of conductive pads;

a rigid bottom printed circuit board layer comprising a second non-conductive material layer with a second conductive layer disposed on a lower surface of the second non-conductive material layer, wherein the second conductive layer is pattered to form the second electrical interface comprising a plurality of flat solder pads, wherein the top and bottom printed circuit board layers are in facing relation to each other;

a plurality of plated throughholes within the multilayer printed circuit board electrically coupling the plurality of conductive pads of the first interface to the plurality of flat solder pads of the second electrical interface;

an acoustic port disposed in an interior region of the multilayer printed circuit board and passing completely through the multilayer printed circuit board, wherein one of the plurality of flat solder pads of the second electrical interface is a metal ring that completely surrounds the acoustic port in the multilayer printed circuit board; and

a mounting region disposed along the periphery of the top printed circuit board layer;

a micro-electro-mechanical system (MEMS) microphone die mounted to the upper surface of the top printed circuit board layer and electrically coupled to at least one of the conductive pads of the first electrical interface, the MEMS microphone die being disposed directly over the acoustic port in the multilayer printed circuit board; and

a single-piece microphone die protection member;

wherein the microphone die protection member is a solid material with a predetermined shape comprising a rectangular top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle, the sidewall portion supporting the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface;

wherein the attachment surface of the sidewall portion of the microphone die protection member is aligned with and attached to the mounting region of the top printed circuit board layer; and

wherein the predetermined height of the sidewall portion of the microphone die protection member, the interior sidewall surface of the sidewall portion of the microphone die protection member, and an interior surface of the top portion of the microphone die protection member, in cooperation with the upper surface of the top printed circuit board layer, provide a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.

12. The acoustic component of claim 11, wherein the multilayer printed circuit board further comprises:

a third conductive layer disposed on a lower surface of the first non-conductive material layer, wherein the third conductive layer is patterned to form a plurality of first electrodes, the first electrodes being electrically coupled to the first electrical interface via plated throughholes;

a fourth conductive layer disposed on an upper surface of the second non-conductive material layer, wherein the fourth conductive layer is patterned to form a plurality of second electrodes, the second electrodes being electrically coupled to the second electrical interface via plated throughholes; and

a passive electronic material layer disposed between the third and fourth conductive layers and in electrical contact with the first and second electrodes.

13. The acoustic component of claim 12, wherein the passive electronic material layer is a resistive material.

14. The acoustic component of claim 12, wherein the passive electronic material layer is a capacitive dielectric material.

15. The acoustic component of claim 12, wherein a passive electrical element formed in the passive electronic material layer filters one or more of an input signal, an output signal, or input power.

16. The acoustic component of claim 11, wherein the MEMS microphone die is a pressure-equalizing MEMS microphone die, a diaphragm of the MEMS microphone die defines a front volume and a back volume within the protective enclosure, and the acoustic port disposed in the multilayer printed circuit board is acoustically coupled to the diaphragm.

17. The acoustic component of claim 16, wherein an interface between the attachment surface of the sidewall portion of the microphone die protection member and the upper surface of the top printed circuit board layer is sealed to maintain acoustic pressure within the back volume.

18. The acoustic component of claim 11, wherein the multilayer printed circuit board further comprises an acoustic material that substantially blocks contaminants from passing through the acoustic port.

19. The acoustic component of claim 18, wherein the acoustic material is a film of polymeric material.

20. The acoustic component of claim 18, wherein the acoustic material is hydrophobic.