Interlock features of a portable electronic device

• US 10,321,590 B2
• Filed: 03/09/2017
• Issued: 06/11/2019
• Est. Priority Date: 09/06/2016
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Cater, Tyler B., Pope, Benjamin J., Myers, Scott A., Bustle, Benjamin Shane, Yang, Tseng-Mau, Brinkman, Adam J.
• Primary Examiner(s): Wu, James
• Application Number:
  US15/454,826
• Publication Number:
  US 20180070465A1
• Time in Patent Office: 824 Days
• CPC Class Codes: B29C 37/0082 Mechanical anchoring B29C66/303 takes precedence
• CPC Class Codes: B29C 45/14311 using means for bonding the coating to the articles B29C45/14795 takes precedence
• CPC Class Codes: B29C 45/14467 Joining articles or parts of a single article B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: H01Q 1/24 with receiving set
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/521 reducing the coupling between adjacent antennas
• CPC Class Codes: H04B 1/3827 Portable transceivers
• CPC Class Codes: H04M 1/0202 Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/185 Improving the rigidity of the casing or resistance to shocks
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03

Abstract

An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.

Claims

1. A housing for a consumer electronic product, comprising:

a first metal housing part having side walls that (i) include micro-features formed thereon, and (ii) define an internal volume, wherein the first metal housing part is coupled to a radio frequency (RF) antenna configured to emit a RF signal;

a second metal housing part having a bottom wall, the bottom wall including an edge having an indention that together with at least one of the side walls defines a channel, wherein the first and second metal housing parts are separated by the channel; and

a dielectric element that fills the channel and the micro-features to interlock and electrically isolate the first and second metal housing parts, the dielectric element including a first dielectric element and a second dielectric element, wherein the first dielectric element mechanically interlocks with the first and second metal housing parts, and the second dielectric element partially fills the channel and defines an exterior surface of the housing.

2. The housing for the consumer electronic product as recited in claim 1, wherein at least one of the micro-features includes a first through hole characterized as having a first longitudinal axis.

3. The housing for the consumer electronic product as recited in claim 2, wherein at least one of the micro-features include a second through hole characterized as having a second longitudinal axis, and the second through hole is oriented at a non-zero angle relative to the first through hole.

4. The housing for the consumer electronic product as recited in claim 3, wherein the side walls include upper edges that define a platform capable of receiving a transparent protective cover that defines and overlays the internal volume.

5. The housing for the consumer electronic product as recited in claim 1, wherein the first dielectric element and the second dielectric element combine to fill the channel.

6. The housing for the consumer electronic product as recited in claim 1, wherein the first dielectric element includes an internal surface that defines the internal volume.

8. The housing for the consumer electronic product as recited in claim 1, wherein the micro-features have a tiered layer interlock.

9. The housing for the consumer electronic product as recited in claim 8, wherein the tiered layer interlock comprises a first tier layer and a second tier layer, the first tier layer being smaller than the second tier layer.

7. The housing for the consumer electronic product as recited in 1, wherein the dielectric element includes an amount of a dual state material in a solid state.

10. A method for making an enclosure for an electronic device, the method comprising:

forming micro-features in side walls of a first metal housing part, wherein the side walls define an internal volume, and the first metal housing part is coupled to a radio frequency (RF) antenna configured to emit a RF signal;

forming a bottom wall in a second metal housing part, wherein the bottom wall includes an edge having an indention;

coupling the first metal housing part to the second metal housing part, wherein the indention and at least one of the side walls define a channel, and the first and second metal housing parts are separated by the channel; and

filling the channel and the micro-features with a dielectric element such as to interlock and electrically isolate the first and second metal housing parts, the dielectric element including a first dielectric element and a second dielectric element, wherein the first dielectric element mechanically interlocks with the first and second metal housing parts, and the second dielectric element partially fills the channel and defines an exterior surface of the housing.

11. The method of claim 10, wherein the side walls include a first wall having a first through hole and a second wall having a second though hole.

12. The method of claim 11, wherein the first through hole is oriented at a non-zero angle relative to the second through hole.

13. The method of claim 10, wherein the side walls include edges that define a platform capable of receiving a protective cover that defines and overlays the internal volume.

14. The method of claim 10, wherein the dielectric element includes a dual state material.

15. The method of claim 10, wherein the first dielectric element and the second dielectric element combine to fill the channel.

16. A housing for a portable electronic device, the housing comprising:

a corner housing part having side walls that (i) include micro-features, and (ii) define an internal volume, wherein the corner housing part is coupled to a radio frequency (RF) antenna configured to radiate a RF signal;

a bottom housing part having a bottom wall, the bottom wall including an edge having an indention that together with at least one of the side walls defines a channel, wherein the corner and bottom housing parts are separated by the channel; and

a dielectric element that fills the channel and the micro-features to interlock and electrically isolate the corner and bottom housing parts, the dielectric element including a first dielectric element and a second dielectric element, wherein the first dielectric element mechanically interlocks with the corner and bottom housing parts, and the second dielectric element partially fills the channel and defines an exterior surface of the housing.

17. The housing as recited in claim 16, wherein the corner housing part comprises the RF antenna.

18. The housing as recited in claim 16, wherein the micro-features are oriented at a non-zero angle relative to the bottom wall.

19. The housing as recited in claim 16, wherein the first dielectric element and the second dielectric element combine to fill the channel.

20. The housing as recited in claim 16, wherein the first dielectric element includes an internal surface that partially defines the internal volume.