Substrate bonding method and display substrate manufactured thereby
First Claim
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1. A substrate bonding method comprising the steps of:
- (1) forming a pattern, wherein the pattern is any one or more selected from a point pattern and a line pattern, by ink-jet printing a photo-curable adhesive ink on a lower substrate;
(2) forming a spacer having a height of 1.0 to 10 μ
m on the lower substrate by photo-curing the pattern;
(3) forming an adhesive layer by ink-jet printing the photo-curable adhesive ink on the surface of the lower substrate on which the spacer is formed; and
(4) laminating the adhesive layer of the lower substrate and an upper substrate by performing photo-curing,wherein a dot pitch of the ink-jet printing in Step (1) is 300 to 2,500 μ
m, wherein a dot pitch of the ink-jet printing in Step (3) is 50 to 200 μ
m.
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Abstract
The present invention relates to a substrate bonding method and a display substrate manufactured thereby, the method comprising the steps of: (1) forming a pattern by ink-jet printing a photo-curable adhesive ink on a lower substrate; (2) forming a spacer on the lower substrate by photo-curing the pattern; (3) forming an adhesive layer by ink-jet printing the photo-curable adhesive ink on the surface of the lower substrate on which the spacer is formed; and (4) laminating the adhesive layer of the lower substrate and an upper substrate by performing photo-curing.
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Citations
10 Claims
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1. A substrate bonding method comprising the steps of:
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(1) forming a pattern, wherein the pattern is any one or more selected from a point pattern and a line pattern, by ink-jet printing a photo-curable adhesive ink on a lower substrate; (2) forming a spacer having a height of 1.0 to 10 μ
m on the lower substrate by photo-curing the pattern;(3) forming an adhesive layer by ink-jet printing the photo-curable adhesive ink on the surface of the lower substrate on which the spacer is formed; and (4) laminating the adhesive layer of the lower substrate and an upper substrate by performing photo-curing, wherein a dot pitch of the ink-jet printing in Step (1) is 300 to 2,500 μ
m, wherein a dot pitch of the ink-jet printing in Step (3) is 50 to 200 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification