Substrate bonding method and display substrate manufactured thereby

• US 10,322,569 B2
• Filed: 11/27/2015
• Issued: 06/18/2019
• Est. Priority Date: 11/27/2014
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: LG Chem Limited (LG Corporation)
• Inventors: Back, Seung-A, Kim, Joon-Hyung
• Primary Examiner(s): McNally, Daniel
• Application Number:
  US15/519,953
• Publication Number:
  US 20170348955A1
• Time in Patent Office: 1,299 Days
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/145 Printing

Abstract

The present invention relates to a substrate bonding method and a display substrate manufactured thereby, the method comprising the steps of: (1) forming a pattern by ink-jet printing a photo-curable adhesive ink on a lower substrate; (2) forming a spacer on the lower substrate by photo-curing the pattern; (3) forming an adhesive layer by ink-jet printing the photo-curable adhesive ink on the surface of the lower substrate on which the spacer is formed; and (4) laminating the adhesive layer of the lower substrate and an upper substrate by performing photo-curing.

Claims

1. A substrate bonding method comprising the steps of:

(1) forming a pattern, wherein the pattern is any one or more selected from a point pattern and a line pattern, by ink-jet printing a photo-curable adhesive ink on a lower substrate;

(2) forming a spacer having a height of 1.0 to 10 μ

m on the lower substrate by photo-curing the pattern;

(3) forming an adhesive layer by ink-jet printing the photo-curable adhesive ink on the surface of the lower substrate on which the spacer is formed; and

(4) laminating the adhesive layer of the lower substrate and an upper substrate by performing photo-curing,

wherein a dot pitch of the ink-jet printing in Step (1) is 300 to 2,500 μ

m, wherein a dot pitch of the ink-jet printing in Step (3) is 50 to 200 μ

m.

2. The method of claim 1, wherein the pattern additionally comprises a partition wall pattern on an outer edge of the substrate.

3. The method of claim 2, wherein the partition wall pattern is in a form of being partially open.

4. The method of claim 2, wherein the partition wall pattern has a round edge portion.

5. The method of claim 1, wherein the lower substrate and the upper substrate are glass or a film.

6. The method of claim 1, wherein the photo-curable adhesive ink is for UV-curing or electron beam curing.

7. The method of claim 1, wherein the photo-curable adhesive ink comprises an epoxy compound, a photopolymerization initiator, a surfactant, a photostabilizer, and a solvent.

8. The method of claim 1, wherein the photo-curing in Step (2) is carried out at an UV intensity of 50 to 500 mW/cm² for 5 to 500 seconds.

9. The method of claim 1, wherein the photo-curing in Step (2) is carried out for 5 to 500 seconds by using electron beam.

10. The method of claim 1, wherein a dot pitch of the ink-jet printing in Step (3) is 100 to 150 μ

m.