Multipart lid for a semiconductor package with multiple components

• US 10,325,830 B1
• Filed: 11/30/2017
• Issued: 06/18/2019
• Est. Priority Date: 11/30/2017
• Status: Expired due to Fees

• Current Assignee: Elpis Technologies Inc. (Wi-LAN Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Arvin, Charles L., Ostrander, Steven P., Tunga, Krishna R.
• Primary Examiner(s): Hargrove, Frederick B
• Assistant Examiner(s): Reddington, Patricia D
• Application Number:
  US15/826,856
• Publication Number:
  US 20190164864A1
• Time in Patent Office: 565 Days
• Field of Search: 257713
• CPC Class Codes: F28F 21/085 from copper or copper alloys
• CPC Class Codes: F28F 21/087 from nickel or nickel alloys
• CPC Class Codes: F28F 21/089 Coatings, claddings or bonding layers made from metals or metal alloys F28F19/06 takes precedence
• CPC Class Codes: F28F 2265/26 for allowing differential expansion between elements floating header box elements F28F9/0236
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

Claims

1. A multipart lid comprising:

an upper part, wherein the upper part is cube shaped with a first rectangular cavity on a bottom surface of the upper part, wherein the first rectangular cavity extends partially into the upper part; and

a lower part joined to the upper part, wherein the lower part comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first integrated circuit, wherein the CTE of the first integrated circuit is 3 ppm/°

C., wherein a second cavity in the lower part corresponds to a size of the first integrated circuit,

wherein a height of the first integrated circuit is coplanar to a height of the lower part,

wherein the lower part comprises a first opening, wherein the first opening aligns with the first rectangular cutout cavity.

2. The multipart lid according to claim 1, wherein the upper part comprises copper, wherein a plating of the upper part comprises nickel.

3. The multipart lid according to claim 1, wherein the lower part comprises two or more parts.

4. The multipart lid according to claim 1, further comprising:

a coplanar bottom surface, wherein the coplanar bottom surface comprises the first opening and the second cavity.

5. The multipart lid according to claim 1, wherein the lower part comprises a nickel iron alloy, wherein a plating of the lower part comprises nickel.

6. The multipart lid according to claim 1, further comprising:

one or more additional openings, each of the one or more additional openings correspond to a shape of an electronic component.

7. The multipart lid according to claim 3, further comprising:

one or more discrete components, wherein each part of the two or more joined parts comprises a CTE matching a CTE of a corresponding component of one or more discrete components.

8. A structure comprising:

a substrate;

a first integrated component electrically connected and mounted on the substrate;

one or more discrete components electrically connected and mounted on the substrate;

and a substrate mounted multipart lid covering both the first integrated component and the one or more discrete components, wherein the multipart lid comprises an upper part and a lower part, wherein a coefficient of thermal expansion (CTE) of the lower part substantially matches an average of the CTE of the first integrated component and the CTE of the substrate, wherein the CTE of the first integrated circuit is 3 ppm/°

C., and the CTE of the substrate is 25 ppm/°

C.,

wherein a height of the first integrated circuit is coplanar to a height of the lower part,

wherein the multipart lid comprises a coplanar bottom surface, wherein the coplanar bottom surface comprises a first cavity corresponding to the first integrated circuit, and one or more second cavities, each of the one or more second cavities corresponding to one of the one or more discrete components,

wherein each part of the two or more parts comprises a CTE matching a CTE of a corresponding component of the one or more discrete components.

9. The structure according to claim 8, wherein the upper part comprises copper, wherein a plating of the upper part comprises nickel.

10. The structure according to claim 8, wherein the lower part comprises two or more parts.

11. The structure according to claim 8, wherein the lower part comprises a nickel iron alloy, wherein a plating of the lower part comprises nickel.

12. The structure according to claim 8, wherein

an upper surface of the first cavity is coplanar with a bottom surface of the upper part.

13. A method of fabricating a multipart lid, the method comprising:

forming an upper part, wherein the upper part comprises heat transfer capabilities, the upper part comprises a cube shape and a first cavity on a bottom surface, wherein the first cavity extends partially into the upper part;

forming a lower part, wherein the lower part comprises a coefficient of thermal expansion (CTE) substantially matching a CTE of a first integrated component, wherein the CTE of the first integrated circuit is 3 ppm/°

C., the lower part comprises a coplanar bottom surface, a second cavity corresponding to the first cavity, the lower part comprises a third cavity, wherein the combined first cavity and the second cavity correspond to a shape of a discrete component, wherein the third cavity corresponds to a shape of the integrated circuit

wherein a height of the first integrated circuit is coplanar to a height of the lower part; and

joining the upper part and the lower part, aligning the first cavity and the second cavity.

14. The method according to claim 13, wherein the lower part comprises two or more parts.

15. The method according to claim 13, wherein

the coplanar bottom surface comprises one or more additional cavities, each of the one or more additional cavities corresponding to a shape of a corresponding one or more additional discrete components.

16. The method according to claim 13, wherein the lower part comprises a nickel iron alloy, wherein a plating of the lid comprises nickel.

17. The method according to claim 15, wherein each part of the two or more joined parts comprises a CTE matching a CTE of a corresponding adjacent component of the one or more additional discrete components.