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Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces

  • US 10,325,877 B2
  • Filed: 04/23/2018
  • Issued: 06/18/2019
  • Est. Priority Date: 12/30/2015
  • Status: Active Grant
First Claim
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1. A vertically integrated microelectronic package, comprising:

  • a circuit platform having an upper surface and a lower surface opposite the upper surface thereof, the upper surface of the circuit platform having a wire bond-only surface area;

    a first microelectronic device coupled to the upper surface of the circuit platform;

    first wire bond wires coupled to and extending away from an upper surface of the first microelectronic device;

    second wire bond wires coupled to the upper surface of the circuit platform in the wire bond-only surface area and coupled to the upper surface of the first microelectronic device;

    a protective layer disposed over the circuit platform and the first microelectronic device, the protective layer having a lower surface and an upper surface opposite the lower surface thereof with the lower surface of the protective layer being in contact with the upper surface of the circuit platform, the upper surface of the protective layer having a surface mount-only area; and

    a second microelectronic device in a face-down orientation coupled to upper ends of the first wire bond wires in the surface mount-only area, the second microelectronic device located above and at least partially overlapping the first microelectronic device.

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