Proximity detector device with interconnect layers and related methods
First Claim
1. A method of forming a proximity detector device, the method comprising:
- forming a first interconnect layer comprising a plurality of first electrically conductive traces;
forming an integrated circuit (IC) layer over the first interconnect layer, the IC layer comprising;
an image sensor IC; and
a light source IC laterally spaced from the image sensor IC;
forming a second interconnect layer over the IC layer, the second interconnect layer comprising a plurality of second electrically conductive traces and first and second openings having sidewalls defined by dielectric material of the second interconnect layer, the first and second openings respectively aligned with the image sensor IC and the light source IC;
filling the first and second openings of the second interconnect layer with a transparent adhesive material, the transparent adhesive material physically contacting the image sensor IC and light source IC;
forming a lens assembly over the second interconnect layer, the lens assembly comprising first and second lenses respectively aligned with the first and second openings and adhered to the transparent adhesive material; and
forming a plurality of contacts coupled respectively to the plurality of first electrically conductive traces.
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Abstract
A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.
21 Citations
17 Claims
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1. A method of forming a proximity detector device, the method comprising:
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forming a first interconnect layer comprising a plurality of first electrically conductive traces; forming an integrated circuit (IC) layer over the first interconnect layer, the IC layer comprising; an image sensor IC; and a light source IC laterally spaced from the image sensor IC; forming a second interconnect layer over the IC layer, the second interconnect layer comprising a plurality of second electrically conductive traces and first and second openings having sidewalls defined by dielectric material of the second interconnect layer, the first and second openings respectively aligned with the image sensor IC and the light source IC; filling the first and second openings of the second interconnect layer with a transparent adhesive material, the transparent adhesive material physically contacting the image sensor IC and light source IC; forming a lens assembly over the second interconnect layer, the lens assembly comprising first and second lenses respectively aligned with the first and second openings and adhered to the transparent adhesive material; and forming a plurality of contacts coupled respectively to the plurality of first electrically conductive traces. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of forming a proximity detector device, the method comprising:
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positioning an image sensor integrated circuit (IC) and a light source IC on an adhesive layer of a carrier layer, wherein the image sensor IC and the light source IC are laterally spaced apart; forming an encapsulation material to surround the image sensor IC and the light source IC to form an IC layer on the carrier layer, wherein a backside of the encapsulation material is directed away from the carrier layer; flipping the IC layer and placing the IC layer on the carrier layer after forming the encapsulation material; forming an interconnect layer over the encapsulation material, wherein the interconnect layer comprises electrically conductive traces coupled to contacts of the image sensor IC and contacts of the light source IC, the interconnect layer further comprising first and second openings respectively aligned with the image sensor IC and the light source IC; forming a transparent adhesive material in the first and second openings; positioning a first lens and a second lens on the transparent adhesive material, the first lens and the second lens physically contacting the transparent adhesive material and respectively aligned with the image sensor IC and the light source IC; forming a molding compound over the interconnect layer to surround the first lens and the second lens, wherein the IC layer, the interconnect layer, and the molding compound surrounding the first lens and the second lens form an intermediate structure; flipping the intermediate structure and placing the intermediate structure on the adhesive layer of the carrier layer, wherein the backside of the encapsulation material is directed away from the carrier layer after flipping the intermediate structure; removing a portion of the backside of the encapsulation material to expose surfaces of the image sensor IC and the light source IC; forming a further interconnect layer over the IC layer, the further interconnect layer comprising further electrically conductive traces electrically coupled to the electrically conductive traces of the interconnect layer; and forming a plurality of contacts coupled to the further electrically conductive traces of the further interconnect layer. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification