Method of fabricating light emitting device package
First Claim
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1. A method of fabricating a light emitting device package comprising in sequential order:
- (1) forming a plurality of semiconductor light emitting parts above a growth substrate, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer vertically stacked on the growth substrate;
(2) after forming the plurality of semiconductor light emitting parts, and while the plurality of light emitting parts are disposed below the growth substrate, forming a partition structure having a plurality of light emitting windows in the growth substrate, the partition structure including partitions formed of a portion of the growth substrate, and each partition formed between two adjacent semiconductor light emitting parts of the plurality of semiconductor light emitting parts in a plan view; and
(3) after forming the partition structure and while the plurality of light emitting parts are disposed below the growth substrate;
filling a resin having a phosphor into each of the plurality of light emitting windows; and
forming a plurality of wavelength conversion parts by planarizing a surface of the resin.
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Abstract
A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.
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Citations
20 Claims
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1. A method of fabricating a light emitting device package comprising in sequential order:
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(1) forming a plurality of semiconductor light emitting parts above a growth substrate, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer vertically stacked on the growth substrate; (2) after forming the plurality of semiconductor light emitting parts, and while the plurality of light emitting parts are disposed below the growth substrate, forming a partition structure having a plurality of light emitting windows in the growth substrate, the partition structure including partitions formed of a portion of the growth substrate, and each partition formed between two adjacent semiconductor light emitting parts of the plurality of semiconductor light emitting parts in a plan view; and (3) after forming the partition structure and while the plurality of light emitting parts are disposed below the growth substrate; filling a resin having a phosphor into each of the plurality of light emitting windows; and forming a plurality of wavelength conversion parts by planarizing a surface of the resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of fabricating a light emitting device package comprising in sequential order:
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(1) forming a plurality of semiconductor light emitting parts above a growth substrate, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer vertically stacked on the growth substrate; (2) after forming the plurality of semiconductor light emitting parts, and while the plurality of light emitting parts are disposed below the growth substrate, forming a partition structure having a plurality of light emitting windows corresponding respectively to the plurality of semiconductor light emitting parts in the growth substrate, the partition structure including partitions formed of a portion of the growth substrate, and each partition formed between two adjacent semiconductor light emitting parts of the plurality of semiconductor light emitting parts in a plan view; and (3) after forming the partition structure and while the plurality of light emitting parts are disposed below the growth substrate; dispensing a first resin having one of red, green, and blue phosphors into each of the plurality of light emitting windows; dispensing a second resin on the first resin in each of the plurality of light emitting windows, the second resin being transparent and not being mixed with a phosphor; and forming a plurality of wavelength conversion parts by planarizing a surface of the second resin.
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15. A method of manufacturing a light emitting device package comprising in sequential order:
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(1) forming a light emitting diode (LED) above a substrate; (2) after forming the LED, and while the LED is below the substrate, forming a wavelength conversion part on the LED; and (3) after forming the wavelength conversion part, planarizing a top surface of the wavelength conversion part by removing a portion of the wavelength conversion part, wherein the wavelength conversion part comprises a first resin layer including a first phosphor material, a second resin layer, and a light filter disposed between the first and second resin layers, wherein the light emitting diode includes a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, and wherein the first and second semiconductor layers are doped with impurities, and the first and second semiconductor layers have opposite polarities from each other. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification