×

Method of fabricating light emitting device package

  • US 10,326,061 B2
  • Filed: 04/13/2017
  • Issued: 06/18/2019
  • Est. Priority Date: 08/11/2016
  • Status: Active Grant
First Claim
Patent Images

1. A method of fabricating a light emitting device package comprising in sequential order:

  • (1) forming a plurality of semiconductor light emitting parts above a growth substrate, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer vertically stacked on the growth substrate;

    (2) after forming the plurality of semiconductor light emitting parts, and while the plurality of light emitting parts are disposed below the growth substrate, forming a partition structure having a plurality of light emitting windows in the growth substrate, the partition structure including partitions formed of a portion of the growth substrate, and each partition formed between two adjacent semiconductor light emitting parts of the plurality of semiconductor light emitting parts in a plan view; and

    (3) after forming the partition structure and while the plurality of light emitting parts are disposed below the growth substrate;

    filling a resin having a phosphor into each of the plurality of light emitting windows; and

    forming a plurality of wavelength conversion parts by planarizing a surface of the resin.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×