Isolated power transfer with integrated transformer and voltage control

• US 10,326,375 B1
• Filed: 12/07/2017
• Issued: 06/18/2019
• Est. Priority Date: 12/07/2017
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Silicon Laboratories Incorporated
• Inventors: Pentakota, Krishna, Al-Shyoukh, Mohammad, Mastovich, Stefan N.
• Primary Examiner(s): Tran, Khai
• Application Number:
  US15/835,234
• Publication Number:
  US 20190181764A1
• Time in Patent Office: 558 Days
• Field of Search: 375258, 363 2101, 363 2112, 327536
• CPC Class Codes: G01R 19/18 using conversion of DC into AC, e.g. with choppers
• CPC Class Codes: H01F 2019/085 Transformer for galvanic isolation
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H02M 1/0048 Circuits or arrangements for reducing losses using snubbers H02M1/34
• CPC Class Codes: H02M 3/335 using semiconductor devices only
• CPC Class Codes: H02M 3/33523 with galvanic isolation between input and output of both the power stage and the feedback loop
• CPC Class Codes: H02M 3/33576 : having at least one active switching element at the secondary side of an isolation transformer
• CPC Class Codes: H02M 7/537 : using semiconductor devices only, e.g. single switched pulse inverters
• CPC Class Codes: H03F 3/195 : in integrated circuits
• CPC Class Codes: H03F 3/213 : in integrated circuits
• CPC Class Codes: H03F 3/2173 : of the bridge type
• CPC Class Codes: Y02B 70/10 : Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Abstract

An isolated power transfer device has a primary side and a secondary side isolated from the primary side by an isolation barrier. A secondary-side circuit includes a rectifier circuit coupled to a secondary-side conductive coil. The secondary-side circuit includes a first resistor coupled to a first power supply node and a terminal node. The secondary-side circuit includes a second resistor coupled to the terminal node and a second power supply node. The secondary-side circuit includes a first circuit to generate a feedback signal in response to a reference voltage and a signal on the terminal node. The feedback signal has a hysteretic band defined by the first resistor and the second resistor. The secondary-side circuit is configured as an AC/DC power converter that provides, on the first power supply node, an output DC signal having a voltage level based on a ratio of the first resistor to the second resistor.

Claims

1. An isolated power transfer device having a primary side and a secondary side isolated from the primary side by an isolation barrier, the isolated power transfer device comprising:

a first power supply node;

a second power supply node;

a secondary-side conductive coil;

a secondary-side circuit comprising;

a rectifier circuit coupled to the secondary-side conductive coil, the first power supply node, and the second power supply node;

a first resistor coupled to the first power supply node and a terminal node;

a second resistor coupled to the terminal node and the second power supply node; and

a first circuit configured to generate a feedback signal in response to a predetermined reference voltage and a signal on the terminal node, the feedback signal having a hysteretic band defined by a first resistance of the first resistor and a second resistance of the second resistor,

wherein the secondary-side circuit is configured as an AC/DC power converter circuit that provides, on the first power supply node, an output DC signal having a voltage level based on a ratio of the first resistance to the second resistance.

2. The isolated power transfer device, as recited in claim 1, wherein the secondary-side circuit further comprises:

a third resistor coupled to the terminal node, the hysteretic band being further defined by a third resistance of the third resistor.

3. The isolated power transfer device, as recited in claim 1, wherein the first resistor and the second resistor are external to an integrated circuit comprising the secondary-side circuit.

4. The isolated power transfer device, as recited in claim 3, wherein the secondary-side circuit further comprises a third resistor internal to the integrated circuit.

5. The isolated power transfer device, as recited in claim 1, wherein the secondary-side circuit further comprises:

an overvoltage protection circuit configured to clamp an output DC voltage level on the first power supply node to be at most a predetermined output voltage level.

6. The isolated power transfer device, as recited in claim 1, further comprising:

an input power supply node configured to provide an input DC signal to a primary-side conductive coil; and

a primary-side circuit coupled to the primary-side conductive coil, the primary-side circuit comprising;

a second circuit coupled to the primary-side conductive coil to form an oscillator circuit configured as a Class-D oscillator of a DC/AC power converter responsive to the input DC signal and an oscillator enable signal, the oscillator circuit being enabled and disabled at a frequency based on the first resistance and the second resistance; and

a receiver configured to receive the feedback signal from the first circuit via a communications channel across the isolation barrier, and

wherein the secondary-side circuit further comprises a transmitter configured to transmit the feedback signal to the across the isolation barrier using the communications channel.

7. The isolated power transfer device, as recited in claim 1, further comprising:

a transformer configured to perform an AC/AC power conversion, the transformer comprising;

a primary-side conductive coil; and

the secondary-side conductive coil electrically isolated from the primary-side conductive coil,

wherein the transformer is formed using a first substrate made of an insulating material and the transformer is integrated into an integrated circuit package including a primary-side circuit and the secondary-side circuit, the integrated circuit package including conductive structures formed on a package substrate of the integrated circuit package, wherein the first substrate is disposed on the conductive structures of the package substrate.

8. The isolated power transfer device, as recited in claim 7, wherein the first substrate is a glass substrate having a high transition temperature and a low dielectric constant.

9. A method for operating an isolated power transfer device having a primary side and a secondary side isolated from the primary side by an isolation barrier, the method comprising:

rectifying an AC signal received from a secondary-side conductive coil to generate an output DC signal having a voltage level based on a ratio of a first resistance of a first resistor to a second resistance of a second resistor, the first resistor and the second resistor being coupled to a terminal node of the isolated power transfer device; and

generating a feedback signal in response to a predetermined reference voltage and a signal on the terminal node, the feedback signal having a hysteretic band defined by the first resistance and the second resistance.

10. The method, as recited in claim 9, further comprising:

converting an input DC signal to a second AC signal, the input DC signal being electrically isolated from the output DC signal,

wherein the converting comprises;

driving an oscillator circuit with the input DC signal; and

selectively enabling the oscillator circuit based on the feedback signal to generate the second AC signal.

11. The method, as recited in claim 10, wherein the oscillator circuit is enabled and disabled at a frequency based on the first resistance and the second resistance.

12. The method, as recited in claim 10, wherein the converting further comprises:

converting the second AC signal to the AC signal using an inductor formed from a primary-side conductive coil and the secondary-side conductive coil, the secondary-side conductive coil being electrically isolated from the primary-side conductive coil.

13. The method, as recited in claim 10, wherein the selectively enabling is further based on a status indicator indicating an operation status of a communications channel across the isolation barrier.

14. The method, as recited in claim 13, further comprising:

generating the status indicator based on a change in signal level of the feedback signal within a predetermined period.

15. The method, as recited in claim 9, further comprising:

clamping the voltage level to a predetermined voltage level.

16. The method, as recited in claim 9, wherein the hysteretic band is further defined by a third resistance of a third resistor coupled to the terminal node.

17. The method, as recited in claim 9, further comprising:

controlling the hysteretic band independently from the voltage level.

18. An isolated power transfer device comprising:

an integrated circuit package comprising;

a multi-layer substrate;

a first conductive structure formed using the multi-layer substrate; and

a first die held by the integrated circuit package and disposed on the first conductive structure, the first die comprising;

a substrate formed of an insulating material; and

a transformer formed on the substrate, the transformer comprising;

a first conductive coil comprising a center tap coupled to an input power supply node of the integrated circuit package; and

a second conductive coil electrically isolated from the first conductive coil,

wherein the first conductive coil is configured to transfer power via the second conductive coil from the input power supply node to an output power supply node, the input power supply node being electrically isolated from the output power supply node.

19. The isolated power transfer device, as recited in claim 18, further comprising:

a second die held by the integrated circuit package, the second die being electrically coupled to the second conductive coil, the second die comprising a secondary-side circuit comprising;

a rectifier circuit coupled to the second conductive coil, a first power supply node, and a second power supply node;

a first resistor coupled to the first power supply node and a terminal node;

a second resistor coupled to the terminal node and the second power supply node; and

a first circuit configured to generate a feedback signal in response to a predetermined reference voltage and a signal on the terminal node, the feedback signal having a hysteretic band defined by a first resistance of the first resistor and a second resistance of the second resistor; and

a third die held by the integrated circuit package, the third die being electrically coupled to the second conductive coil and electrically isolated from the second die, the third die comprising;

a primary-side circuit coupled to the first conductive coil, the primary-side circuit comprising;

a second circuit coupled to the first conductive coil to form an oscillator circuit configured as a power amplifier of a DC/AC power converter responsive to an input DC signal on the input power supply node and an oscillator enable signal, the oscillator circuit being enabled and disabled at a frequency based on the first resistance and the second resistance,

wherein the secondary-side circuit is configured as an AC/DC power converter circuit that provides, on the first power supply node, an output DC signal having a voltage level based on a ratio of the first resistance to the second resistance.

20. The isolated power transfer device, as recited in claim 18, wherein the substrate is a glass substrate having a high transition temperature and a low dielectric constant.

21. The isolated power transfer device, as recited in claim 18, wherein the first conductive coil is formed in a first layer on the substrate and the second conductive coil is formed in a second layer on the substrate.