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Top port MEMS package and method

  • US 10,327,076 B1
  • Filed: 07/20/2016
  • Issued: 06/18/2019
  • Est. Priority Date: 07/12/2010
  • Status: Active Grant
First Claim
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1. An electronic component package comprising:

  • a substrate comprising an upper substrate surface, a lower substrate surface, and a recess in the upper substrate surface, the recess comprising;

    a base surface between the upper substrate surface and the lower substrate surface; and

    a sidewall connecting the upper substrate surface and the base surface;

    a Micro Electro Mechanical Systems (MEMS) electronic component comprising an upper component surface and a lower component surface opposite the upper component surface, wherein;

    the lower component surface is coupled to the upper substrate surface and over the recess; and

    a first portion of the recess extends beyond a footprint of the lower component surface; and

    a lid coupled to the substrate over the MEMS electronic component, the lid comprising an inner lid surface defining a lid cavity, wherein the first portion of the recess provides a fluid communication path between the lid cavity and the lower component surface.

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