Top port MEMS package and method

• US 10,327,076 B1
• Filed: 07/20/2016
• Issued: 06/18/2019
• Est. Priority Date: 07/12/2010
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Syed, Ahmer Raza, Kuo, Bob Shih-Wei, Troche, Jr., Louis B.
• Primary Examiner(s): Nguyen, Sean H
• Application Number:
  US15/214,567
• Time in Patent Office: 1,063 Days
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/2823 Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material number or position of ports H04R1/2815; vents in bandpass type enclosures H04R1/2846
• CPC Class Codes: H04R 11/04 Microphones
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H04R 9/08 Microphones

Abstract

A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.

Claims

1. An electronic component package comprising:

a substrate comprising an upper substrate surface, a lower substrate surface, and a recess in the upper substrate surface, the recess comprising;

a base surface between the upper substrate surface and the lower substrate surface; and

a sidewall connecting the upper substrate surface and the base surface;

a Micro Electro Mechanical Systems (MEMS) electronic component comprising an upper component surface and a lower component surface opposite the upper component surface, wherein;

the lower component surface is coupled to the upper substrate surface and over the recess; and

a first portion of the recess extends beyond a footprint of the lower component surface; and

a lid coupled to the substrate over the MEMS electronic component, the lid comprising an inner lid surface defining a lid cavity, wherein the first portion of the recess provides a fluid communication path between the lid cavity and the lower component surface.

2. The electronic component package of claim 1 wherein the lid comprises a top port in fluid communication with the upper component surface.

3. The electronic component package of claim 2 further comprising a seal between the upper component surface and the inner lid surface that prevents fluid communication between the top port and the base surface via the lid cavity.

4. The electronic component package of claim 3 wherein:

the substrate further comprises terminals;

the MEMS electronic component further comprises bond pads; and

the electronic component package further comprises bond wires coupling the bond pads to the terminals.

5. The electronic component package of claim 4 wherein the seal encloses the bond pads and a portion of the bond wires.

6. The electronic component package of claim 1 wherein a second portion of the recess is located directly below the lower component surface.

7. The electronic component package of claim 1 further comprising:

a plurality of mounting pads on the upper substrate surface that couple the MEMS electronic component to the substrate above the recess;

wherein adjacent ones of the plurality of mounting pads are separated from each other by an air gap.

8. The electronic component package of claim 7 wherein each of a plurality of corners of the lower component surface is coupled to a respective one of the plurality of mounting pads.

9. The electronic component package of claim 7 wherein each mounting pad from the plurality of mounting pads comprises a respective portion of a metal layer and a respective portion of a solder mask formed on the respective portion of the metal layer.

10. The electronic component package of claim 7 wherein each mounting pad from the plurality the mounting pads comprises a respective area of the upper substrate surface that lies outside of the recess.

11. The electronic component package of claim 7 wherein each mounting pad from the plurality of mounting pads is formed on the base surface within the recess.

12. An electronic component package comprising:

a substrate comprising a first substrate surface;

a Micro Electro Mechanical Systems (MEMS) electronic component comprising a first component surface and a second component surface opposite the first component surface;

a lid coupled to the substrate over the MEMS electronic component, the lid comprising a lid inner surface defining a lid cavity;

a plurality of mounting pads coupling the first component surface to the first substrate surface, wherein each mounting pad of the plurality of mounting pads includes a nonconductive protrusion that projects above the first substrate surface and supports the MEMS electronic component such that a space is maintained between the first component surface and the first substrate surface; and

an adhesive attaching the first component surface to each nonconductive protrusion of the plurality of mounting pads.

13. The electronic component package of claim 12 further comprising:

a recess in an upper substrate surface of the substrate;

wherein the first substrate surface comprises a base surface of the recess that is between the upper substrate surface and a lower substrate surface of the substrate; and

wherein a sidewall of the recess connects the upper substrate surface to the base surface of the recess.

14. The electronic component package of claim 12 wherein:

the substrate comprises an upper substrate surface and a lower substrate surface opposite the upper substrate surface; and

the upper substrate surface comprises the first substrate surface.

15. The electronic component package of claim 12 wherein the lid comprises a top port in fluid communication with the second component surface.

16. A method of forming an electronic component package comprising:

mounting a Micro Electro Mechanical Systems (MEMS) electronic component to a substrate above a recess in an upper surface of the substrate such that a first portion of the recess extends beyond a footprint of a first surface of the MEMS electronic component; and

mounting a lid to the substrate such that a top port of the lid is in fluid communication with a second surface of the MEMS electronic component opposite the first surface of the MEMS electronic component and such that the first portion of the recess provides a fluid communication path between a lid cavity the first surface of the MEMS electronic component.

17. The method of claim 16, wherein the mounting the MEMS electronic component comprises attaching, with an adhesive, the MEMS electronic component to a plurality of nonconductive protrusions that project above a base surface of the recess.

18. The method of claim 16, further comprising forming the recess in the upper surface of the substrate by selectively removing portions of the substrate.

19. The method of claim 16, further comprising forming the recess in the upper surface of the substrate by:

punching an opening in a first dielectric layer of the substrate; and

mounting the first dielectric layer to a second dielectric layer of the substrate.