Electronic device with encapsulated circuit assembly having an integrated metal layer

• US 10,327,326 B2
• Filed: 11/21/2017
• Issued: 06/18/2019
• Est. Priority Date: 08/17/2017
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Boozer, Brad G., Ely, Colin M., Cardinali, Steven P.
• Primary Examiner(s): Semenenko, Yuriy
• Application Number:
  US15/819,243
• Publication Number:
  US 20190059152A1
• Time in Patent Office: 574 Days
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H03K 2217/960765 Details of shielding arrangements
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/0086 portable, e.g. battery operated apparatus casings for switching devices H01H9/02
• CPC Class Codes: H05K 5/064 sealed by potting, e.g. waterproof resin poured in a rigid casing
• CPC Class Codes: H05K 9/0026 integrally formed from metal sheet

Abstract

Embodiments are directed to a circuit assembly for an electronic device having an electromagnetic shield that defines a sensing element or contact pad along an outer surface of the assembly. The circuit assembly includes a group of electrical components attached to a surface of a printed circuit board. A molded structure may encapsulate the group of electrical components and at least a portion of the surface of the printed circuit board. A metal layer may be formed over an outer surface of the molded structure. The metal layer may define both a shield portion configured to provide shielding for one or more of the group of electrical components and an electrode configured to detect an input applied to the electronic device.

Claims

1. A circuit assembly for an electronic device, comprising:

a printed circuit board;

a group of electrical components attached to a surface of the printed circuit board;

a molded structure encapsulating the group of electrical components and at least a portion of the surface of the printed circuit board; and

a metal layer formed over an outer surface of the molded structure and defining;

a shield portion configured to provide shielding for one or more of the group of electrical components; and

an electrode electrically isolated from the shield portion and configured to detect an input applied to the electronic device.

2. The circuit assembly of claim 1, wherein the electrode forms a capacitive sensing element that is configured to detect a touch applied to the electronic device.

3. The circuit assembly of claim 1, wherein:

the electronic device comprises a sensing layer that is electrically coupled to the electrode of the circuit assembly; and

the input comprises a force applied to the electronic device; and

a capacitance between the sensing layer and the electrode changes in response to the force applied to the electronic device.

4. The circuit assembly of claim 1, wherein:

the shield portion and the electrode are formed from a common material; and

the shield portion and the electrode are arranged substantially coplanar along the outer surface of the molded structure.

5. The circuit assembly of claim 1, wherein:

the electrode is a first electrode;

the metal layer defines a second electrode separated from the shield portion;

the first electrode and the second electrode are separated from the shield portion by a gap; and

the circuit assembly further comprises an electrical trace extending between the first electrode and the second electrode and positioned within the gap.

6. The circuit assembly of claim 5, wherein:

the molded structure is formed from a plastic doped with a metal material; and

the electrical trace is formed along the outer surface of the molded structure from a portion of the metal material remaining after a portion of the plastic has been ablated.

7. The circuit assembly of claim 1, further comprising:

electrically conductive vias extending through the molded structure electrically coupling the electrode with one or more electrical components of the group of electrical components.

8. The circuit assembly of claim 1, wherein:

the surface of the printed circuit board is a first surface;

the printed circuit board further defines a second surface opposite the first surface;

the molded structure is a first molded structure formed at least partially over the first surface; and

a second molded structure is formed at least partially over the second surface.

9. The circuit assembly of claim 1, wherein:

the circuit assembly further comprises a flexible circuit; and

the flexible circuit is electrically coupled to the metal layer at a first end and electrically coupled to an element of the printed circuit board at a second end opposite to the first end.

10. A wearable electronic device, comprising:

an enclosure; and

a circuit assembly positioned within the enclosure and comprising;

a printed circuit board;

a group of electrical components attached and electrically coupled to the printed circuit board;

a molded structure encapsulating the group of electrical components; and

a metal layer formed over the molded structure and defining;

an electromagnetic shield for one or more electrical components of the group of electrical components; and

an electrode electrically isolated from the electromagnetic shield and configured to electrically couple to an electrical component of the wearable electronic device that is distinct from the circuit assembly.

11. The wearable electronic device of claim 10, wherein:

the electrode forms a sensing element configured to detect an input received along an exterior surface of the wearable electronic device; and

one or more of the group of electrical components are responsive to the detected input.

12. The wearable electronic device of claim 11, wherein:

the enclosure defines an opening;

the wearable electronic device further comprises a touch sensitive display at least partially positioned within the opening and configured to depict a graphical output of the wearable electronic device;

the electrical component of the wearable electronic device is a sensing layer of the touch sensitive display; and

the graphical output is responsive to the detected input.

13. The wearable electronic device of claim 12, wherein:

the sensing layer moves inward toward the circuit assembly in response to receiving the input; and

the movement of the sensing layer results in a change in capacitance between the sensing layer and the electrode.

14. The wearable electronic device of claim 10, wherein the electrode defines a contact pad that is directly coupled with the electrical component of the electronic device.

15. The wearable electronic device of claim 10, wherein the electrical component of the wearable electronic device is an antenna configured to receive a wireless communication signal.

16. The wearable electronic device of claim 10, wherein:

the wearable electronic device comprises a band coupled to the enclosure and configured to secure the wearable electronic device to a user; and

the electrode is configured to detect when the wearable electronic device is secured to the user.

17. A method of forming a circuit assembly, comprising:

forming a molded structure over a group of electrical components positioned along a printed circuit board to encapsulate the group of electrical components within the molded structure; and

forming a metal layer along an outer surface of the molded structure to define;

(1) an electrode electrically coupled to the group of electrical components, and

(2) a shield portion electrically isolated from the electrode and configured to shield the group of electrical components from electromagnetic interference.

18. The method of claim 17, wherein forming the metal layer further comprises:

sputtering an electrically conductive material onto a surface of the molded structure.

19. The method of claim 17, wherein forming the metal layer further comprises forming an electrical trace to the electrode.

20. The method of claim 17, wherein:

forming the molded structure further comprises flowing a plastic doped with a metal material along one or more surfaces of the group of electrical components; and

forming the metal layer further comprises forming electrical traces along a gap between the electrode and the shield portion, the electrical traces generated by laser treating a portion of the plastic.