Interfacial convective assembly for high aspect ratio structures without surface treatment

• US 10,329,139 B2
• Filed: 06/07/2011
• Issued: 06/25/2019
• Est. Priority Date: 06/08/2010
• Status: Active Grant

• Current Assignee: Northeastern University
• Original Assignee: Northeastern University
• Inventors: Cha, Nam-Goo, Echegoyen, Yolanda, Busnaina, Ahmed, Kim, Taehoon
• Primary Examiner(s): Sellman, Cachet I
• Application Number:
  US13/702,133
• Publication Number:
  US 20130287999A1
• Time in Patent Office: 2,940 Days
• Field of Search: 977733, 427180, 427 74
• CPC Class Codes: B05D 1/00 Processes for applying liquids or other fluent materials B05D5/00, B05D7/00 take precedence
• CPC Class Codes: B05D 1/36 Successively applying liquids or other fluent materials, e.g. without intermediate treatment
• CPC Class Codes: B05D 2401/32 applied as powders
• CPC Class Codes: B05D 7/22 to internal surfaces, e.g. of tubes
• CPC Class Codes: B22F 1/0545 Dispersions or suspensions of nanosized particles
• CPC Class Codes: B22F 2998/00 Supplementary information concerning processes or compositions relating to powder metallurgy
• CPC Class Codes: B32B 3/18 characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side B32B5/02 takes precedence
• CPC Class Codes: B81B 1/002 Holes characterised by their shape, in either longitudinal or sectional plane
• CPC Class Codes: B81C 1/00373 Selective deposition, e.g. printing or microcontact printing
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: C23C 26/00 Coating not provided for in groups C23C2/00 - C23C24/00
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24562 Interlaminar spaces

Abstract

A method for assembling colloidal particles onto a substrate surface through fluid transport. The method comprises placing a first fluid placed adjacent to the substrate surface, applying a colloidal dispersion on top of the first fluid layer and removal of the first fluid layer. The method is extremely versatile, and is especially useful in depositing colloidal materials in high aspect ratio channels and vias without the need for prior treatment of the surface.

Claims

1. A method for depositing colloidal particles onto a substrate comprising:

(a) providing a substrate having a surface;

(b) depositing a first fluid onto the surface of the substrate to form a first layer;

(c) depositing an aqueous dispersion of colloidal particles as a second layer on top of the first layer to form a two-layered fluid system;

(d) optionally covering the second layer with a cover so as to form an assembly comprising a sandwich of the first and second layers between the substrate and the cover;

(e) removing the first layer; and

(f) removing water from the second layer, leaving a layer of colloidal particles on the surface of said substrate.

2. The method of claim 1 wherein the substrate is hydrophobic.

3. The method of claim 1 wherein the substrate is hydrophilic.

4. The method of claim 1 wherein the substrate comprises one or more materials selected from the group consisting of glass, organic polymer, inorganic polymer, ceramic, metal, metalloid, and a layered combination or mixture thereof.

5. The method of claim 1 wherein the substrate comprises a non-metallic surface that is at least partly metallized.

6. The method of claim 5 wherein the metallization is lithographically patterned.

7. The method of claim 4 wherein the substrate comprises glass and the glass comprises a silicate, borate, or phosphate, or combination or mixture thereof.

8. The method of claim 4 wherein the substrate comprises an organic polymer and the organic polymer comprises a thermoplastic or thermoset resin or copolymer or mixture thereof.

9. The method of claim 4 wherein the substrate comprises an organic polymer and the organic polymer comprises a partially or perfluorinated polymer, polycarbonate, polyester, polyalkylene, polyacrylate or polymethacrylate, polystyrene, or polyacrylonitrile, or a copolymer or mixture thereof.

10. The method of claim 4 wherein the substrate comprises an organic polymer and the organic polymer is electrically conductive or semi-conductive.

11. The method of claim 10 wherein the organic polymer comprisespoly(para-phenylene vinylene), polythiophene, poly(paraphenylene), polyquinoline, polypyrrole, polyacetylene, or polyfluorene, or a copolymer or mixture thereof.

12. The method of claim 4 wherein the substrate comprises an inorganic polymer and the inorganic polymer comprises a polysiloxane, silicate, or aluminosilicate, or a combination or mixture thereof.

13. The method of claim 4 wherein the substrate comprises a ceramic and the ceramic comprises a metal or metalloid oxide, nitride, or carbide, or a combination or mixture thereof.

14. The method of claim 13 wherein the substrate comprises a ceramic and the ceramic comprises aluminum oxide, aluminum nitride, aluminum carbide, titanium oxide, titanium nitride, titanium carbide, silicon oxide, silicon carbide, silicon nitride, boron carbide, boron nitride, antimony oxide, iron oxide, magnesium oxide, nickel oxide, tin oxide, zinc oxide, zirconium oxide, or a combination or mixture thereof.

15. The method of claim 4 wherein the substrate comprises a metal and the metal comprises aluminum, gold, silver, platinum, cadmium, copper, nickel, titanium, or iron, or a combination or mixture thereof.

16. The method of claim 4 wherein the substrate comprises a metalloid and the metalloid comprises conducting, semi-conducting, or insulating, doped or undoped Si, CdS, CdSe, Ge, GaAs, GaAlAs, ZnS, InP, or Ge, or a combination or mixture thereof.

17. The method of claim 4 wherein the substrate comprises silica, polyethylene, or polycarbonate.

18. The method of claim 1 wherein the substrate is rigid.

19. The method of claim 1 wherein the substrate is flexible.

24. The method of claim 1 wherein the first fluid wets the substrate.

25. The method of claim 1 wherein the first fluid comprises an organic fluid.

26. The method of claim 25 wherein the organic fluid comprises an alcohol, ester, or ketone.

27. The method of claim 25 wherein the first fluid comprises a liquid that is immiscible with water.

28. The method of claim 25 wherein the first fluid comprises a liquid that is partially miscible with water.

29. The method of claim 25 wherein the first fluid comprises a liquid that is completely miscible with water.

30. The method of claim 25 wherein the normal boiling point of the first fluid is about 99°

C. or less.

31. The method of claim 25 wherein the normal boiling point of the first fluid is about 80°

C. or less.

32. The method of claim 25 wherein the normal boiling point of the first fluid is about 60°

C. or less.

33. The method of claim 25 wherein the normal boiling point of the first fluid is about 50°

C. or less.

34. The method of claim 26 wherein the surface tension of the first fluid at 25°

C. is 40 dynes/cm or less.

35. The method of claim 26 wherein the surface tension of the first fluid at 25°

C. is 25 dynes/cm or less.

36. The method of claim 26 wherein the specific gravity of the first fluid is in the range of about 0.6 to about 0.95.

37. The method of claim 26 wherein the specific gravity of the first fluid is in the range of about 0.7 to about 0.85.

38. The method of claim 1 wherein the particles are nanoparticles.

39. The method of claim 1 wherein the colloidal particles comprise at least one allotrope of carbon, glass, organic polymer, inorganic polymer, ceramic, inorganic salt, metal or metalloid, or a combination or mixture thereof.

40. The method of claim 39 wherein the colloidal particles contain a fill material different from the remaining particle material, wherein the fill material comprises one or more allotropes of carbon, organic polymer, inorganic polymer, inorganic salt, metal or metalloid, or a mixture thereof.

41. The method of claim 1 wherein the aqueous dispersion comprises 0.1 to 25 wt % particles.

42. The method of claim 39 wherein the organic polymer comprises a biopolymer.

43. The method of claim 1 wherein the aqueous dispersion further comprises an internally dispersed phase of a partially immiscible or immiscible liquid.

44. The method of claim 43 wherein some portion of the colloidal particles are positioned within the internally dispersed liquid phase.

45. The method of claim 43 wherein some portion of the colloidal particles are positioned at the interface between the aqueous and the internally dispersed liquid phase.

46. The method of claim 1 wherein the colloidal particles further comprise a ligand or surfactant.

47. The method of claim 1 wherein the first layer is removed by the application of heat or vacuum or both.

48. The method of claim 47 wherein the first layer is removed by the application of heat.

49. The method of claim 47 wherein the first layer is removed by evaporation.

50. The method of claim 47 wherein the first layer is removed by comingling with, and incorporating into, the aqueous phase.

51. The method of claim 1 wherein the second layer is removed by the application of heat or vacuum or both.

52. The method of claim 1 wherein the particles remaining after the removal of the first and second layers of liquid form a patterned deposit of particles on the substrate.

53. The method of claim 52 wherein the patterned deposit of particles on the substrate forms an electrical conductor or semiconductor device.

20. The method of clam I wherein the substrate comprises patterned micro- or nano-dimensioned features.

21. The method of claim 20 wherein the patterned features present aspect ratios of 10or more.

22. The method of claim 20 wherein the patterned features present aspect ratios of 1 or more.

23. The method of claim 20 wherein the patterned features present aspect ratios of 100 or more.