Ceramic pressure measurement cell and method for production thereof
First Claim
Patent Images
1. A method of bonding two ceramic components using an active brazing solder, comprising:
- providing the two ceramic components;
preparing a solder stop layer on at least one surface of at least one ceramic component, which separates a portion of the surface to be wetted by the solder from a portion to be kept free of the solder;
providing the active brazing solder between the first and the second ceramic component in the surface areas of the first and of the second component to be wetted by the active brazing solder;
heating the ceramic components and the active brazing solder under vacuum up to a temperature at which the active brazing solder melts and reacts with the ceramic components; and
allowing the ceramic components to cool down, wherein;
the solder stop layer comprises a metal oxide, which has an oxygen coexistence decomposition pressure of not less than 10−
24 MPa (10−
23·
bar) and not more than 10−
13 MPa (10−
12·
bar) at an inverse temperature of 8·
10−
4/K and an oxygen coexistence decomposition pressure of not less than 10−
28 MPa (10−
27 bar) and not more than 10−
16 MPa (10−
15 bar) at an inverse temperature of 9·
10−
4/K;
for producing a pressure measurement cell, the first ceramic component comprises a counterpart and a second ceramic component comprises a measurement membrane, wherein the counterpart is connected pressure-tight with the measurement membrane by means of a joint, formed by said active brazing solder;
the ceramic material of said measurement membrane and said counterpart comprise an aluminum oxide ceramic;
said active brazing solder comprises a Zi-Ni—
Ti—
containing active brazing solder; and
said solder stop layer has a thickness of no more than 0.2 micron;
wherein the preparation of the solder stop layer comprises sputtering or gas phase deposition of the metal, followed by oxidation; and
wherein the oxidation is carried out by heating in an oxygen-containing atmosphere, and said oxidation takes place by heating to a temperature of not less than 500°
C.
2 Assignments
0 Petitions
Accused Products
Abstract
A pressure measurement cell, comprising: a ceramic measurement membrane and a ceramic counterpart. The measurement membrane is joined to the counterpart in a pressure-tight manner forming a pressure chamber between the measurement membrane and the counterpart by means of an active brazing solder. The pressure measurement cell furthermore has a solder stop layer on a surface of the measurement membrane and/or the counterpart, wherein the solder stop layer has a metal oxide or a reduced form of the metal oxide. The metal oxide has at least one oxidation stage, which, assuming an activity coefficient of Rakt=1 at an inverse temperature of 8·10−4/K, has an oxygen coexistence decomposition pressure of not less than 1−23 MPa (10−23· bar) and not more than 1−12 MPa (10−12· bar) and which, assuming an activity coefficient of Rakt=1, at an inverse temperature of 9·10−4/K has an oxygen coexistence decomposition pressure of not less than 1−27 MPa (10−27 bar) and not more than 1−15 MPa (10−15 bar). Suitable metal oxides are, for example, oxides of chromium, tungsten or titanium.
8 Citations
9 Claims
-
1. A method of bonding two ceramic components using an active brazing solder, comprising:
-
providing the two ceramic components; preparing a solder stop layer on at least one surface of at least one ceramic component, which separates a portion of the surface to be wetted by the solder from a portion to be kept free of the solder; providing the active brazing solder between the first and the second ceramic component in the surface areas of the first and of the second component to be wetted by the active brazing solder; heating the ceramic components and the active brazing solder under vacuum up to a temperature at which the active brazing solder melts and reacts with the ceramic components; and allowing the ceramic components to cool down, wherein; the solder stop layer comprises a metal oxide, which has an oxygen coexistence decomposition pressure of not less than 10−
24 MPa (10−
23·
bar) and not more than 10−
13 MPa (10−
12·
bar) at an inverse temperature of 8·
10−
4/K and an oxygen coexistence decomposition pressure of not less than 10−
28 MPa (10−
27 bar) and not more than 10−
16 MPa (10−
15 bar) at an inverse temperature of 9·
10−
4/K;for producing a pressure measurement cell, the first ceramic component comprises a counterpart and a second ceramic component comprises a measurement membrane, wherein the counterpart is connected pressure-tight with the measurement membrane by means of a joint, formed by said active brazing solder; the ceramic material of said measurement membrane and said counterpart comprise an aluminum oxide ceramic; said active brazing solder comprises a Zi-Ni—
Ti—
containing active brazing solder; andsaid solder stop layer has a thickness of no more than 0.2 micron; wherein the preparation of the solder stop layer comprises sputtering or gas phase deposition of the metal, followed by oxidation; and wherein the oxidation is carried out by heating in an oxygen-containing atmosphere, and said oxidation takes place by heating to a temperature of not less than 500°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of bonding two ceramic components using an active brazing solder, comprising:
-
providing the two ceramic components; preparing a solder stop layer on at least one surface of at least one ceramic component, which separates a portion of the surface to be wetted by the solder from a portion to be kept free of the solder; providing the active brazing solder between the first and the second ceramic component in the surface areas of the first and of the second component to be wetted by the active brazing solder; heating the ceramic components and the active brazing solder under vacuum up to a temperature at which the active brazing solder melts and reacts with the ceramic components; and allowing the ceramic components to cool down, wherein; the solder stop layer comprises a metal oxide, which has an oxygen coexistence decomposition pressure of not less than 10−
24 MPa (10−
23 bar) and not more than 10−
13 MPa (10−
12 bar) at an inverse temperature of 8·
10−
4/K and an oxygen coexistence decomposition pressure of not less than 10−
28 MPa (10−
27 bar) and not more than 10−
16 MPa (10−
15 bar) at an inverse temperature of 9·
10−
4/K,the preparation of the solder stop layer comprises sputtering or gas phase deposition of the metal, followed by oxidation, and the oxidation is carried out by heating in an oxygen-containing atmosphere, and said oxidation takes place by heating to a temperature of not less than 500°
C. - View Dependent Claims (9)
-
Specification
-
- Resources
Litigation Campaign Assessment
Thank you for your request. You will receive a custom alert email when the Litigation Campaign Assessment is available.
×
-
Current AssigneeEndress+Hauser SE+Co. KG (Endress+Hauser AG)
-
Original AssigneeEndress+Hauser SE+Co. KG (Endress+Hauser AG)
-
InventorsPonath, Nils, Rossberg, Andreas
-
Primary Examiner(s)Allen, Andre J
-
Application NumberUS14/891,413Publication NumberTime in Patent Office1,890 DaysField of Search73724US Class CurrentCPC Class CodesB23K 35/0238 layeredB23K 35/3606 Borates or B-oxidesC04B 2237/122 based on refractory metalsC04B 2237/127 The active component for bo...C04B 2237/343 Alumina or aluminatesC04B 2237/592 whereby the interlayer is n...C04B 2237/62 Forming laminates or joined...C04B 37/006 consisting of metals or met...G01L 9/0075 using a ceramic diaphragm, ...
