Electromagnetic component and fabrication method thereof

• US 10,332,669 B2
• Filed: 02/13/2015
• Issued: 06/25/2019
• Est. Priority Date: 04/24/2012
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chang, Wei-Chien, Wu, Chia-Chi, Chiang, Lang-Yi, Wu, Tsung-Chan, Yeh, Jih-Hsu
• Primary Examiner(s): Chan, Tszfung J
• Application Number:
  US14/621,409
• Publication Number:
  US 20150155091A1
• Time in Patent Office: 1,593 Days
• Field of Search: 336200, 336232
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/04 for manufacturing coils coils for transformer or inductances H01F27/28
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H01F 5/02 wound on non-magnetic supports, e.g. formers
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.

Claims

1. An electromagnetic component, comprising:

a substrate;

a conductive structure on the substrate, wherein the conductive structure comprises a coil formed in a plurality of conductive layers separated by at least one insulating layer, wherein the plurality of conductive layers comprise at least three conductive layers, wherein a blind via is disposed in a first insulating layer of the at least one insulating layer to electrically connect a first conductive layer and a second conductive layer, wherein a hollow space is formed inside the coil and extended from a top surface of the conductive structure to a bottom surface of the substrate, said hollow space penetrating the plurality of conductive layers and the at least one insulating layer with an inner side surface of the coil in each of the plurality of conductive layers being exposed to the hollow space; and

a magnetic molding body, encapsulating the conductive structure and extending into the hollow space, wherein an outer surface of a first portion of the magnetic molding body disposed inside the hollow space is physically in contact with said inner side surface of the coil in each of the plurality of conductive layers.

2. The electromagnetic component according to claim 1, wherein a first portion of the coil disposed on the first conductive layer has two ending portions to form a first slit therebetween, wherein a first end portion of said two ending portions is electrically connected to the second conductive layer through the blind via.

3. The electromagnetic component according to claim 1, wherein a second portion of the magnetic molding body is physically in contact with a top surface of the coil.

4. The electromagnetic component according to claim 1, wherein the magnetic molding body encapsulating the conductive structure and extending into the hollow space is integrally formed.

5. An electromagnetic component, comprising:

a conductive structure, wherein the conductive structure comprises a coil formed in a plurality of conductive layers separated by a plurality of insulating layers, wherein a second conductive layer is disposed over a first conductive layer and a third conductive layer is disposed over the second conductive layer, wherein a slit is formed between a first end portion and a second end portion of a first coil pattern of the second conductive layer, wherein the first end portion of the first coil pattern is electrically connected to a second coil pattern of the first conductive layer through a first blind via disposed in a first insulating layer of the plurality of insulating layers, and the second end portion of the first coil pattern is electrically connected to a third coil pattern of the third conductive layer through a second blind via disposed in a second insulating layer of the plurality of insulating layers, and wherein a hollow space is formed inside the coil and extended from a top surface to a bottom surface of the conductive structure, said hollow space penetrating the plurality of conductive layers and the plurality of insulating layers with an inner side surface of the coil in each of the plurality of conductive layers being exposed to the hollow space; and

a magnetic molding body, encapsulating the conductive structure and extending into the hollow space, wherein an outer surface of a first portion of the magnetic molding body disposed inside the hollow space is physically in contact with said inner side surface of the coil in each of the plurality of conductive layers.

6. The electromagnetic component according to claim 5, wherein a second portion of the magnetic molding body is physically in contact with a top surface of the coil.