Inductor and manufacturing method thereof

• US 10,332,670 B2
• Filed: 10/09/2017
• Issued: 06/25/2019
• Est. Priority Date: 10/11/2013
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Woon Chul, Kim, Sung Hyun, Cha, Hye Yeon
• Primary Examiner(s): Lian, Mang Tin Bik
• Application Number:
  US15/728,161
• Publication Number:
  US 20180033542A1
• Time in Patent Office: 624 Days
• Field of Search: 336200, 336223, 336192, 336233
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/042 by thin film techniques

Abstract

An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.

Claims

1. An inductor comprising:

a body, including;

a coil support layer,

a conductive coil on a surface, of the coil support layer,

a first insulating layer between adjacent turns of the conductive coil and extending higher than an upper surface of the conductive coil in a stacking direction,

a second insulating layer enclosing the first insulating layer and the conductive coil, and

a cover layer comprising magnetic material and covering the second insulating layer; and

external electrodes on respective end surfaces of the body,

wherein the second insulating layer is not disposed at a lower position than a bottom surface of the conductive coil,

wherein an inner side surface of the innermost coil pattern of the conductive coil is directly covered with the second insulating layer, and

wherein an upper surface of the innermost coil pattern in the stacking direction is covered by the first insulating layer and the second insulating layer, and a portion of the innermost coil pattern not covered by the first insulating layer is covered by the second insulating layer.

2. The inductor of claim 1, wherein the width of the first insulating layer disposed between adjacent turns is smaller than that of the turns of the conductive coil.

3. The inductor of claim 1, wherein a gap interval between adjacent turns of the conductive coil in the conductive coil is substantially filled with the first insulating layer.

4. The inductor of claim 1, wherein the first insulating layer is formed of a material different from that of the second insulating layer.

5. The inductor of claim 1, wherein the first insulating layer encloses one or more turns of the conductive coil.

6. The inductor of claim 5, wherein the first insulating layer covers a portion of an upper surface at least one of an inner coil or outer coil of the conductive coil.

7. The inductor of claim 1, wherein the conductive coil has a spiral shape.

8. The inductor of claim 1, wherein the first insulating layer has an average thickness of about 0.5 μ

m to about 15 μ

m.

9. The inductor of claim 1, wherein the second insulating layer has an average thickness of about 0.5 μ

m to about 15 μ

m.

10. The inductor of claim 1, wherein a gap between adjacent turns of the conductive coil is about 8 μ

m to about 12 μ

m.

11. The inductor of claim 1, wherein the second insulating layer is formed of a material containing epoxy.

12. The inductor of claim 1, wherein the coil support layer is a substrate formed of an insulating material.

13. The inductor of claim 1, wherein the conductive coil has a thickness of about 100 μ

m or more.

14. An inductor comprising:

a body, including;

a coil support layer,

an upper conductive coil on a surface of the coil support layer,

a lower conductive coil on an opposite surface of the coil support layer and connected to the upper conductive coil,

a first upper insulating layer between adjacent turns of the upper conductive coil and extending higher than an upper surface of the upper conductive coil in a stacking direction,

a first lower insulating layer between adjacent turns of the lower conductive coil and extending lower than a lower surface of the lower conductive coil in the stacking direction,

a second upper insulating layer enclosing the first upper insulating layer and the upper conductive coil,

a second lower insulating layer enclosing the first lower insulating layer and the lower conductive coil,

an upper cover layer comprising magnetic material and covering the second upper insulating layer, and

a lower cover layer comprising magnetic material and covering the second lower insulating layer;

a first external electrode on an end surface of the body and connected to the upper conductive coil; and

a second external electrode on an opposite surface of the body and connected to the lower conductive coil,

wherein the second upper insulating layer is not disposed at a lower position than a bottom surface of the upper conductive coil,

wherein the second lower insulating layer is not disposed at a higher position than an upper surface of the lower conductive coil,

wherein an inner side surface of an innermost coil pattern of the upper conductive coil is directly covered with the second upper insulating layer, and

wherein an inner side surface of an innermost coil pattern of the lower conductive coil is directly covered with the second lower insulating layer, and

wherein an upper surface of the innermost coil pattern of the upper conductive coil in the stacking direction is covered by the first upper insulating layer and the second upper insulating layer, and a portion of the innermost coil pattern of the upper conductive coil not covered by the first upper insulating layer is covered by the second upper insulating layer, and

wherein a lower surface of the innermost coil pattern of the lower conductive coil in the stacking direction is covered by the first lower insulating layer and the second lower insulating layer, and a portion of the innermost coil pattern of the lower conductive coil not covered by the first lower insulating layer is covered by the second lower insulating layer.