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Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same

  • US 10,333,019 B2
  • Filed: 05/25/2017
  • Issued: 06/25/2019
  • Est. Priority Date: 05/27/2016
  • Status: Active Grant
First Claim
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1. A package structure, comprising:

  • a lead frame;

    a first light sensor being electrically coupled to said lead frame;

    a light emitter separated from said first light sensor and being electrically coupled to said lead frame;

    a first plastic body which is a transparent plastic body, and configured to cover all or part of said first light sensor and said light emitter and have a trench therein;

    a light-blocking layer located on a side surface of said first plastic body, wherein said first plastic body is divided by said trench into a first portion covering said light emitter and a second portion covering said first light sensor, said first portion of said first plastic body has said side surface facing said first light sensor; and

    a second plastic body made of infrared cutoff materials, and configured to fill gaps between a plurality of inner pins of said lead frame or to be located below said lead frame.

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