Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same
First Claim
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1. A package structure, comprising:
- a lead frame;
a first light sensor being electrically coupled to said lead frame;
a light emitter separated from said first light sensor and being electrically coupled to said lead frame;
a first plastic body which is a transparent plastic body, and configured to cover all or part of said first light sensor and said light emitter and have a trench therein;
a light-blocking layer located on a side surface of said first plastic body, wherein said first plastic body is divided by said trench into a first portion covering said light emitter and a second portion covering said first light sensor, said first portion of said first plastic body has said side surface facing said first light sensor; and
a second plastic body made of infrared cutoff materials, and configured to fill gaps between a plurality of inner pins of said lead frame or to be located below said lead frame.
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Abstract
A package structure and a method for manufacturing the same are disclosed. The package structure includes a first plastic body which covers a first light sensor and a light emitter, and a second plastic body which is made of infrared cutoff materials and fills inner pins of a lead frame or is formed below the lead frame. A trench is formed in the first plastic body so that a light-blocking layer is located on a side surface of the first plastic body. The second plastic body and the light-blocking layer are used to avoid influence of infrared light on a first light sensor.
12 Citations
23 Claims
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1. A package structure, comprising:
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a lead frame; a first light sensor being electrically coupled to said lead frame; a light emitter separated from said first light sensor and being electrically coupled to said lead frame; a first plastic body which is a transparent plastic body, and configured to cover all or part of said first light sensor and said light emitter and have a trench therein; a light-blocking layer located on a side surface of said first plastic body, wherein said first plastic body is divided by said trench into a first portion covering said light emitter and a second portion covering said first light sensor, said first portion of said first plastic body has said side surface facing said first light sensor; and a second plastic body made of infrared cutoff materials, and configured to fill gaps between a plurality of inner pins of said lead frame or to be located below said lead frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a package structure, comprising:
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providing a lead frame; mounting a first light sensor and a light emitter, which are mounted separately but both are electrically coupled to said lead frame; forming a first plastic body which is a transparent plastic body, and covers all or part of said first light sensor and said light emitter; forming a trench in said first plastic body, wherein said first plastic body is divided by said trench into a first portion covering said light emitter and a second portion covering said first light sensor, said first portion of said first plastic body has a side surface facing said first light sensor; forming a light light-blocking layer on said side surface; and forming a second plastic body which is made of infrared cutoff materials, and fills inner pins of said lead frame or is formed below said lead frame. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification