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Methods for magnetic sensor having non-conductive die paddle

  • US 10,333,055 B2
  • Filed: 03/02/2017
  • Issued: 06/25/2019
  • Est. Priority Date: 01/16/2012
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • employing a conductive leadframe;

    forming a non-conductive die paddle in relation to the leadframe;

    placing a die on the non-conductive die paddle to form an assembly;

    forming at least one electrical connection between the die and the leadframe;

    coupling a magnetic transducer to the die;

    molding a magnetic layer within the die paddle; and

    overmolding the assembly to form an integrated circuit package.

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