Methods for magnetic sensor having non-conductive die paddle

• US 10,333,055 B2
• Filed: 03/02/2017
• Issued: 06/25/2019
• Est. Priority Date: 01/16/2012
• Status: Active Grant

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Milano, Shaun D., Doogue, Michael C., Taylor, William P.
• Primary Examiner(s): Ngo, Ngan V
• Application Number:
  US15/447,320
• Publication Number:
  US 20170179377A1
• Time in Patent Office: 845 Days
• CPC Class Codes: G01R 33/0029 Treating the measured signals, e.g. removing offset or noise
• CPC Class Codes: G01R 33/0052 Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips devices based on galvano-magnetic effect or the like H10N50/85
• CPC Class Codes: G01R 33/0076 Protection, e.g. with housings against stray fields
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: G01R 33/09 Magnetoresistive devices
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49506 an insulative substrate being used as a diepad, e.g. ceramic, plastic H01L23/49531 takes precedence
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H10N 50/01 : Manufacture or treatment
• CPC Class Codes: H10N 50/10 : Magnetoresistive devices
• CPC Class Codes: H10N 50/80 : Constructional details
• CPC Class Codes: H10N 52/00 : Hall-effect devices integrated devices or assemblies of multiple devices H10N59/00
• CPC Class Codes: H10N 52/01 : Manufacture or treatment
• CPC Class Codes: H10N 52/101 : Semiconductor Hall-effect devices
• CPC Class Codes: H10N 52/80 : Constructional details

Abstract

Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Claims

1. A method, comprising:

employing a conductive leadframe;

forming a non-conductive die paddle in relation to the leadframe;

placing a die on the non-conductive die paddle to form an assembly;

forming at least one electrical connection between the die and the leadframe;

coupling a magnetic transducer to the die;

molding a magnetic layer within the die paddle; and

overmolding the assembly to form an integrated circuit package.

2. The method according to claim 1, further including forming the non-conductive die paddle from a plastic material.

3. The method according to claim 2, further including molding the plastic die paddle.

4. The method according to claim 3, wherein the leadframe does not overlap with the die.

5. The method according to claim 1, wherein the magnetic transducer does not overlap with any of the leadframe.

6. The method according to claim 1, further including overmolding the die paddle, the die, and the magnetic layer.

10. The method according to claim 1, wherein a first surface of the leadframe and a first surface of the die are substantially coplanar.

7. A method, comprising:

employing a conductive leadframe;

forming a non-conductive die paddle in relation to the leadframe;

placing a die on the non-conductive die paddle to form an assembly;

forming at least one electrical connection between the die and the leadframe;

overmolding the assembly to form an integrated circuit package;

positioning a Hall element in the die; and

molding a magnetic layer within the die paddle.

8. A method, comprising:

employing a conductive leadframe;

forming a non-conductive die paddle in relation to the leadframe;

placing a die on the non-conductive die paddle to form an assembly;

forming at least one electrical connection between the die and the leadframe;

overmolding the assembly to form an integrated circuit package;

positioning a magnetoresistive element; and

molding a magnetic layer within the die paddle.

9. A method, comprising:

employing a conductive leadframe;

forming a non-conductive die paddle in relation to the leadframe;

placing a die on the non-conductive die paddle to form an assembly;

forming at least one electrical connection between the die and the leadframe;

coupling a magnetic transducer to the die;

molding a magnetic layer within the die paddle;

overmolding the assembly to form an integrated circuit package; and

employing a non-conductive adhesive to secure the die to the die-paddle, wherein a material comprising the non-conductive die-paddle substantially eliminates eddy current flow in the die paddle.

11. A method, comprising:

employing a conductive leadframe;

positioning a non-conductive die paddle in relation to the leadframe;

positioning a die in relation to the die paddle;

coupling a magnetic transducer to the die, wherein a cross section of the device through the magnetic transducer consists of non-conductive materials; and

molding a magnetic layer within the die paddle.

12. A method, comprising:

employing a conductive leadframe;

positioning a non-conductive die paddle in relation to the leadframe, wherein the die paddle comprises a plastic material;

positioning a die in relation to the die paddle;

coupling a magnetic transducer to the die, wherein the magnetic transducer does not overlap with any conductive material;

forming at least one electrical connection from the die to the leadframe; and

molding a magnetic layer within the die paddle.