LED lighting systems and methods
First Claim
1. An LED lighting system comprising:
- a flexible layered circuit structure comprisinga top thermally conductive layer;
a middle electrically insulating layer;
a bottom thermally conductive layer;
a plurality of light emitting diodes mounted on the top layer;
a housing substrate;
a mounting structure, the mounting structure comprising an engagement member that grips the flexible layered circuit structure, the mounting structure suspending the layered circuit structure above the housing substrate such that an air gap is disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, the air gap having a long dimension and a short dimension approximately orthogonal to the long dimension such that the long dimension is longer than the short dimension, where the air gap is open to at least one side of the long dimension of the flexible layered circuit structure, and wherein the distance between the layered circuit structure and the housing substrate is at least about 0.5 mm; and
wherein the mounting structure exerts tension outward on the flexible layered circuit structure along the lengthwise axis of the flexible layered circuit structure away from a middle of the flexible layered circuit structure.
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Abstract
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.
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Citations
28 Claims
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1. An LED lighting system comprising:
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a flexible layered circuit structure comprising a top thermally conductive layer; a middle electrically insulating layer; a bottom thermally conductive layer; a plurality of light emitting diodes mounted on the top layer; a housing substrate; a mounting structure, the mounting structure comprising an engagement member that grips the flexible layered circuit structure, the mounting structure suspending the layered circuit structure above the housing substrate such that an air gap is disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, the air gap having a long dimension and a short dimension approximately orthogonal to the long dimension such that the long dimension is longer than the short dimension, where the air gap is open to at least one side of the long dimension of the flexible layered circuit structure, and wherein the distance between the layered circuit structure and the housing substrate is at least about 0.5 mm; and wherein the mounting structure exerts tension outward on the flexible layered circuit structure along the lengthwise axis of the flexible layered circuit structure away from a middle of the flexible layered circuit structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. An LED lighting system comprising:
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a flexible layered circuit structure comprising a top thermally conductive layer; a middle electrically insulating layer; a bottom thermally conductive layer; a plurality of light emitting diodes mounted on the bottom layer; a housing substrate; a mounting structure suspending the layered circuit structure above the housing substrate by connecting to a top layer of the housing substrate and a bottom layer of the flexible layered circuit structure, where the mounting structure supports the layered circuit structure such that the top surface of the layered circuit structure and the bottom surface of the layered circuit structure are substantially open to surrounding air, and where the top layer of the housing substrate and a bottom layer of the flexible layered circuit structure approximately face one another, with an air gap disposed in between bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, wherein the distance between the layered circuit structure and the housing substrate is at least about 0.5 mm; and wherein the mounting structure exerts tension on the flexible layered circuit structure in a direction away from the middle of the flexible layered circuit structure along the lengthwise axis of the flexible layered circuit structure such that it is maintained taut.
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Specification