Transducer device comprising an insulating film between a through wiring line and a semiconductor substrate

• US 10,338,034 B2
• Filed: 12/22/2015
• Issued: 07/02/2019
• Est. Priority Date: 12/25/2014
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Wang, Shinan, Setomoto, Yutaka
• Primary Examiner(s): Huls, Natalie
• Application Number:
  US14/978,526
• Publication Number:
  US 20160187299A1
• Time in Patent Office: 1,288 Days
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: B06B 1/0644 using a single piezoelectric element B06B1/0688 takes precedence
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: G01N 29/2406 Electrostatic or capacitive probes, e.g. electret or cMUT-probes
• CPC Class Codes: G01N 29/2418 using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics photoacoustic cells G01N21/1702; measuring characteristics of vibrations by using radiation-sensitive means G01H9/00; acousto-optical conversion techniques for short-range imaging G01S15/8965; sound-producing devices using laser bundle G10K15/046
• CPC Class Codes: G01N 29/2437 Piezoelectric probes

Abstract

A method for creating an electronic device including a semiconductor substrate, an element unit, a through wiring line, and a wiring portion includes forming interstitial via holes in a first surface of the substrate, forming a first insulating film on the inner walls of the via holes, forming openings that reach the first insulating film on the bottoms of the via holes from a second surface of the substrate, forming a second insulating film on the bottoms of the openings, forming a through wiring line in the via holes, forming an element unit that electrically connects the through wiring line, reducing the thickness of the substrate from the second surface so that the second surface becomes flush with the second insulating film on the bottoms of the openings, and forming a wiring portion, on the second insulating film, that electrically connects to the through wiring line.

Claims

1. A device comprising:

a semiconductor substrate including a first surface and a second surface opposite to the first surface;

a through wiring line passing through the substrate between the first surface and the second surface;

electrodes electrically connected to the through wiring line; and

an insulating film is disposed between the through wiring line and the semiconductor substrate,

wherein the insulating film is a silicon oxide film, and wherein a silicon nitride film is disposed between the through wiring line and the semiconductor substrate.

2. The device according to claim 1, wherein the device comprises a capacitive micro-machined ultrasonic transducer.

3. A subject-information acquisition apparatus comprising:

the transducer according to claim 2; and

a processing unit configured to acquire information on a subject using an electrical signal output from the transducer,

wherein the transducer receives acoustic waves from the subject and converts the acoustic waves to the electrical signal.

4. The subject-information acquisition apparatus according to claim 3, further comprising:

a light source,

wherein the transducer receives photoacoustic waves generated from the subject irradiated with light emitted from the light source and converts the photoacoustic waves to an electrical signal, and

wherein the processing unit acquires information on the subject using the electrical signal.

5. A subject-information acquisition apparatus comprising:

the transducer according to claim 2;

a light source; and

a processing unit configured to acquire information of a subject using an electrical signal output from the transducer,

wherein the transducer receives acoustic waves generated from the subject irradiated with light emitted from the light source and converts the acoustic waves to the electrical signal.

6. A measuring apparatus comprising:

the transducer configured to receive external force according to claim 2,

wherein the measuring apparatus measures a magnitude of the external force applied to a surface of the transducer using an electrical signal from the transducer.

7. The device according to claim 1, wherein the device comprises a piezoelectric transducer.

8. A subject-information acquisition apparatus comprising:

the transducer according to claim 7; and

a processing unit configured to acquire information on a subject using an electrical signal output from the transducer,

wherein the transducer receives acoustic waves from the subject and converts the acoustic waves to the electrical signal.

9. The subject-information acquisition apparatus according to claim 8, further comprising:

a light source,

wherein the transducer receives photoacoustic waves generated from the subject irradiated with light emitted from the light source and converts the photoacoustic waves to an electrical signal, and

wherein the processing unit acquires information on the subject using the electrical signal.

10. A subject-information acquisition apparatus comprising:

the transducer according to claim 7;

a light source; and

a processing unit configured to acquire information of a subject using an electrical signal output from the transducer,

wherein the transducer receives acoustic waves generated from the subject irradiated with light emitted from the light source and converts the acoustic waves to the electrical signal.

11. A measuring apparatus comprising:

the transducer configured to receive external force according to claim 7,

wherein the measuring apparatus measures a magnitude of the external force applied to a surface of the transducer using an electrical signal from the transducer.

12. The device according to claim 1, wherein the silicon nitride film is formed by a LP-CVD method.

13. The device according to claim 1, wherein a thermal oxide layer is disposed only in a part of the first surface or a part of the second surface.

14. The device according to claim 1, wherein the substrate has a thickness of 300 μ

m or less.

15. A device comprising:

a semiconductor substrate including a first surface and a second surface opposite to the first surface;

a through wiring line passing through the substrate between the first surface and the second surface;

electrodes electrically connected to the through wiring line; and

an insulating film between the through wiring line and the semiconductor substrate, the insulating film being a high dielectric strength film formed at a temperature of 800°

C. or higher and being one or more layers of a silicon thermal oxide film formed by thermal oxidation,

wherein a silicon nitride film is disposed between the through wiring line and the semiconductor substrate.

16. The device according to claim 15, wherein the insulating film is one or more layers of a silicon nitride film formed by CVD.

17. The device according to claim 15, wherein the insulating film is heat resistant at least at temperatures less than or equal to 400°

C.

18. The device according to claim 15, wherein the substrate has a thickness of 300 μ

m or less.