Current sense accuracy improvement for MOSFET RDS (on) sense based voltage regulator by adaptive temperature compensation
First Claim
1. An Information Handling System (IHS) having temperature-compensated power control, the IHS comprising:
- a computing component;
a voltage regulation (VR) module comprising;
an integrated circuit die;
a power stage component contained in the integrated circuit die and comprising a high side driver and a low side driver both electrically connected to power the computing component with voltage-regulated power;
a current sensor contained in the integrated circuit die to measure a monitored current (Imon) value of the voltage-regulated power; and
a temperature sensor contained in the integrated circuit die and which measures a temperature value at one location of the integrated circuit die, wherein the temperature value sensed at the location has a nonlinear temperature coefficient relationship with a second temperature of the high side driver; and
a VR controller in communication with the current sensor and the temperature sensor and which executes instructions that configure the VR controller to;
receive the Imon value from the current sensor;
receive the temperature value from the temperature sensor;
determine a temperature-compensated Imon value based at least in part on the Imon value, the temperature value, and an empirically-derived temperature coefficient defined at the Imon value and the temperature value, the empirically-derived temperature coefficient being determined by a testing phase wherein a testing system;
identifies an identifier (ID) for a power stage (Pstage) of the integrated circuit;
performs an iterative process for thermal coefficient tuning, which records temperature and an Iout matrix;
empirically captures sample values as an integrated circuit die temperature of the VR module continues to rise across an operating temperature range of the VR module;
samples output current (Iout) and forms an output current matrix as an array, based on sampled output voltage and defined temperature points; and
in response to completion of the iterative process, generates, by the testing system, a nonlinear thermal coefficient, current offset curve by performing one of;
(i) calculating piecewise linear values to extrapolate between sampled values stored within an empirical database;
or (ii) performing high-order polynomial curve fitting to extrapolate between the sampled values within the empirical database, wherein the empirical database is processed to create a look-up table that stores temperature coupling coefficients that provides fine-tuned temperature compensation for Imon across a VR operation range; and
control the voltage-regulated power at least in part based on the temperature-compensated Imon value determined at least in part by the empirically-derived temperature coefficient.
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Accused Products
Abstract
An information handling system (IHS) includes temperature-compensated power control by a voltage regulation (VR) module to: (i) receive a monitored current (Imon) value from a current sensor integrated into the VR module; (ii) receive a temperature value from the temperature sensor also integrated into the VR module; (iii) determine a temperature-compensated Imon value based at least in part on the Imon value, the temperature value, and an empirically-derived temperature coefficient defined at the Imon value and the temperature value; and (iv) control the voltage-regulated power at least in part based on the temperature-compensated Imon value. The empirically-derived temperature coefficient adjusts for nonlinear portions of temperature coupling relationship between a portion of an integrated circuit (IC) die that can include the current sensor and the temperature sensor and a temperature experienced by by active portion of VR module.
23 Citations
16 Claims
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1. An Information Handling System (IHS) having temperature-compensated power control, the IHS comprising:
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a computing component; a voltage regulation (VR) module comprising; an integrated circuit die; a power stage component contained in the integrated circuit die and comprising a high side driver and a low side driver both electrically connected to power the computing component with voltage-regulated power; a current sensor contained in the integrated circuit die to measure a monitored current (Imon) value of the voltage-regulated power; and a temperature sensor contained in the integrated circuit die and which measures a temperature value at one location of the integrated circuit die, wherein the temperature value sensed at the location has a nonlinear temperature coefficient relationship with a second temperature of the high side driver; and a VR controller in communication with the current sensor and the temperature sensor and which executes instructions that configure the VR controller to; receive the Imon value from the current sensor; receive the temperature value from the temperature sensor; determine a temperature-compensated Imon value based at least in part on the Imon value, the temperature value, and an empirically-derived temperature coefficient defined at the Imon value and the temperature value, the empirically-derived temperature coefficient being determined by a testing phase wherein a testing system; identifies an identifier (ID) for a power stage (Pstage) of the integrated circuit; performs an iterative process for thermal coefficient tuning, which records temperature and an Iout matrix; empirically captures sample values as an integrated circuit die temperature of the VR module continues to rise across an operating temperature range of the VR module; samples output current (Iout) and forms an output current matrix as an array, based on sampled output voltage and defined temperature points; and in response to completion of the iterative process, generates, by the testing system, a nonlinear thermal coefficient, current offset curve by performing one of;
(i) calculating piecewise linear values to extrapolate between sampled values stored within an empirical database;
or (ii) performing high-order polynomial curve fitting to extrapolate between the sampled values within the empirical database, wherein the empirical database is processed to create a look-up table that stores temperature coupling coefficients that provides fine-tuned temperature compensation for Imon across a VR operation range; andcontrol the voltage-regulated power at least in part based on the temperature-compensated Imon value determined at least in part by the empirically-derived temperature coefficient. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of performing temperature-compensated power control of an information handling system (IHS), the method comprising:
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measuring, by a current sensor contained in an integrated circuit die, a monitored current (Imon) value of voltage-regulated power by a power stage having a high side driver and a low side driver contained in the integrated circuit die; measuring a temperature value using a temperature sensor at one location of the integrated circuit die having a nonlinear temperature coefficient with the high side driver; retrieving an empirically-derived temperature coefficient at the Imon value and the temperature value, the empirically-derived temperature coefficient being determined by a testing phase comprising; identifying an identifier (ID) for a power stage (Pstage) of the integrated circuit; performing, by a testing system, an iterative process for thermal coefficient tuning, which records temperature and an Iout matrix; empirically capturing sample values as an integrated circuit die temperature of the VR module continues to rise across an operating temperature range of the VR module; sampling, by the testing system, output current (Iout); forming an array based on defined temperature points; and in response to completion of the iterative process, generating, by the testing system, a nonlinear thermal coefficient, current offset curve by performing one of;
(i) calculating piecewise linear values to extrapolate between sampled values stored within an empirical database;
or (ii) performing high-order polynomial curve fitting to extrapolate between the sampled values within the empirical database, wherein the empirical database is processed to create a look-up table for temperature coupling coefficients that provides fine-tuned temperature compensation for Imon across a VR operation range;determining a temperature-compensated Imon value based at least in part on the Imon value and the temperature value; and controlling a level of the voltage-regulated power at least in part based on the temperature-compensated Imon value determined at least in part by the empirically-derived temperature coefficient. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification