Timing exact design conversions from FPGA to ASIC
First Claim
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1. A method comprising:
- accessing programming data for a programmable logic design to meet a plurality of design specifications; and
altering a programming data layer of the programmable logic design to form a hard-wired design that meets the plurality of design specifications, said altering including;
based on the programming data, determining a plurality of interconnects between the programming data layer and at least one of a plurality of input programming nodes of a programmable circuit layer of the programmable logic design and determining a plurality of individual logic values provided by a respective one of the plurality of interconnects; and
based on the plurality of individual logic values, replacing the programming data layer with a wire pattern layer hard-wired to a first portion of the plurality of interconnects to provide a logic high and hard-wired to a second portion of the plurality of interconnects to provide a logic low.
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Abstract
A device having a design conversion from a field programmable gate array (FPGA) to an application specific integrated circuit (ASIC), comprising: a user configurable element in the FPGA replaced by a mask configurable element in the ASIC, wherein the FPGA and the ASIC have identical die size and identical transistor layouts.
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Citations
20 Claims
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1. A method comprising:
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accessing programming data for a programmable logic design to meet a plurality of design specifications; and altering a programming data layer of the programmable logic design to form a hard-wired design that meets the plurality of design specifications, said altering including; based on the programming data, determining a plurality of interconnects between the programming data layer and at least one of a plurality of input programming nodes of a programmable circuit layer of the programmable logic design and determining a plurality of individual logic values provided by a respective one of the plurality of interconnects; and based on the plurality of individual logic values, replacing the programming data layer with a wire pattern layer hard-wired to a first portion of the plurality of interconnects to provide a logic high and hard-wired to a second portion of the plurality of interconnects to provide a logic low. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A plurality of semiconductor devices comprising:
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a programmable logic device including a first programming data layer, a first programmable circuit layer comprising a plurality of first input programming nodes, and a plurality of first interconnects between the first programming data layer and at least one of the plurality of first input programming nodes, wherein the programmable logic device is configured to receive programming data to meet a plurality of design specifications; and a hard-wired logic device configured to meet the plurality of design specifications and including; a second programmable circuit layer with common design relative to the first programmable circuit layer and comprising a plurality of second input programming nodes; a wire pattern layer based on the programming data; and a plurality of second interconnects between the wire pattern layer and at least one of the plurality of second input programming nodes and with common design relative to the plurality of first interconnects, wherein the wire pattern layer is hard-wired to a first portion of the plurality of second interconnects to provide a logic high and is hard-wired to a second portion of the plurality of second interconnects to provide a logic low. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A non-transitory computer-readable storage device comprising a plurality of computer-executable instructions stored therein, wherein the plurality of computer-executable instructions comprise:
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instructions to provide a programmable logic design including a first programming data layer, a first programmable circuit layer comprising a plurality of first input programming nodes, and a plurality of first interconnects between the first programming data layer and at least one of the plurality of first input programming nodes; instructions to provide programming data for the programmable logic design to meet a plurality of design specifications; and instructions to provide a hard-wired logic design configured to meet the plurality of design specifications and including; a second programmable circuit layer with common design relative to the first programmable circuit layer and comprising a plurality of second input programming nodes; a wire pattern layer based on the programming data; and a plurality of second interconnects between the wire pattern layer and at least one of the plurality of second input programming nodes and with common design relative to the plurality of first interconnects, wherein the wire pattern layer is hard-wired to a first portion of the plurality of second interconnects to provide a logic high and is hard-wired to a second portion of the plurality of second interconnects to provide a logic low. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification