×

Mechanical couplings designed to resolve process constraints

  • US 10,340,152 B1
  • Filed: 12/29/2017
  • Issued: 07/02/2019
  • Est. Priority Date: 12/29/2017
  • Status: Active Grant
First Claim
Patent Images

1. An integrated circuit package, comprising:

  • a shunt resistor having at least one self-aligning member that protrudes from a first surface of the shunt resistor; and

    a lead frame having at least one self-aligning feature, wherein the self-aligning feature is a cavity extending from a first surface of the lead frame facing the first surface of the shunt resistor and the at least one self-aligning member is located within the cavity that form the at least one self-aligning feature; and

    an integrated circuit located on said lead frame.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×