Mechanical couplings designed to resolve process constraints

• US 10,340,152 B1
• Filed: 12/29/2017
• Issued: 07/02/2019
• Est. Priority Date: 12/29/2017
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Chien, Yuh-Harng, Chou, Hung-Yu, Lee, Fu-Kang, Kummerl, Steven Alfred
• Primary Examiner(s): Chaudhari, Chandra
• Application Number:
  US15/857,988
• Publication Number:
  US 20190206699A1
• Time in Patent Office: 550 Days
• Field of Search: None
• CPC Class Codes: H01L 21/4825 Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 23/49517 Additional leads
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 24/00 Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

Claims

1. An integrated circuit package, comprising:

a shunt resistor having at least one self-aligning member that protrudes from a first surface of the shunt resistor; and

a lead frame having at least one self-aligning feature, wherein the self-aligning feature is a cavity extending from a first surface of the lead frame facing the first surface of the shunt resistor and the at least one self-aligning member is located within the cavity that form the at least one self-aligning feature; and

an integrated circuit located on said lead frame.

2. The integrated circuit package of claim 1, wherein the cavity is a through hole that extends from the first side of the lead frame through a second side of the lead frame that is opposite the first side of the lead frame.

3. The integrated circuit package of claim 2, wherein an outermost surface of the at least one self-aligning member has a surface area that is greater than a surface area of the self-aligning feature of the lead frame.

4. The integrated circuit package of claim 1, wherein the at least one self-aligning member is affixed to the self-aligning feature of the lead frame by solder coupling.

5. The integrated circuit package of claim 1, wherein the shunt resistor has at least four self-aligning members.

6. An amplifier comprising:

an integrated circuit package comprising;

a shunt resistor having at least two self-aligning members, each self-aligning member being formed from the shunt resistor material and as protrusions from a first surface of the shunt resistor; and

a lead frame having at two least self-aligning features, wherein the self-aligning features are through holes extending from a first surface of the lead frame facing the first surface of the shunt resistor through a second surface of the lead frame opposite the first surface,

wherein each of the at least two self-aligning members are located within and through a respective self-aligning feature; and

an integrated circuit located on said lead frame.

7. The amplifier of claim 6, wherein at least a portion of at least one of the self-aligning members that extends past the self-aligning feature has a larger surface area than a surface area of the self-aligning feature of the lead frame.

8. The amplifier of claim 6, wherein each of the at least two self-aligning members are affixed to the self-aligning features of the lead frame by solder coupling.

9. The amplifier of claim 6, wherein the shunt resistor has at least four self-aligning members.