Sensor module with blade insert

• US 10,340,211 B1
• Filed: 03/15/2018
• Issued: 07/02/2019
• Est. Priority Date: 03/15/2018
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Suwankasab, Chanon, Saiyajitara, Amornthep, Saklang, Chayathorn, Hooper, Stephen Ryan
• Primary Examiner(s): Diaz, Jose R
• Application Number:
  US15/922,873
• Time in Patent Office: 474 Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/00 Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/45664 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/02 : Containers; Seals H01L23/12, H01L23/34, H01L23/48, H01L23/552, H01L23/66 take precedence; for memories G11C
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49503 : characterised by the die pad
• CPC Class Codes: H01L 23/49541 : Geometry of the lead-frame
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/49589 : Capacitor integral with or on the leadframe
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/165 : Containers
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

Claims

1. A sensor module, comprising:

a dual gauge lead frame, the lead frame including;

a die pad,

a plurality of lead fingers spaced around the die pad and extending generally perpendicularly thereto, wherein each of the lead fingers has a proximal end near to the die pad and a distal end farther from the die pad, and

two or more blade-type leads having proximal ends connected to the distal ends of two or more of the plurality of lead fingers, wherein the die pad and the plurality of lead fingers have a first thickness and the blade-type leads have a second thickness that is greater than the first thickness;

a first semiconductor die attached on a top surface of the die pad;

first electrical connections connecting electrodes on an active surface of the first semiconductor die to the proximal ends of respective ones of the plurality of lead fingers;

a plurality of passive devices, each passive device mounted on and connected across respective pairs of the plurality of lead fingers;

a mold compound covering the die pad, the first semiconductor die, the plurality of passive devices, the first electrical connections, and the proximal ends of the plurality of lead fingers and the two or more blade-type leads, wherein the mold compound forms a generally rectangular molded body.

2. The sensor module of claim 1, wherein the blade-type leads extend only from one side of the molded body.

3. The sensor module of claim 2, wherein the plurality of lead fingers extend from one other side of the molded body.

4. The sensor module of claim 3, wherein the blade-type leads transmit and receive functional signals and the plurality of lead fingers transmit and receive test signals.

5. The sensor module of claim 3, wherein the plurality of lead fingers extend a first distance from the molded body and the blade-type leads extend a second distance from the molded body that is greater than the first distance.

6. The sensor module of claim 5, wherein the first distance is less than 1 mm and the second distance is less than 10 mm.

7. The sensor module of claim 2, wherein the plurality of lead fingers extend from at least two other sides of the molded body.

8. The sensor module of claim 1, wherein the proximal ends of the blade-type leads are integral with the distal ends of the two or more of the plurality of lead fingers.

9. The sensor module of claim 1, wherein the first thickness is about 0.25 mm and the second thickness is less than 0.64 mm.

10. The sensor module of claim 1, wherein at least the distal ends of the lead fingers and the blade-type leads are plated with a metal or a metal alloy.

11. The sensor module of claim 1, further comprising a sensor housing within which the molded body and the distal ends of the plurality of lead fingers are encased.

12. The sensor module of claim 1, further comprising:

a second semiconductor die attached on a top side of the first semiconductor die; and

second electrical connections connecting the second semiconductor die to at least one of the first semiconductor die and at least one of the lead fingers,

wherein the first semiconductor die comprises an application specific integrated circuit (ASIC) and the second semiconductor die comprises an acceleration sensor.

13. The sensor module of claim 1, wherein the first and second electrical connections comprise bond wires.

14. A method of assembling a sensor module, the method comprising:

providing a dual gauge lead frame, the lead frame including;

a die pad,

a plurality of lead fingers spaced around the die pad and extending generally perpendicularly thereto, wherein each of the lead fingers has a proximal end near to the die pad and a distal end farther from the die pad, and

two or more blade-type leads connected to the distal ends of two or more of the plurality of lead fingers, wherein the die pad and the plurality of lead fingers have a first thickness and the blade-type leads have a second thickness that is greater than the first thickness;

attaching a first semiconductor die to the die pad;

electrically connecting electrodes on an active surface of the first semiconductor die to the proximal ends of respective ones of the plurality of lead fingers;

mounting and electrically connecting a plurality of passive devices across respective pairs of the plurality of lead fingers; and

covering the die pad, the first semiconductor die, the passive devices, the electrical connections, and the proximal ends of the plurality of lead fingers and the two or more blade-type leads with a mold compound, thereby forming a generally rectangular molded body.

15. The method of claim 14, wherein the blade-type leads extend only from one side of the molded body.

16. The method of claim 15, wherein the plurality of lead fingers extend from one other side of the molded body.

17. The method of claim 16, wherein the plurality of lead fingers extend a first distance from the molded body and the blade-type leads extend a second distance from the molded body that is greater than the first distance.

18. The method of claim 14, wherein the proximal ends of the blade-type leads are attached to the distal ends of respective ones of the plurality of lead fingers.

19. The method of claim 14, further comprising encasing the molded body in a housing, thereby forming the sensor module.

20. The method of claim 14, further comprising:

attaching a second semiconductor die on a top side of the first semiconductor die; and

electrically connecting the second semiconductor die to at least one of the first semiconductor die and at least one of the lead fingers,

wherein the first semiconductor die comprises an application specific integrated circuit (ASIC) and the second semiconductor die comprises an acceleration sensor.