Semiconductor package with three-dimensional antenna
First Claim
Patent Images
1. A semiconductor package, comprising:
- a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region;
a semiconductor die disposed on the package substrate in the first region;
a conductive shielding element disposed on the package substrate and covering the semiconductor die; and
a three-dimensional (3D) antenna, comprising;
a planar structure portion disposed on the package substrate in the second region; and
a bridge structure portion above the planar structure portion and connected thereto,wherein the first bar pattern has an end in the first region to serve as a feeding point of the 3D antenna, andwherein the conductive shielding element has an opening formed in a sidewall thereof, such that the first bar pattern passes through the conductive shielding element via the opening.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region, a semiconductor die disposed on the package substrate in the first region, a conductive shielding element disposed on the package substrate and covering the semiconductor die, and a three-dimensional (3D) antenna. The 3D antenna includes a planar structure portion disposed on the package substrate in the second region, and a bridge structure portion above the planar structure portion and connected thereto.
19 Citations
18 Claims
-
1. A semiconductor package, comprising:
-
a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region; a semiconductor die disposed on the package substrate in the first region; a conductive shielding element disposed on the package substrate and covering the semiconductor die; and a three-dimensional (3D) antenna, comprising; a planar structure portion disposed on the package substrate in the second region; and a bridge structure portion above the planar structure portion and connected thereto, wherein the first bar pattern has an end in the first region to serve as a feeding point of the 3D antenna, and wherein the conductive shielding element has an opening formed in a sidewall thereof, such that the first bar pattern passes through the conductive shielding element via the opening. - View Dependent Claims (2, 3, 4)
-
-
5. A semiconductor package, comprising:
-
a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region; a molding compound disposed on the package substrate in the first and second regions; a semiconductor die disposed on the package substrate in the first region and inside the molding compound; a three-dimensional (3D) antenna, comprising; a planar structure portion on the package substrate in the second region; and a wall structure portion contacting the planar structure portion and covering a top surface or one of sidewalls of the molding compound in the second region; and a conductive shielding element disposed on the package substrate to cover the semiconductor die, wherein the bar pattern has one end in the first region to serve as a feeding point of the 3D antenna, wherein a spacer portion of the conductive shielding element has an opening formed in a sidewall thereof, such that the bar pattern passes through the spacer portion via the opening. - View Dependent Claims (6, 7, 8, 9, 10)
-
-
11. A semiconductor package assembly, comprising:
-
a printed circuit board (PCB) having a keep-out region; a package substrate disposed on the PCB, wherein the package substrate has a first region and a second region defined between an edge of the package substrate and an edge of the first region and corresponding to the keep-out region; a semiconductor die disposed on the package substrate in the first region; a conductive shielding element disposed on the package substrate and covering the semiconductor die; a three-dimensional (3D) antenna, comprising; a planar structure portion disposed on the package substrate in the second region; and a bridge structure portion above the planar structure portion and connected thereto; and a molding compound encapsulating the conductive shielding element and the 3D antenna, wherein the first bar pattern has an end in the first region to serve as a feeding point of the 3D antenna and the second bar pattern is parallel to the first bar pattern and grounded via the package substrate, wherein the conductive shielding element has an opening formed in a sidewall thereof, such that the first bar pattern passes through the conductive shielding element via the opening. - View Dependent Claims (12, 13)
-
-
14. A semiconductor package assembly, comprising:
-
a printed circuit board (PCB) having a keep-out region; a package substrate disposed on the PCB, wherein the package substrate has a first region and a second region defined between an edge of the package substrate and an edge of the first region and corresponding to the keep-out region; a molding compound disposed on the package substrate in the first and second regions; a semiconductor die disposed on the package substrate in the first region and inside the molding compound; a three-dimensional (3D) antenna, comprising; a planar structure portion on the package substrate in the second region; and a wall structure portion contacting the planar structure portion and covering a top surface or one of sidewalls of the molding compound in the second region; and a conductive shielding element disposed on the package substrate to cover the semiconductor die, wherein the bar pattern has one end in the first region to serve as a feeding point of the 3D antenna and the spiral pattern has an end to serve as an open end of the 3D antenna, wherein a spacer portion of the conductive shielding element has an opening formed in a sidewall thereof, such that the bar pattern passes through the spacer portion via the opening. - View Dependent Claims (15, 16, 17, 18)
-
Specification