Tooling for coupling multiple electronic chips
First Claim
1. A method comprising:
- depositing, in physical contact with at least a portion of multiple chips, a temperature-conductive liquidus or gel material on a rigid body;
hardening the temperature-conductive liquidus or gel material to constrain at least a portion of each of the multiple chips such that the hardened material and the multiple chips behave as part of the rigid body;
bringing a bonding surface of each of the multiple chips into contact with a bonding surface of an element, by uniformly applying a force on the rigid body to place the multiple chips under pressure without causing damage to the multiple chips or the bonding surface of the element; and
removing all of the hardened material from contact with the multiple chips.
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Accused Products
Abstract
A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.
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Citations
18 Claims
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1. A method comprising:
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depositing, in physical contact with at least a portion of multiple chips, a temperature-conductive liquidus or gel material on a rigid body; hardening the temperature-conductive liquidus or gel material to constrain at least a portion of each of the multiple chips such that the hardened material and the multiple chips behave as part of the rigid body; bringing a bonding surface of each of the multiple chips into contact with a bonding surface of an element, by uniformly applying a force on the rigid body to place the multiple chips under pressure without causing damage to the multiple chips or the bonding surface of the element; and removing all of the hardened material from contact with the multiple chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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depositing, in physical contact with at least a portion of plurality of chips, a temperature-conductive liquidus or gel material on a rigid body; hardening the temperature-conductive liquidus or gel material to constrain at least a portion of each of the plurality of chips such that the hardened material and the plurality of chips behave as a part of the rigid body; uniformly applying a force to the rigid body to cause the hardened material to transfer the force from the rigid body to the plurality of chips to thereby bond bonding surfaces of the plurality of chips to a bonding surface of an element; and removing all of the hardened material from contact with the plurality of chips. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification