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Tooling for coupling multiple electronic chips

  • US 10,340,239 B2
  • Filed: 07/31/2017
  • Issued: 07/02/2019
  • Est. Priority Date: 06/14/2005
  • Status: Active Grant
First Claim
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1. A method comprising:

  • depositing, in physical contact with at least a portion of multiple chips, a temperature-conductive liquidus or gel material on a rigid body;

    hardening the temperature-conductive liquidus or gel material to constrain at least a portion of each of the multiple chips such that the hardened material and the multiple chips behave as part of the rigid body;

    bringing a bonding surface of each of the multiple chips into contact with a bonding surface of an element, by uniformly applying a force on the rigid body to place the multiple chips under pressure without causing damage to the multiple chips or the bonding surface of the element; and

    removing all of the hardened material from contact with the multiple chips.

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