OLED panel fabrication method and OLED panel
First Claim
1. An organic light emitting display (OLED) panel fabrication method, comprising the following steps:
- Step S1;
providing a substrate, forming an OLED device on the substrate; and
arranging at least two circumferential loops of barrier walls, which are spaced from each other, on the substrate along an outer circumference of the OLED device, wherein an innermost loop of the barrier walls defines and delimits a light emission area on the substrate;
Step S2;
depositing a first inorganic blocking layer of an entire surface to completely cover the OLED device and entirety of the barrier walls;
Step S3;
coating and forming an organic buffer layer on a portion of the first inorganic blocking layer that corresponds to the light emission area and coating and forming a densification layer on a portion of the first inorganic blocking layer that corresponds to an area between every two adjacent ones of the barrier walls; and
Step S4;
depositing a second inorganic blocking layer of an entire surface to completely cover the organic buffer layer, entirety of the densification layer, and the entirety of the barrier walls;
wherein the at least two circumferential loops of barrier walls comprise three circumferential loops including the innermost loop, an intermediate loop, and an outermost loop, and the densification layer comprises a first densification layer formed between the barrier walls of the innermost and the intermediate loop and a second densification layer formed between the barrier walls of the intermediate loop and the outermost loop, wherein the first and second densification layers are both formed on the first inorganic blocking layer and are both covered by the second inorganic blocking layer, such that the first and second densification layers are interposed between the first and second inorganic layers and separate from each other.
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Abstract
The present invention provides an OLED panel fabrication method and an OLED panel. The OLED panel fabrication method of the present invention is such that at least two loops of spaced barrier walls are provided on an outer circumference of the OLED device and inkjet printing is applied to form, in sequence, an organic buffer layer between a first inorganic blocking layer and a second inorganic blocking layer at a location above a light emission area defined and delimited by the barrier walls and a loop of densification layer between the first inorganic blocking layer and the second inorganic blocking layer at a location above an area between two adjacent ones of the barrier walls so as to form a complicated path that retards invasion of water vapor and oxygen in a lateral side encapsulation structure to improve a lateral side film encapsulation effect thereby providing a film encapsulation structure having an increased gas blocking capability to effectively protect the OLED device, increase the life span of the OLED device, and suit the need of encapsulation of a flexible OLED panel. In addition, the fabrication method is easy to carry out.
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Citations
15 Claims
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1. An organic light emitting display (OLED) panel fabrication method, comprising the following steps:
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Step S1;
providing a substrate, forming an OLED device on the substrate; and
arranging at least two circumferential loops of barrier walls, which are spaced from each other, on the substrate along an outer circumference of the OLED device, wherein an innermost loop of the barrier walls defines and delimits a light emission area on the substrate;Step S2;
depositing a first inorganic blocking layer of an entire surface to completely cover the OLED device and entirety of the barrier walls;Step S3;
coating and forming an organic buffer layer on a portion of the first inorganic blocking layer that corresponds to the light emission area and coating and forming a densification layer on a portion of the first inorganic blocking layer that corresponds to an area between every two adjacent ones of the barrier walls; andStep S4;
depositing a second inorganic blocking layer of an entire surface to completely cover the organic buffer layer, entirety of the densification layer, and the entirety of the barrier walls;wherein the at least two circumferential loops of barrier walls comprise three circumferential loops including the innermost loop, an intermediate loop, and an outermost loop, and the densification layer comprises a first densification layer formed between the barrier walls of the innermost and the intermediate loop and a second densification layer formed between the barrier walls of the intermediate loop and the outermost loop, wherein the first and second densification layers are both formed on the first inorganic blocking layer and are both covered by the second inorganic blocking layer, such that the first and second densification layers are interposed between the first and second inorganic layers and separate from each other. - View Dependent Claims (2, 3, 4, 5)
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6. An organic light emitting diode (OLED) panel, comprising:
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a substrate; an OLED device arranged on the substrate; at least two loops of barrier walls that are arranged on the substrate to be spaced from each other and located along an outer circumference of the OLED device, wherein an innermost loop of the barrier walls defines and delimits a light emission area on the substrate; a first inorganic blocking layer of an entire surface to completely cover the OLED device and entirety of the barrier walls; an organic buffer layer arranged on a portion of the first inorganic blocking layer that corresponds to the light emission area; a densification layer arranged between every two adjacent ones of the barrier walls; and a second inorganic blocking layer of an entire surface to completely cover the organic buffer layer, entirety of the densification layer, and the entirety of the barrier walls; wherein the at least two circumferential loops of barrier walls comprise three circumferential loops including the innermost loop, an intermediate loop, and an outermost loop, and the densification layer comprises a first densification layer formed between the barrier walls of the innermost and the intermediate loop and a second densification layer formed between the barrier walls of the intermediate loop and the outermost loop, wherein the first and second densification layers are both formed on the first inorganic blocking layer and are both covered by the second inorganic blocking layer, such that the first and second densification layers are interposed between the first and second inorganic layers and separate from each other. - View Dependent Claims (7, 8, 9, 10)
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11. An organic light emitting display (OLED) panel fabrication method, comprising the following steps:
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Step S1 ;
providing a substrate, forming an OLED device on the substrate; andarranging at least two circumferential loops of barrier walls, which are spaced from each other, on the substrate along an outer circumference of the OLED device, wherein an innermost loop of the barrier walls defines and delimits a light emission area on the substrate; Step S2 ;
depositing a first inorganic blocking layer of an entire surface to completely cover the OLED device and entirety of the barrier walls;Step S3 ;
coating and forming an organic buffer layer on a portion of the first inorganic blocking layer that corresponds to the light emission area and coating and forming a densification layer on a portion of the first inorganic blocking layer that corresponds to an area between every two adjacent ones of the barrier walls; andStep S4;
depositing a second inorganic blocking layer of an entire surface to completely cover the organic buffer layer, entirety of the densification layer, and the entirety of the barrier walls;wherein the densification layer has a height equal to or less than a height of the barrier walls; and wherein the at least two circumferential loops of barrier walls comprise three circumferential loops including the innermost loop, an intermediate loop, and an outermost loop, and the densification layer comprises a first densification layer formed between the barrier walls of the innermost and the intermediate loop and a second densification layer formed between the barrier walls of the intermediate loop and the outermost loop, wherein the first and second densification layers are both formed on the first inorganic blocking layer and are both covered by the second inorganic blocking layer, such that the first and second densification layers are interposed between the first and second inorganic layers and separate from each other. - View Dependent Claims (12, 13, 14, 15)
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Specification