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Anti-microbial balanced weave wearable undergarment and process therefore

  • US 10,342,714 B2
  • Filed: 03/02/2018
  • Issued: 07/09/2019
  • Est. Priority Date: 03/02/2016
  • Status: Active Grant
First Claim
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1. A wearable weave that comprises:

  • at least one outer section;

    a midsection attached to the at least one outer section, such that the midsection comprises;

    a first antimicrobial layer configured to contact a wearer'"'"'s body, such that the first antimicrobial layer comprises a center sublayer between two outer sublayers, such the center sublayer comprises;

    a first balance plain weave pattern, such that a plurality of first warp tows in the first antimicrobial layer each respectively comprise a first 1 to 3 filaments and each filament in the first 1 to 3 filaments respectively comprises a first copper that comprises at least one of;

    first Cu+ ions, first Cu+++ ions, or combinations thereof; and

    a plurality of first fill tows, such that each fill tow in the plurality of first fill tows respectively comprises a first nanomaterial that consists of a second copper that comprises material that comprises the first fill tows and at least one of;

    second Cu+ ions, second Cu+++ ions, or combinations thereof; and

    a second antimicrobial layer disposed adjacent to the first antimicrobial layer; and

    an air gap disposed between the first and second antimicrobial layers, such that the second antimicrobial layer comprises;

    a second balance plain weave pattern, such that each second warp tow in a plurality of second warp tows respectively comprises a second 1 to 3 filaments such that each filament in the second 1 to 3 elements respectively comprises a third copper that comprises at least one of third Cu+ ions, third Cu+++ ions, or combinations thereof; and

    a plurality of second fill tows such that each second fill tow in the plurality of second fill tows respectively comprises a second nanomaterial that comprises a fourth copper that comprises at least one of fourth Cu+ ions or fourth Cu+++ ions; and

    a gap disposed between the first and the second antimicrobial layers, such that the gap consists of air.

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